A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

2020 ◽  
Author(s):  
SeungNam Son ◽  
DongHyun Khim ◽  
SeokHun Yun ◽  
JunHwan Park ◽  
EunTaek Jeong ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Level ◽  
Bonding Technology ◽  
Wafer Level Package

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Evolution of Wafer Bonding Technology and Applications from Wafer-Level Packaging to Micro/Nanofluidics-Enhanced Sensing

2021 ◽  
pp. 187-215
Author(s):  
Jikai Xu ◽  
Zhihao Ren ◽  
Bowei Dong ◽  
Chenxi Wang ◽  
Yanhong Tian ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Bonding Technology
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