scholarly journals Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications

2018 ◽  
Author(s):  
Asisa Kumar Panigrahi ◽  
C. Hemanth Kumar ◽  
Satish Bonam ◽  
Paul K. Brince ◽  
Tamal Ghosh ◽  
...  
Keyword(s):  
Surface Passivation ◽  
Metal Alloy ◽  
Heterogeneous Integration ◽  
High Quality ◽  
3D Ic ◽  
Fine Pitch ◽  
Cu Bonding

Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

2014 ◽  
Author(s):  
Ling Xie ◽  
Sunil Wickramanayaka ◽  
Boo Yung Jung ◽  
Jerry Aw Jie Li ◽  
Lim Jung-kai ◽  
...  
Keyword(s):  
High Density ◽  
Wafer Level ◽  
3D Ic ◽  
Fine Pitch ◽  
Cu Bonding

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

2011 ◽  
Vol 17 (1) ◽  
pp. 105-109 ◽  
Author(s):  
Eun-Jung Jang ◽  
Jae-Won Kim ◽  
Bioh Kim ◽  
Thorsten Matthias ◽  
Young-Bae Park
Keyword(s):  
Temperature Effect ◽  
Annealing Temperature ◽  
Bonding Energy ◽  
3D Ic ◽  
Cu Bonding

scholarly journals High quality crystalline silicon surface passivation by combined intrinsic and n-type hydrogenated amorphous silicon

2011 ◽  
Vol 99 (20) ◽  
pp. 203503 ◽  
Author(s):  
Jan-Willem A. Schüttauf ◽  
Karine H. M. van der Werf ◽  
Inge M. Kielen ◽  
Wilfried G. J. H. M. van Sark ◽  
Jatindra K. Rath ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Silicon Surface ◽  
Surface Passivation ◽  
Crystalline Silicon ◽  
Hydrogenated Amorphous Silicon ◽  
High Quality ◽  
Hydrogenated Amorphous ◽  
Silicon Surface Passivation
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