Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

2020 ◽  
Author(s):  
Rahul Mathur ◽  
Chien-Ju Chao ◽  
Rossana Liu ◽  
Nikhil Tadepalli ◽  
Pranavi Chandupatla ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Wafer Bonding ◽  
High Performance ◽  
Face To Face ◽  
Bonding Technology

Thermal analysis of high-performance mortar containing burnt clay shale as a partial portland cement replacement in the temperature range up to 1000 °C

2016 ◽  
Vol 41 (1) ◽  
pp. 54-64 ◽  
Author(s):  
Anton Trník ◽  
Lenka Scheinherrová ◽  
Tereza Kulovaná ◽  
Pavel Reiterman ◽  
Eva Vejmelková ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Portland Cement ◽  
High Performance ◽  
Clay Shale ◽  
Cement Replacement ◽  
Temperature Range ◽  
Burnt Clay

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

2016 ◽  
Vol 75 (9) ◽  
pp. 345-353 ◽  
Author(s):  
F. Kurz ◽  
T. Plach ◽  
J. Suss ◽  
T. Wagenleitner ◽  
D. Zinner ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Precision ◽  
Wafer Bonding ◽  
Wafer Level ◽  
3D Ics ◽  
Direct Wafer Bonding ◽  
Bonding Technology

Molecular Simulation on Interfacial Structure and Gettering Efficiency of Si (110)/(100) Directly Bonded Hybrid Crystal Orientation Substrates

2009 ◽  
Vol 156-158 ◽  
pp. 199-204
Author(s):  
Hiroaki Kariyazaki ◽  
Tatsuhiko Aoki ◽  
Kouji Izunome ◽  
Koji Sueoka
Keyword(s):  
Molecular Simulation ◽  
Wafer Bonding ◽  
Crystal Orientation ◽  
High Performance ◽  
Cmos Technology ◽  
Experimental Results ◽  
Interfacial Structure ◽  
Atomic Configuration ◽  
Promising Technology ◽  
Bonded Interface

Hybrid crystal orientation technology (HOT) substrates comprised of Si (100) and (110) surface orientation paralleling each <110> direction attract considerable attentions as one of the promising technology for high performance bulk CMOS technology. Although HOT substrates are fabricated by wafer bonding of Si (110) and Si (100) surfaces, it is not clear the atomic configuration of interfacial structure. Furthermore, the possibility for the interface to be an effective gettering source of impurity metals was not well studied. In this paper, we studied the interfacial structure and gettering efficiency of the atomic bonded interface by molecular simulations. The results indicate that the simulated atomic configuration and gettering efficiency of the bonded interface agreed well with the experimental results.

High performance InAs quantum dot lasers on silicon substrates by low temperature Pd-GaAs wafer bonding

2015 ◽  
Vol 107 (26) ◽  
pp. 261107 ◽  
Author(s):  
Zihao Wang ◽  
Ruizhe Yao ◽  
Stefan F. Preble ◽  
Chi-Sen Lee ◽  
Luke F. Lester ◽  
...  
Keyword(s):  
Low Temperature ◽  
Quantum Dot ◽  
Wafer Bonding ◽  
High Performance ◽  
Silicon Substrates ◽  
Quantum Dot Lasers ◽  
Gaas Wafer ◽  
Inas Quantum Dot

Smart‐Cut® : The Basic Fabrication Process for Unibond® Soi Wafers

1996 ◽  
Vol 446 ◽  
Author(s):  
A.J. Auberton‐Hervé ◽  
T. Barge ◽  
F. Metral ◽  
M. Bruel ◽  
B. Aspar ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Low Cost ◽  
Bulk Silicon ◽  
High Quality ◽  
Thin Film Thickness ◽  
Hydrogen Implantation ◽  
Electric Behavior ◽  
Bonding Technology ◽  
Good Uniformity ◽  
Quality Surface

AbstractThe advantage of SOI wafers for device manufacture has been widely studied. To be a real challenger to bulk silicon, SOI producers have to offer SOI wafers in large volume and at low cost. The new Smart‐Cut® SOI process used for the manufacture of the Unibond® SOI wafers answers most of the SOI wafer manufacturability issues. The use of Hydrogen implantation and wafer bonding technology is the best combination to get good uniformity and high quality for both the SOI and buried oxide layer. In this paper, the Smart‐Cut® process is described in detail and material characteristics of Unibond® wafers such as crystalline quality, surface roughness, thin film thickness homogeneity, and electric behavior.

Varifocal mirror integrated with scanner using wafer bonding technology

2016 ◽  
Author(s):  
Kenta Nakazawa ◽  
Takashi Sasaki ◽  
Hiromasa Furuta ◽  
Jiro Kamiya ◽  
Hideki Sasaki ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Bonding Technology
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