Numerical analysis of thermal effects in SOI MOSFET Flip-Chip packages: Multi-scale studies on isolated transistors and global simulations

2016 ◽  
Author(s):  
Giacomo Garegnani ◽  
Vincent Fiori ◽  
Sebastien Gallois-Garreignot ◽  
Roberto Gonella
Keyword(s):  
Numerical Analysis ◽  
Thermal Effects ◽  
Flip Chip ◽  
Soi Mosfet ◽  
Multi Scale

Multi-scale numerical analysis of the eccentricity on the instability of RCFST long columns

2021 ◽  
Vol 167 ◽  
pp. 108228
Author(s):  
Chao Guo ◽  
Zhengran Lu ◽  
Guochang Li
Keyword(s):  
Numerical Analysis ◽  
Multi Scale

Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

2005 ◽  
Vol 127 (1) ◽  
pp. 47-51 ◽  
Author(s):  
Man-Lung Sham ◽  
Jang-Kyo Kim
Keyword(s):  
Numerical Analysis ◽  
Residual Stresses ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Flexural Modulus ◽  
Curing Temperature ◽  
Electronic Packages ◽  
Element Analysis ◽  
Plastic Package

Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which many reliability issues arise, including warpage of the package, premature interfacial failure, and degraded interconnections. Bimaterial strip bending experiment has been employed successfully to monitor the evolution of the residual stresses in underfrill resins for flip chip applications. A numerical analysis is developed to predict the residual stresses, which agree well with the experimental measurements. The changes of material properties, such as flexural modulus and coefficient of thermal expansion, of the resins with temperature are taken into account in the finite element analysis.

scholarly journals Lossless WDM PON Photonic Integrated Receivers Including SOAs

2019 ◽  
Vol 9 (12) ◽  
pp. 2457 ◽  
Author(s):  
Goki ◽  
Imran ◽  
Porzi ◽  
Toccafondo ◽  
Fresi ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Wavelength Division Multiplexing ◽  
Flip Chip ◽  
Optical Network ◽  
Silicon On Insulator ◽  
Passive Optical Network ◽  
Case Scenario ◽  
Worst Case ◽  
The Impact ◽  
Wdm Transmission

The role of a semiconductor optical amplifier (SOA) for amplifying downstream traffic at optical network terminals (ONT) within a silicon-photonics integrated receiver in a high capacity passive optical network (PON) is investigated. The nearly traveling wave SOA effects are evaluated by considering fabrication and link loss constraints through numerical analysis and experimental validation. The impact of hybrid integration of a SOA chip on a silicon on insulator (SOI) photonic chip using the flip chip bonding technique on SOA design is evaluated through numerical analysis of a multi section cavity model. The performance of the proposed ONT receiver design employing twin parallel SOAs is evaluated experimentally on a 32 × 25 Gb/s OOK WDM transmission system considering cross gain modulation (XGM) and amplified spontaneous emission (ASE) constraints. The XGM impact is evaluated through 32 channel wavelength division multiplexing (WDM) transmission and a likely PON worst case scenario of high channel power difference (~10 dB) between adjacent channels. The impact of ASE is evaluated through the worst-case polarization condition, i.e., when all of the signal is coupled to only one. Successful transmission was achieved in both worst-case conditions with limited impact on performance. SOA results indicate that a maximum residual facet reflectivity of 4 × 10−4 for the chip-bonded device can lead to a power penalty below 2 dB in a polarization-diversity twin SOAs receiver.

scholarly journals Numerical analysis of the thermomechanical behaviour of an integrally water-heated tool for composite manufacturing

2016 ◽  
Vol 36 (4) ◽  
pp. 241-253
Author(s):  
Rzgar Abdalrahman ◽  
Stephen Grove ◽  
Adam Kyte ◽  
Md Jahir Rizvi
Keyword(s):  
Numerical Analysis ◽  
Thermal Effects ◽  
Tool Material ◽  
Temperature Cycling ◽  
Transient Heating ◽  
Element Analysis ◽  
Heating And Cooling ◽  
Thermomechanical Behaviour ◽  
And Performance ◽  
Out Of Autoclave

Integrally water-heated tooling is one of the technologies available for ‘out-of-autoclave’ processing of advanced thermoset polymer composites. Temperature variation and temperature cycling, during heating and cooling, affect the properties of tool material and may produce undesirable thermal effects that degrade the tool durability and performance, especially when the tool construction involves various materials. Hence, in the current study, the performance and the thermomechanical behaviour of an integrally water-heated tool have been investigated using finite element analysis method. The intended tool, in the current study, consists different materials of composite and metals and is designed to heat up to 90℃. Linear mechanical properties, coefficient of thermal expansions and transient heating curve of each tool part are determined experimentally and set during the numerical analysis of tool structure to calculate the static thermal load effects of deformation, stress and strain. Comparing the numerical thermal effects with the ultimate stresses and strains of the tool, materials concluded that no failure occurs with regard to static thermal loads. However, the calculated stresses are as much as the lowest magnitude of safety relates to the tool mould part made of Alepoxy.

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