scholarly journals Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2335
Author(s):  
Jialong Qiu ◽  
Yanzhi Peng ◽  
Peng Gao ◽  
Caiju Li
Keyword(s):  
Tensile Strength ◽  
Solder Alloy ◽  
Tensile Tests ◽  
Melting Behavior ◽  
Second Phase ◽  
Solder Alloys ◽  
Cu Content ◽  
Diffusion Force ◽  
Fine Microstructure ◽  
Effect Of Copper

The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

Effect of Plastic Deformation on the Mechanical Properties and Microstructure of Homogenized AZ80 Magnesium Alloy

2010 ◽  
Vol 139-141 ◽  
pp. 180-184
Author(s):  
Yong Xue ◽  
Zhi Min Zhang ◽  
Li Hui Lang
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Grain Boundaries ◽  
Gradual Increase ◽  
Tensile Tests ◽  
Extrusion Ratio ◽  
Extrusion Temperature ◽  
Second Phase ◽  
Strength And Plasticity ◽  
Az80 Alloy

In the present research, the influences of different extrusion ratios (15, 30, 45, 60, and 75) and extrusion temperatures (300°C, 330°C, 360°C, 390°C, 420°C) on the mechanical properties and microstructure of homogenized AZ80 alloy have been investigated through the tensile tests and via metallographic microscope observation. The results show that the alloy’s grain is small and small amounts of black hard and brittle second-phase β (Mg17Al12) are precipitated uniformly along the grain boundary causing the gradual increase of the alloy’s tensile strength at 330°C. When the extrusion temperature is up to 390°C, the grain size increases significantly, but the second phase precipitation along grain boundaries transforms into continuous and uniform-distribution precipitation within the grain. In this case, when the extrusion ratio is 60, the alloy’s tensile strength reaches its peak 390Mpa. As the extrusion temperature increases, inhomogeneous precipitation of the second-phase along grain boundaries increases, causing the decrease of the alloy’s strength. At the same temperature, the tensile strength increases firstly and then decreases as extrusion ratio increases. With the gradual increase of the refinement grain, the dispersed precipitates increase and the alloy’s tensile strength and plasticity reach their peaks when the extrusion temperature is 390°C. As the grain grows, the second phase becomes inhomogeneous distribution, and the alloy’s strength and plasticity gradually decrease.

scholarly journals Evolution of the Second-Phase Particles and Their Effect on Tensile Fracture Behavior of 2219 Al-xCu Alloys

Metals ◽  
2020 ◽  
Vol 10 (2) ◽  
pp. 197
Author(s):  
Daofen Xu ◽  
Kanghua Chen ◽  
Yunqiang Chen ◽  
Songyi Chen
Keyword(s):  
Fracture Behavior ◽  
Solution Treatment ◽  
Aging Treatment ◽  
Fracture Initiation ◽  
Tensile Tests ◽  
Tensile Fracture ◽  
Second Phase ◽  
Cu Content ◽  
Second Phase Particles ◽  
Microcrack Propagation

In this study, the continuous evolution of the second-phase particles across as-cast, homogenization, multi-directional forging (MDF), and solution-aging treatment and their effect on tensile fracture behavior of 2219 aluminum alloys with different Cu contents was examined by optical microscopy (OM), scanning electron microscopy (SEM), and tensile tests. The results showed that the microstructure of as-cast 2219 aluminum alloy consisted of the α-Al matrix, Al2Cu coarse phase, and Fe-rich impurity phase. Severe segregation of Cu existed, and eutectic networks can be observed in the ingot. With an increase in Cu content, the eutectic networks became coarsen and thicker. During the complex improved process, the refinement mechanisms were fragmentation, dissolution, and diffusion of Al2Cu particles. Most fine Al2Cu particles were fully dissolved into the matrix and partial coarse particles were still retained after solution-aging treatment. Thus, the elongations of all the samples, undergoing solution treatment followed by water quenching, increased evidently. Then, the elongations decreased slightly due to the increase of precipitates. The fractography analysis of peak aged condition samples indicated that the fracture mode was diverted from a typical inter-granular fracture to a mainly trans-granular fracture with increase in Cu content from 5.56% to 6.52%. Fracture initiation mainly occurred by original microcrack propagation and microvoid nucleation at the coarse constituents.

Effects of Cu on the Microstructures and Tensile Properties of Thixoformed Al-Si Alloys

2014 ◽  
Vol 217-218 ◽  
pp. 91-98
Author(s):  
Mohd Shukor Salleh ◽  
Mohd Zaidi Omar ◽  
Junaidi Syarif ◽  
K.S. Alhawari ◽  
M.N. Mohammed
Keyword(s):  
Tensile Strength ◽  
Tensile Properties ◽  
Copper Content ◽  
Liquid Fraction ◽  
Tensile Tests ◽  
Scanning Calorimetry ◽  
Cu Content ◽  
Semi Solid ◽  
Cooling Slope Casting ◽  
Solid Liquid

In this study, the effects of copper content on the microstructures and tensile properties of thixoformed Al-5Si-xCu-0.5Fe (x =1.0, 2.0 and 3.0 wt. %) were investigated. For this study, three different alloys having various amounts of copper were prepared using cooling slope casting before thixoforming. The semi-solid liquid range for the alloys were estimated using the diffrential scanning calorimetry (DSC) analysis. The samples were thixoformed at 40% liquid fraction. Some of these samples were treated with a T6 aging process. The thixoformed and thixoformed T6 samples were then characterized by optical microscopy, scanning electron microscope (SEM) and energy dispersive X-ray (EDX) as well as tensile tests. The different phases formed in the thixoformed and thixoformed T6 samples were throughly investigated.The results indicate that as copper content increases, the tensile strength also increases, which might due to precipitation hardening. The thixoformed T6 alloys attained an ultimate tensile strength (UTS) as high as 303 MPa when Cu content is 3 wt%.

Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy

2016 ◽  
Vol 675-676 ◽  
pp. 513-516 ◽  
Author(s):  
Phairote Sungkhaphaitoon ◽  
Thawatchai Plookphol
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Ultimate Tensile Strength ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Solder Alloys ◽  
Cooling Systems ◽  
Cooling Rates ◽  
Microstructure And Mechanical Properties ◽  
Two Phases

The dependence of microstructure and mechanical properties of Sn-0.7wt.%Cu solder alloys on different cooling rates were investigated. Two cooling rates were employed during solidification: 0.04 °C/s (mold-cooled system) and 1.66 °C/s (water-cooled system). The results showed that the ultimate tensile strength of Sn-0.7wt.%Cu solder alloy increased but the elongation decreased when water-cooled system was used. The microstructure of Sn-0.7wt.%Cu solder alloys solidified by both cooling systems exhibited two phases of Sn-rich and Cu6Sn5 intermetallic compounds (IMCs). However, finer grains were observed in the water-cooled specimens.

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

2018 ◽  
Vol 18 (1) ◽  
pp. 49-57 ◽  
Author(s):  
P. Manoj Kumar ◽  
G. Gergely ◽  
D. K. Horváth ◽  
Z. Gácsi
Keyword(s):  
Mechanical Properties ◽  
Hardness Test ◽  
Tensile Tests ◽  
Optical Microscope ◽  
Solder Alloys ◽  
Extensive Discussion ◽  
Microstructural Investigation ◽  
Pure Lead ◽  
Cu Content ◽  
Sac Solder

Abstract The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.

Microstructure and Properties of Nb Nanoparticles Reinforced Sn-0.7Cu Solder Alloy

2021 ◽  
Author(s):  
Zheng Liu ◽  
Yang Li ◽  
Yifeng Xiong ◽  
Huiming Gao
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Thermal Properties ◽  
Ultimate Tensile Strength ◽  
Melting Temperature ◽  
Solder Alloy ◽  
Fracture Mechanism ◽  
Composite Solder ◽  
Solder Alloys ◽  
Microstructure And Properties

Abstract The effect of trace Nb nanoparticles on thermal properties, wettability, microstructure and mechanical properties of Sn-0.7Cu solder alloy was investigated. The results show that the melting temperature of Sn-0.7Cu composite solder alloy is between 229 ? and 231 ?, and the effect of Nb nanoparticles on the melting temperature is not obvious. The wettability of the solder alloy was remarkably improved by adding Nb nanoparticles. The coarse ß-Sn phase and ß-Sn/Cu6Sn5 eutectic in the Sn-0.7Cu composite solder alloys is refined by adding appropriate Nb nanoparticles, and then the ultimate tensile strength (37.3 MPa) and the elongation (2.47 mm) of Sn-0.7Cu alloy are increased to the maximum 45.4 MPa and 4.59 mm of Sn-0.7Cu-0.12Nb alloy. The fracture mechanism of Sn-0.7Cu-xNb composite solder alloys are plastic fracture.

Effect of Micron Size Ni Particle Addition on Microstructure, Thermal and Mechanical Properties of Sn-9Zn Lead-Free Solder Alloy

2012 ◽  
Vol 229-231 ◽  
pp. 271-275
Author(s):  
M. Muktadir Billah ◽  
Kazi Mohammad Shorowordi
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Structural Changes ◽  
Melting Behavior ◽  
Solder Alloys ◽  
Microstructural Investigation ◽  
Weight Percentage ◽  
Micron Size ◽  
Free Solder ◽  
Particle Addition

This study had been carried out to investigate the effect of micron size Ni particle addition on the microstructure, melting behavior and mechanical properties of the ternary Sn-9Zn solder alloys. Different weight percentage, viz. 0.25, 0.5 and 1 of micron size Ni particle was added in the liquid Sn-9Zn alloy and then cast into the metal mold. Melting behavior was studied by Differential Thermal Analyzer (DTA). Microstructural investigation was conducted using Optical and Scanning Electron Microscope (SEM). Tensile properties were determined at a strain rate 3.00 mm.min-1. The results indicated that Ni addition increased both the melting point and solidification range of the Sn-9Zn solder alloy. The microstructures of newly developed ternary Sn-9Zn-xNi solder alloys consisted of fine needle-like α-Zn phase dispersed in the β-Sn matrix. It was found that small amount of Ni (0.25 wt. %) addition refined and dispersed the Zn needles throughout the matrix. Besides, enhanced precipitation of Zn in the β-Sn matrix was also observed. All these structural changes increased the hardness and tensile strength of Sn-9Zn alloy with the addition of Ni particle to a certain amount.

scholarly journals AA2219 Aluminum Alloy Processed via Multi-Axial Forging in Cryogenic and Ambient Environments

2019 ◽  
Vol 8 (2) ◽  
pp. 1 ◽  
Author(s):  
Amin Azimi ◽  
Gbadebo Moses Owolabi ◽  
Hamid Fallahdoost ◽  
Nikhil Kumar ◽  
Horace Whitworth ◽  
...  
Keyword(s):  
Tensile Strength ◽  
Room Temperature ◽  
Tensile Tests ◽  
Second Phase ◽  
X Ray Diffraction ◽  
Transmission Electron Microscopy Micrographs ◽  
Transmission Electron ◽  
Second Phase Particles ◽  
Aa2219 Aluminum Alloy ◽  
Cryogenic Processing

This paper presents the microstructure and the mechanical behavior of nanocrystalline AA2219 processed by multi axial forging (MAF) at ambient and cryogenic temperatures. The X-ray diffraction pattern and transmission electron microscopy micrographs in the initial microstructure characterization indicate a more effective severe plastic deformation during the cryogenic MAF than the same process conducted at room temperature. MAF at cryogenic temperature results in crystallite size reduction to nanoscales as well as second phase particles breakage to finer particles which are the crucial factors to increasing the mechanical properties of the material. Fractography analysis and tensile tests results show that cryogenic forging does not only increase the mechanical strength and toughness of the alloys significantly, but also improves the ductility of the material in comparison with the conventional forging. In this comparative regard, cryogenic processing provides 44% increase in the tensile strength of the material only after 2 forging cycles when compared to the room temperature process. In addition, further forging process to the next cycles slightly enhances the tensile strength at the expense of ductility due to less ability of the dislocations to accumulate. However, the ductility of the ambient temperature forged samples decreases at a faster rate than that of cryoforged samples.

Effect of Copper on Tensile Strength Improvement of Al-Cu-SiCP New Composite

2013 ◽  
Vol 773-774 ◽  
pp. 541-546
Author(s):  
Md Abdul Maleque ◽  
A. Arifutzzaman
Keyword(s):  
Tensile Strength ◽  
Fracture Surface ◽  
Tensile Test ◽  
Stir Casting ◽  
Test Machine ◽  
Automotive Engine ◽  
Cu Content ◽  
The Matrix ◽  
Sem Micrograph ◽  
Effect Of Copper

The composite materials with 2, 4 and 6 % Cu were developed using a noble stir casting method. Tensile test was conducted using universal tensile test machine according to ASTM-2002 (E8M-01) standard and the fracture surface was analysed using scanning electron microscope (SEM). The result showed that the ultimate tensile strength (UTS) was increased due to the percentage increment of Cu in the Al-Cu matrix. A significant change in UTS was observed from 2 to 4 % Cu whereas slight improvement was seen from 4 to 6 % Cu addition. The SEM micrograph of the fracture surface reveals that the cracks were propagated in the fibrous zone resulting from the initiation of micro voids between the matrix and particle interfaces. The number and size of dimples for 2% Cu were considerably lower and the facet features were noticeably higher than higher Cu content composition, whereas, the dimple and facet size and number for the 4% Cu are very close to the 6% Cu content composite which may play important role in the improvement of tensile strength. These findings tinted for the potential application of SiCp reinforced Cu influenced Al-Cu-SiCp composite for automotive engine components and other similar applications as well.

scholarly journals Effect of Nano-Y2O3 Addition on Microstructure and Tensile Properties of High-Nb TiAl Alloy Prepared by Spark Plasma Sintering

Metals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1048
Author(s):  
Yingchao Guo ◽  
Yongfeng Liang ◽  
Junpin Lin ◽  
Fei Yang
Keyword(s):  
Tensile Strength ◽  
Spark Plasma Sintering ◽  
Tial Alloy ◽  
Second Phase ◽  
Fine Grain ◽  
Fine Grain Strengthening ◽  
Plasma Sintering ◽  
Spark Plasma ◽  
Y2o3 Addition ◽  
Powder Metallurgy Route

Nano-Y2O3 reinforced Ti-47.7Al-7.1Nb-(V, Cr) alloy was fabricated by a powder metallurgy route using spark plasma sintering (SPS), and the influence of nano-Y2O3 contents on the microstructure and mechanical properties were investigated systematically. The results revealed that the ultimate tensile strength and elongation of the alloy were 570 ± 28 MPa and 1.7 ± 0.6% at 800 °C, 460 ± 23 MPa and 6.1 ± 0.4% at 900 °C with no nano-Y2O3, 662 ± 24 MPa and 5.5 ± 0.5% at 800 °C, and 466 ± 25 MPa and 16.5 ± 0.8% at 900 °C with 0.05 at% nano-Y2O3 addition, respectively. Due to the fine-grain strengthening and the second-phase strengthening, both tensile strength and elongation of the high-Nb TiAl alloy were enhanced with the addition of nano-Y2O3.

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