Novel low dielectric loss polyimide film: synthesis and high frequency electrical properties

2018 ◽  
Author(s):  
Huang Xuwei ◽  
Shu Xiang ◽  
Liu Tao ◽  
Wang Jian ◽  
Li Qingmin ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Dielectric Loss ◽  
High Frequency ◽  
Polyimide Film ◽  
Low Dielectric ◽  
Film Synthesis

Photosensitive Polyimide having low loss tangent for RF application

2018 ◽  
Vol 2018 (1) ◽  
pp. 000476-000482 ◽  
Author(s):  
Masao Tomikawa ◽  
Hitoshi Araki ◽  
Yohei Kiuchi ◽  
Akira Shimada
Keyword(s):  
Molecular Structure ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Frequency ◽  
Low Dielectric Constant ◽  
Low Loss ◽  
Elongation At Break ◽  
Low Dielectric ◽  
The Poor

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.

scholarly journals MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Polymers ◽  
2020 ◽  
Vol 12 (9) ◽  
pp. 1875
Author(s):  
Jianming Guo ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Dielectric Loss ◽  
High Frequency ◽  
Composite Laminates ◽  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
Weight Ratio ◽  
Resin Matrix ◽  
Ceramic Powders ◽  
Low Dielectric ◽  
Low Dissipation

Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, Li2TiO3 (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.

HIGH-FREQUENCY DIELECTRIC BEHAVIOR OF INDIUM AND CHROMIUM SUBSTITUTED Mg–Mn FERRITES

2010 ◽  
Vol 24 (15) ◽  
pp. 1657-1667 ◽  
Author(s):  
A. LAKSHMAN ◽  
P. S. V. SUBBA RAO ◽  
K. H. RAO
Keyword(s):  
Dielectric Constant ◽  
Dielectric Loss ◽  
High Frequency ◽  
Loss Factor ◽  
Space Charge Polarization ◽  
Dielectric Behavior ◽  
Dielectric Loss Factor ◽  
Dc Resistivity ◽  
Low Dielectric ◽  
Tan Δ

Dielectric properties such as DC resistivity (ρ), dielectric constant (ε) and dielectric loss factor ( tan δ) have been measured for Mg 0.9 Mn 0.1 In x Fe 2-x O 4 and Mg 0.9 Mn 0.1 Cr y Fe 2-y O 4 at room temperature. The composition dependence of ρ, ε and tan δ and the frequency dependence of ε and tan δ are presented in this paper. The resistivity increases while the dielectric constant decreases with increasing concentrations of indium and chromium ions. The dielectric loss factor at 100 kHz increases with composition for the samples 0.1 ≤ x ≤ 0.9 and 0.1 ≤ y ≤ 0.7. The dielectric constant for a given sample decreases with increasing frequency showing the normal dielectric behavior. The values of dielectric loss factor have been found to increase with frequency for the samples corresponding to x or y = 0.1 to 0.5; while other samples showed abnormal dielectric behavior. The observed variations in ρ are explained by Verwey's hopping mechanism while the variations in ε and tan δ with composition and frequency are explained by space charge polarization using Koop's theory. Higher values of DC resistivity and low dielectric losses suggest that the prepared materials have great potential for microwave and high-frequency applications.

An effective strategy for the preparation of intrinsic low-k and ultralow-loss dielectric polysiloxanes at high frequency by introducing trifluoromethyl groups into the polymers

2020 ◽  
Vol 11 (38) ◽  
pp. 6163-6170
Author(s):  
Fengping Liu ◽  
Xingrong Chen ◽  
Linxuan Fang ◽  
Jing Sun ◽  
Qiang Fang
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Frequency ◽  
Low Dielectric Constant ◽  
Effective Strategy ◽  
Low Dielectric ◽  
5 Ghz ◽  
Low K ◽  
Trifluoromethyl Groups

Two new CF3-containing polysiloxanes with low dielectric constant (Dk) and dielectric loss (Df ) at a high frequency of 5 GHz were reported. The sample with two −CF3 groups exhibits better dielectric properties with Dk of 2.53 and ultralow Df of 1.66 × 10−3.

Sign in / Sign up

Export Citation Format

Share Document