Study of Statistical Prevention Mechanism in Integrated Microelectronic Device Manufacturing

2018 ◽  
Author(s):  
Hong Chen ◽  
Shan Li ◽  
Qing Guo ◽  
Shuai Shao ◽  
JianJiang Shi
Keyword(s):  
Microelectronic Device

Micropatterning of Permalloy Films by Electron Lithography

1976 ◽  
Vol 34 ◽  
pp. 448-449
Author(s):  
J. K. Maurin
Keyword(s):  
Electron Beam ◽  
Subsequent Development ◽  
Electron Optical System ◽  
Microelectronic Device ◽  
Magnetic Bubble ◽  
Control Beam ◽  
Photosensitive Material ◽  
Direct Exposure ◽  
Electron Lithography ◽  
Scanning Electron

Conductor, resistor, and dielectric patterns of microelectronic device are usually defined by exposure of a photosensitive material through a mask onto the device with subsequent development of the photoresist and chemical removal of the undesired materials. Standard optical techniques are limited and electron lithography provides several important advantages, including the ability to expose features as small as 1,000 Å, and direct exposure on the wafer with no intermediate mask. This presentation is intended to report how electron lithography was used to define the permalloy patterns which are used to manipulate domains in magnetic bubble memory devices.The electron optical system used in our experiment as shown in Fig. 1 consisted of a high resolution scanning electron microscope, a computer, and a high precision motorized specimen stage. The computer is appropriately interfaced to address the electron beam, control beam exposure, and move the specimen stage.

Electron tomography of microelectronic device interconnects

2006 ◽  
Vol 97 (7) ◽  
pp. 880-884
Author(s):  
Qing Yang ◽  
John Mardinly ◽  
Christian Kübel ◽  
Chris Nelson ◽  
Christian Kisielowski
Keyword(s):  
Electron Tomography ◽  
Microelectronic Device

Root Cause Analyses of Metal Bridging for Copper Damascene Process

2005 ◽  
Author(s):  
Z. G. Song ◽  
S. P. Neo ◽  
S. K. Loh ◽  
C. K. Oh
Keyword(s):  
Failure Mechanisms ◽  
Copper Corrosion ◽  
Microelectronic Device ◽  
Root Cause ◽  
Damascene Process ◽  
New Process ◽  
Copper Cmp

Abstract New process will introduce new failure mechanisms during microelectronic device manufacturing. Even if the same defect, its root causes can be different for different processes. For aluminum(Al)-tungsten(W) metallization, the root cause of metal bridging is quite simple and mostly it is blocked etch or under-etch. But, for copper damascene process, the root causes of metal bridging are complicated. This paper has discussed the various root causes of metal bridging for copper damascene process, such as those related to litho-etch issue, copper CMP issue, copper corrosion issue and so on.

Applications of Focused Ion Beam Technology in Bonding Failure Analysis for Microelectronic Devices

2011 ◽  
Vol 58-60 ◽  
pp. 2171-2176 ◽  
Author(s):  
Yuan Chen ◽  
Xiao Wen Zhang
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Failure Mechanisms ◽  
Microelectronic Device ◽  
Mechanism Study ◽  
Basic Principles ◽  
The Past ◽  
Microelectronic Devices ◽  
Bonding Failure

Focused ion beam (FIB) system is a powerful microfabrication tool which uses electronic lenses to focus the ion beam even up to nanometer level. The FIB technology has become one of the most necessary failure analysis and failure mechanism study tools for microelectronic device in the past several years. Bonding failure is one of the most common failure mechanisms for microelectronic devices. But because of the invisibility of the bonding interface, it is difficult to analyze this kind of failure. The paper introduced the basic principles of FIB technology. And two cases for microelectronic devices bonding failure were analyzed successfully by FIB technology in this paper.

Vapor deposition of parylene-F using hydrogen as carrier gas

1999 ◽  
Vol 14 (1) ◽  
pp. 246-250 ◽  
Author(s):  
D. Mathur ◽  
G-R. Yang ◽  
T-M. Lu
Keyword(s):  
Thin Films ◽  
Vapor Deposition ◽  
Device Fabrication ◽  
New Method ◽  
Silicon Substrates ◽  
Microelectronic Device ◽  
Precursor Method ◽  
Liquid Precursor ◽  
Carrier Gas ◽  
Liquid Precursors

A new method for depositing parylene-F (PA-F) thin films on silicon substrates has been explored. Hydrogen has been used as a carrier gas along with liquid precursors, dibromotetrafluoro-p-xylene and 1,4-bis(trifluoromethyl)benzene, to deposit PA-F. The properties of this film have been compared with the films obtained by the Gorham dimer method and the liquid precursor method using FTIR, XPS, and XRD. The PA-F films deposited by the dimer or liquid precursor acquired some kind of microcrystallinity on annealing. However, the PA-F films deposited in the presence of hydrogen were amorphous on annealing. This property could be potentially exploited for application in microelectronic device fabrication.

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