The influence of phase inhomogeneity on the current density and temperature gradient in Cu/Sn58Bi/Cu solder joint

2019 ◽  
Author(s):  
Quan-Zhang Wen ◽  
Lei Guo ◽  
Hong-Bo Qin ◽  
Wang-Yun Li ◽  
Dao-Guo Yang
Keyword(s):  
Temperature Gradient ◽  
Solder Joint ◽  
Current Density ◽  
Phase Inhomogeneity

Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guang Chen ◽  
Yao-Feng Wu
Keyword(s):  
Temperature Gradient ◽  
Solder Joint ◽  
Internal Structure ◽  
Composite Solder ◽  
Solder Joints ◽  
Lead Free ◽  
Large Temperature ◽  
Composite Solder Joint ◽  
Content Type ◽  
And Migration

Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on microstructure and composition of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints under a large temperature gradient. Design/methodology/approach In this paper, SAC305 lead-free composite solder containing 0.05 Wt.% TiN was prepared by powder metallurgy method. A temperature gradient generator was designed and the corresponding samples were also prepared. The microstructural evolution, internal structure and elemental content of SAC305 and SAC305/TiN solder joints before and after thermal loading were comparatively studied. Findings The experimental results show that the addition of the TiN reinforcing phase can effectively inhibit the diffusion and migration of copper atoms and, therefore, affect the distribution of newly formed Cu-Sn IMC in solder joints under the condition of thermal migration (TM). Compared with the SAC305 solder joint, the interconnection interface and internal structure of the composite solder joint after 600 h of TM are also relatively complete. Originality/value The TiN reinforcing phase is proven effective to mitigate the TM behavior in solder joints under thermal stressing. Specifically, based on the observation and analysis results of microstructure and internal structure of composite solder joint, the TiN particle can change the temperature gradient distribution of the solder joint, so as to suppress the diffusion and migration of Sn and Cu atoms. In addition, the results of Micro-CT and compositional analysis also indicate that the addition of TiN reinforcement is very helpful to maintain the structural integrity and the compositional stability of the solder joint. Different from other ceramic reinforcements, TiN has good thermo- and electro-conductivity and the thermal-electrical performance of composite solder will not be significantly affected by this reinforcement, which is also the main advantage of selecting TiN as the reinforcing phase to prepare composite solder. This study can not only provide preliminary experimental support for the preparation of high reliability lead-free composite solder but also provide a theoretical basis for the subsequent study (such as electro-thermo distribution in solder joints), which has important application significance.

The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing

2019 ◽  
Vol 31 (4) ◽  
pp. 261-270
Author(s):  
Guang Chen ◽  
Jiqiang Li ◽  
Xinwen Kuang ◽  
Yaofeng Wu ◽  
Fengshun Wu
Keyword(s):  
Solder Joint ◽  
Current Density ◽  
Composite Solder ◽  
Solder Joints ◽  
Experimental Results ◽  
Lead Free ◽  
Cathode Side ◽  
High Current ◽  
Sac305 Solder ◽  
Content Type

Purpose The purpose of this paper is to investigate the effect of nickel-plated graphene (Ni-GNS) on the microstructure and mechanical properties of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder joints before and after an electro-migration (EM) experiment. Design/methodology/approach In this paper, SAC305 solder alloy doped with 0.1 Wt.% Ni-GNS was prepared via the powder metallurgy method. A U-shaped sample structure was also designed and prepared to conduct an EM experiment. The EM experiment was carried out with a current density of 1.5 × 104 A/cm2. The microstructural and mechanical evolutions of both solder joints under EM stressing were comparatively studied using SEM and nanoindentation. Findings The experimental results showed that for the SAC305 solder, the interfacial intermetallic compounds (IMC) formulated a protrusion with an average height of 0.42 µm at the anode after 360 h of EM stressing; however, despite this, the surface of the composite solder joint was relatively smooth. During the stressing period, the interfacial IMC on the anode side of the plain SAC305 solder showed a continuous increasing trend, while the IMC at the cathode presented a decreasing trend for its thickness as the stressing time increased; after 360 h of stressing, some cracks and voids had formed on the cathode side. For the SAC305/ Ni-GNS composite solder, a continuous increase in the thickness of the interfacial IMC was found on both the anode and cathode side; the growth rate of the interfacial IMC at the anode was higher than that at the cathode. The nanoindentation results showed that the hardness of the SAC305 solder joint presented a gradient distribution after EM stressing, while the hardness data showed a relatively homogeneous distribution in the SAC305/ Ni-GNS solder joint. Originality/value The experimental results showed that the Ni-GNS reinforcement could effectively mitigate the EM behavior in solder joints under high current stressing. Specifically, the Ni particles that plated the graphene sheets can work as a fixing agent to suppress the diffusion and migration of Sn and Cu atoms by forming Sn-Cu-Ni IMC. In addition, the nanoidentation results also indicated that the addition of the Ni-GNS reinforcement was very helpful in maintaining the mechanical stability of the solder joint. These findings have provided a theoretical and experimental basis for the practical application of this novel composite solder with high current densities.

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

2011 ◽  
Vol 88 (5) ◽  
pp. 709-714 ◽  
Author(s):  
Sang-Su Ha ◽  
Ji-Yoon Sung ◽  
Jeong-Won Yoon ◽  
Seung-Boo Jung
Keyword(s):  
Solder Joint ◽  
Current Density ◽  
Mechanical Reliability

scholarly journals Effect of modified Ohm's and Fourier's laws on magneto thermoviscoelastic waves with Green-Naghdi theory in a homogeneous isotropic hollow cylinder

2021 ◽  
Vol 8 (6) ◽  
pp. 40-47
Author(s):  
Khamis et al. ◽  
Keyword(s):  
Magnetic Field ◽  
Temperature Gradient ◽  
Charge Density ◽  
Current Density ◽  
Thermal Stresses ◽  
Generalized Thermoelasticity ◽  
Solid Cylinder ◽  
Viscoelastic Solid ◽  
The Impact ◽  
Change System

This paper deals with the modified Ohm's law, including the temperature gradient and charge density effects, and the generalized Fourier's law, including the present current density impact, the problem of conveyance of thermal stresses and temperature in a generalized Magneto–Thermo-Viscoelastic Solid Cylinder of radius L. The formulation is applied to the generalized thermoelasticity dependent on the Green-Naghdi (G-N II) hypothesis. The Laplace change system is utilized to solve the problem. At last, the outcomes got are introduced graphically to show the impact of Magnetic Field and time and on the field variables.

Effect of aluminum trace dimension on electro-migration failure in flip-chip package

2017 ◽  
Vol 31 (07) ◽  
pp. 1741002
Author(s):  
Peisheng Liu ◽  
Guangming Fan ◽  
Yahong Liu ◽  
Longlong Yang ◽  
Xiaoyong Miao
Keyword(s):  
Temperature Gradient ◽  
Joule Heating ◽  
Current Density ◽  
Flip Chip ◽  
3D Model ◽  
Hot Spot ◽  
Electrical Coupling ◽  
Migration Mechanism ◽  
Spot Temperature

A 3D model of flip-chip package is established and thermal–electrical coupling is analyzed. The effect of the width of Aluminum (Al) trace on electro-migration mechanism is also studied. Reducing rates of the hot-spot temperature, the max Joule heating, the max temperature gradient and the max current density are defined to research the effects of the Al trace thickness and the UBM thickness on electro-migration.

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