New RF intrinsic parameters extraction procedure for advanced MOS transistors

Author(s):  
J. C. Tinoco ◽  
A. G. Martinez-Lopez ◽  
M. Emam ◽  
J.-P. Raskin
Author(s):  
A. Bracale ◽  
N. Fel ◽  
V. Ferlet-Cavrois ◽  
D. Pasquet ◽  
J.L. Gautier ◽  
...  

2020 ◽  
Vol 96 (3s) ◽  
pp. 612-614
Author(s):  
В.В. Елесина ◽  
И.О. Метелкин

Проведен анализ случаев возникновения тиристорного эффекта в СВЧ ИС, изготовленных по технологии SiGe БиКМОП, при воздействии ионизирующего излучения. Рассмотрены области СВЧ ИС, чувствительные к возникновению ТЭ, определены основные параметры тиристорных структур. Проведена апробация подхода к восстановлению параметров схемно-топологической радиационно-ориентированной модели тиристорной структуры для САПР. The paper analyzes ionizing radiation induced latchup in microwave SiGe BiCMOS integrated circuits (ICs). Critical parts of ICs sensitive to latchup have been identified and basic parameters of corresponding parasitic thyristor structures have been determined. An approach has been approved to the thyristor structure compact model parameters extraction procedure intended for use in CAD systems.


2018 ◽  
Vol 60 (2) ◽  
pp. 455-458 ◽  
Author(s):  
Djabar Maafri ◽  
Abdelhalim Saadi ◽  
Abdelhalim Slimane ◽  
Mustapha C. E Yagoub

2011 ◽  
Vol 131 (7) ◽  
pp. 864-872 ◽  
Author(s):  
Takashi Toyama ◽  
Shinji Tominaga ◽  
Hiroaki Urushibata ◽  
Hideaki Fujita ◽  
Hirofumi Akagi ◽  
...  

Author(s):  
A. Bracale ◽  
D. Pasquet ◽  
J.L. Gautier ◽  
V. Ferlet ◽  
N. Fel ◽  
...  

2010 ◽  
Vol 5 (2) ◽  
pp. 103-109
Author(s):  
J. Muci ◽  
A. D. Latorre Rey ◽  
F. J. García-Sanchéz ◽  
D. C. Lugo Muñoz ◽  
A. Ortiz-Conde ◽  
...  

A MOSFET model parameters extraction procedure that overcomes the difficulties of separating the effects of source-and-drain series resistance and mobility degradation factor is presented. Instead of the conventional direct fitting, the present procedure involves the use of indirect bidimensional fitting of the source-to-drain resistance of a single device, as obtained from the below-saturation output characteristics measured at several above-threshold gate voltages. The procedure is verified with a simulated long channel FinFET device with externally added resistances and is later applied to experimental planar bulk DRAM MOSFET devices with channel lengths ranging from 0.23μm to 2.0μm. The procedure is shown to be advantageous in terms of computational efficiency and it is appropriate even with high values of externally added series resistances. For the case of devices with various channel lengths, the accuracy of the procedure is improved if the value of RSD is extracted from the shortest channel length. This value of RSD could be used for extracting the other parameters for devices with longer channel.


2010 ◽  
Vol 46 (3) ◽  
pp. 313-322 ◽  
Author(s):  
Alexandre Bacou ◽  
Ahmad Hayat ◽  
Vladimir Iakovlev ◽  
Alexei Syrbu ◽  
AngÉlique Rissons ◽  
...  

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