Effect of Underlap with Fixed Gate Length: GaN-Based Double-Gate MOSFETs

Author(s):  
Md. Rokib Hasan ◽  
Md. Rabiul Islam ◽  
Tanjim Masroor Bhuiyan ◽  
Muhib Ashraf Nibir ◽  
Md. Emran Hasan ◽  
...  
Keyword(s):  
2002 ◽  
Author(s):  
Jae-hong Kim ◽  
Geun-ho Kim ◽  
Suk-woong Ko ◽  
Hak-kee Jung

Aggressive scaling of Metal-oxide-semiconductor Field Effect Transistors (MOSFET) have been conducted over the past several decades and now is becoming more intricate due to its scaling limit and short channel effects (SCE). To overcome this adversity, a lot of new transistor structures have been proposed, including multi gate structure, high-k/metal gate stack, strained channel, fully-depleted body and junctionless configuration. This paper describes a comprehensive 2-D simulation design of a proposed transistor that employs all the aforementioned structures, named as Junctionless Strained Double Gate MOSFETs (JLSDGM). Variation in critical design parameter such as gate length (Lg ) is considered and its impact on the output properties is comprehensively investigated. The results shows that the variation in gate length (Lg ) does contributes a significant impact on the drain current (ID), on-current (ION), off-current (IOFF), ION/IOFF ratio, subthreshold swing (SS) and transconductance (gm). The JLSDGM device with the least investigated gate length (4nm) still provides remarkable device properties in which both ION and gm(max) are measured at 1680 µA/µm and 2.79 mS/µm respectively


2013 ◽  
Vol 275-277 ◽  
pp. 1984-1987 ◽  
Author(s):  
Yu Chen Li ◽  
He Ming Zhang ◽  
Hui Yong Hu ◽  
Yu Ming Zhang ◽  
Bin Wang ◽  
...  

The effect of high-k material on gate threshold voltage for double gate tunnel field-effect transistor (DG-TFET) is studied in this paper. By physically derived the model of threshold voltage for DG-TFET, the quantitative relationship between threshold voltage and gate length is also discussed. It is shown that the proposed model is consistent with the simulation results, and can also easily predict the improved performance on the gate threshold voltage when using high-κ dielectrics and the limited effect on gate threshold voltage when changing the gate length.


2001 ◽  
Vol 686 ◽  
Author(s):  
W.P. Maszara

AbstractDevice modeling data and some early experiments suggests that fully depleted MOSFET devices where channel is controlled by two opposing gates or one gate that surrounds most or the entire channel, will provide better scaling than the classic devices with one gate on one side of the channel. However, formation of such devices requires complex, non-conventional and sometimes exotic geometry and processing, ranging from wafer bonding to selective lateral ‘tunnel’ epitaxy, to selectively wet-etched channels with triangular cross-section. Classic single-gate transistors have been recently demonstrated with reasonable performance at 20-15 nm of physical gate length. Double-gate transistors with their process integration complexity will likely become a viable alternative for smaller geometries. This paper will discuss various approaches to realization of those multi-gate fully depleted devices and their process integration challenges for sub-15 nm gates.


Sign in / Sign up

Export Citation Format

Share Document