dg mosfet
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2022 ◽  
Vol 1048 ◽  
pp. 147-157
Author(s):  
Naveenbalaji Gowthaman ◽  
Viranjay Srivastava

The channel material of a gate describes the operating condition of the MOSFET. A suitable operating condition prevails in MOSFETs if the transistors are quite enough to observe and control at the nanometer regime. An efficient gate and channel material have been proposed in this work which is based on the electrical properties they exhibit at the temperature of 300K. The doping concentration for the electrons and holes is maintained to be 1Χ1019cm-3 for the entire electronic simulator. The simulation results show that using La2O3 along with Indium Nitride (InN) material for the designing of Double-Gate (DG) MOSFETs provides better controllability over the transistor at a channel length of 50nm. This proposed DG-MOSFET is more compliant than the conventional coplanar MOSFETs based on Silicon.


Silicon ◽  
2022 ◽  
Author(s):  
Saradiya Kishor Parija ◽  
Sanjit Kumar Swain ◽  
Sudhansu Mohan Biswal ◽  
Sarosij Adak ◽  
Pradipta Dutta

Author(s):  
Naveenbalaji Gowthaman ◽  
Viranjay M Srivastava

Aluminium Gallium Arsenide (AlGaAs) is a semiconductor material used in the latest design of double heterostructure laser diodes. This semiconductor is mostly available in the arbitrary alloy form between Gallium Arsenide and Aluminium Arsenide. It is derived from the Tri-MethylGallium (TMG/TMGa), and Arsine (AsH3), both the chemicals are pyrophoric and toxic. The resistance is less between source and drain contacts in the case of AlGaAs so that it has been proposed as a material to grow contacts on Indium Phosphide (InP) layer. The AlGaAs uses an ion implantation model for a design purpose which lowers the thermal power while the operation of the device. The parasitic capacitance has to be taken care of while designing a device using this material since the capacitance affects much in the AlGaAs based devices. The average velocity of the electrons has been observed to be increased by 14.63 % in the Au-gate (gate-1) and Pt-gate (gate-2) material-based Double-Gate (DG) MOSFET compared to the Silicon-based DG MOSFET. This paves the way for higher electron mobility, in turn, it can be used in highfrequency device manufacturing. The proposed material can be used in high-speed hybrid applications such as HEMTs and radiofrequency devices for long-haul communication.


2021 ◽  
Author(s):  
Abhinav Gupta ◽  
Manish Kumar Rai ◽  
Amit Kumar Pandey ◽  
Digvijay Pandey ◽  
Sanjeev Rai

Abstract The double gate junctionless transistor (DG-JLT) has become the most promising device in sub nano-meter regime. DGJLT based circuits have improved performance and simpler fabrication than their inversion mode counterparts. This paper demonstrates the design of different analog and digital circuits using DGJLT. Amplifiers and inverters are the basic building block of electronic ICs. A MOS amplifier converts the variation of the gate to source voltage to a small current under transconductance and hence, the output voltage. A single-stage amplifier and differential amplifier have been designed with junctionless-double-gate (JL-DG) MOSFET. Trans-conductance, output voltage, and gain have been investigated using ATLAS 2D device simulator. The inverter is the primary logic gate that can be used to verify the device's response in digital applications. Further, CMOS inverter have been designed using JL-DG MOSFET, and its performance parameters such as switching voltage, noise margin, and logic delay have been analyzed. A switching voltage of 0.43 V, noise margin of 0.265 V, and a delay of 19.18 psec have been obtained for the basic cell. CMOS inverter using JL-DG MOSFET at 20 nm technology node have prompted better performance results. Thus, The JL-DG MOSFET has a bright future in low-power analog and digital applications.


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