Micro pressure sensor fabrication without problem of stiction for a wider range of measurement

Author(s):  
C.W. Liu ◽  
H.S. Ko ◽  
Chie Gau ◽  
C.G. Liu
Materials ◽  
2020 ◽  
Vol 13 (17) ◽  
pp. 3697
Author(s):  
Stefano Salvatori ◽  
Sara Pettinato ◽  
Armando Piccardi ◽  
Vadim Sedov ◽  
Alexey Voronin ◽  
...  

Thin polycrystalline diamond films chemically vapor deposited on thinned silicon substrates were used as membranes for pressure sensor fabrication by means of selective chemical etching of silicon. The sensing element is based on a simple low-finesse Fabry–Pérot (FP) interferometer. The FP cavity is defined by the end-face of a single mode fiber and the diamond diaphragm surface. Hence, pressure is evaluated by measuring the cavity length by an optoelectronic system coupled to the single mode fiber. Exploiting the excellent properties of Chemical Vapor Deposition (CVD) diamond, in terms of high hardness, low thermal expansion, and ultra-high thermal conductivity, the realized sensors have been characterized up to 16.5 MPa at room temperature. Preliminary characterizations demonstrate the feasibility of such diamond-on-Si membrane structure for pressure transduction. The proposed sensing system represents a valid alternative to conventional solutions, overcoming the drawback related to electromagnetic interference on the acquired weak signals generated by standard piezoelectric sensors.


2013 ◽  
Vol 64 (3) ◽  
Author(s):  
Nor Hafizah Ngajikin ◽  
Low Yee Ling ◽  
Nur Izzati Ismail ◽  
Abu Sahmah Mohd Supaát ◽  
Mohd Haniff Ibrahim ◽  
...  

Integration of Complimentary Metal-Oxide-Semiconductor (CMOS) and Microelectromechanical System (MEMS) technology in Fabry Perot blood pressure sensor (FPPS) fabrication processes is presented. The sensor that comprises of a 125 µm diameter of circular diaphragm is modeled to be fabricated using integration of CMOS-MEMS technology. To improve the sensor reliability, a sleeve structure is designed at the back of Silicon wafer by using MEMS Deep Reactive ion Etching (DRIE) process for fiber insertion, which offers a large bonding area. Optical light source at 550 nm wavelength is chosen for this device. The sensor diaphragm mechanic deflection and its optical spectrum is theoretically analyzed and simulated. The analytical results show high linear response in the range of 0 to 40 kPa and a reasonable sensitivity of 1.83 nm/kPa (spectrum shift/pressure) has been obtained for this sensor. The proposed integration of CMOS-MEMS technology limit the material selection yet produces an economical method of FPPS fabrication and integrated system.  


2011 ◽  
Vol 52-54 ◽  
pp. 2060-2064
Author(s):  
Muzalifah Mohd Said ◽  
Muhammad Noorazlan Shah Zainudin ◽  
A.F.M. Napiah Zul ◽  
M. Noh Zarina ◽  
M. Abd Himid Afifah ◽  
...  

Fiber optic interferometry pressure sensor is an excellent diaphragm-base measurement system. It is in-vivo medical device to measure local blood pressure by using endoscopic procedures via the blood vessels and the heart. The sensor must smaller than the size of human artery. This paper has concentrated on the MEMS technology in order to build the sensor tip using micromachining process to the proposed Fabry-Perot Interferometry (FPI) micro-pressure sensor. The feasibility of bulk, surface and hybrid micro-machining as viable proposition for sensor fabrication are reviewed. This paper will address the various factors involved in the manufacturing of FPI sensors, which gives high yield with a specific level of performance. The reliability of the sensor tip has been discussed.


2000 ◽  
Author(s):  
Aleksandar Vujanic ◽  
Nadja Adamovic

Abstract In this paper, we present a fiber optic pressure sensor capable for operation in critical environments. Special attention is given to the sensor design, so that the sensor fabrication is as simple as possible and can be accomplished using standard micromachining processes (wet etching of silicon). Presented pressure sensor employs the principle of light intensity modulation induced by bending of a membrane with boss. Under the influence of pressure a sidewall of boss screens certain area of the fiber-end and modulates the reflected optical signal. A number of design specialties and novel ideas for overcoming the limitations of standard wet etching of silicon are presented. The used fabrication procedure enables, with slight modification of the etching time, fabrication of sensors applicable for measuring various pressure ranges.


2011 ◽  
Vol 131 (9) ◽  
pp. 1518-1527
Author(s):  
Hiromi Maruyama ◽  
Harutoyo Hirano ◽  
Abdugheni Kutluk ◽  
Toshio Tsuji ◽  
Osamu Fukuda ◽  
...  

2010 ◽  
Vol 130 (5) ◽  
pp. 170-175
Author(s):  
Tsukasa Fujimori ◽  
Hideaki Takano ◽  
Yuko Hanaoka ◽  
Yasushi Goto

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