scholarly journals Investigation of Top/Bottom Electrode and Diffusion Barrier Layer for PZT Thick Film MEMS Sensors

Author(s):  
T. Pedersen ◽  
C. C. Hindrichsen ◽  
E. V. Thomsen ◽  
K. Hansen ◽  
R. Lou-Moller
2008 ◽  
Vol 367 (1) ◽  
pp. 201-213 ◽  
Author(s):  
C. C. Hindrichsen ◽  
T. Pedersen ◽  
E. V. Thomsen ◽  
K. Hansen ◽  
R. Lou-Møller

2014 ◽  
Vol 570 ◽  
pp. 183-188 ◽  
Author(s):  
Chang-sing Hwang ◽  
Chun-Huang Tsai ◽  
Chun-Liang Chang ◽  
Chih-Ming Chuang ◽  
Zong-Yang Chuang Shie ◽  
...  

2008 ◽  
Vol 595-598 ◽  
pp. 107-116 ◽  
Author(s):  
Shigenari Hayashi ◽  
Mikihiro Sakata ◽  
Shigeharu Ukai ◽  
Toshio Narita

High temperature oxidation / creep deformation behavior of a diffusion barrier coated Hastelloy-X alloy, with large grain size ~500μm, was investigated at 970°C in air with external tensile stress of 22.5, 27.5, 32, and 40MPa. The diffusion barrier coating formed on Hastelloy-X consisted of a duplex structure with an inner diffusion barrier layer of Re-Cr-Ni alloy, and an outer oxidation resistant layer of β-NiAl. Un coated bare Hastelloy-X alloy with same grain size was also examined under the same conditions for comparison. The composition of the as-coated diffusion barrier coating was (15~21)Ni, (33~37)Cr, (30~33)Re, (11~15)Mo, and (9~14)Fe. This composition corresponds to σ-phase in the Ni-Cr-Re ternary system, which is known as a topologically close packed, TCP phase. The composition of this diffusion barrier layer did not change during the experiment. The oxide scales formed after creep testing on the coated and un-coated alloy surfaces were needle-like θ-Al2O3, and Cr2O3 with small amount of FeCr2O4, respectively. Grain boundary oxidation was also found in the subsurface region of the un-coated alloy. The Al2O3 scale exhibited severe spallation, and many cracks were formed perpendicular to the stress direction. However, no spallation or cracks were observed in the Cr2O3. The creep rupture times for the diffusion barrier coated alloy were about 1.5 times longer than those for bare alloy at all creep stress conditions. The fracture surface after rupture indicates that fracture occurred along alloy grain boundaries in both the coated and un-coated alloy substrate. Many cavities and cracks were observed within the diffusion barrier coated alloy substrate. These cavities and cracks tended to propagate from the substrate toward the diffusion barrier layer, and then stopped at the Re-Cr-Ni / β-NiAl interface. Cracks formed in the un-coated alloy initiated at the tip of grain boundary oxides, and propagated into alloy substrate. However no major cavities were observed inside the alloy substrate. The stress index, n, for both specimens was about 6, and this indicates that the deformation mechanism of both samples was dislocation creep. These results suggest that the Re-Cr-Ni diffusion barrier layer acts as a barrier against the movement of dislocations at the interface with the alloy surface.


1994 ◽  
Vol 343 ◽  
Author(s):  
K. Yoshikawa ◽  
T. Kimura ◽  
H. Noshiro ◽  
S. Ohtani ◽  
M. Yamada ◽  
...  

ABSTRACTRuthenium dioxide (RuO2) thin films are evaluated as bottom electrode for dielectric SrTiO3. It was found that a RuO2 (50nm) / Ru (20nm) barrier layer on a Si substrate is effective as an oxygen barrier layer and as a metal diffusion barrier layer for sputter deposited SrTiO3 films at substrate temperature of 450°C. To test suitability for high temperature processes, RuO2/Ru electrodes were annealed in air at 600°C. 100nm-thiick RuO2 was sufficient to prevent oxygen diffusion. After annealing in the same condition, the leakage current of sputter deposited SrTiO3 (150nm) on RuO2(50nm) / Ru(50nm) was 7.6 × 10 −9 (A/cm2) at 2V.


2016 ◽  
Vol 2016 (4) ◽  
pp. 36-44 ◽  
Author(s):  
K.Yu. Yakovchuk ◽  
◽  
A.V. Mikitchik ◽  
Yu.E. Rudoy ◽  
A.O. Akhtyrsky ◽  
...  

2021 ◽  
Vol 21 (8) ◽  
pp. 4498-4502
Author(s):  
Yen Ngoc Nguyen ◽  
Khanh Quoc Dang ◽  
Injoon Son

An effective diffusion barrier layer was coated onto the surface of BiTe-based materials to avoid the formation of brittle intermetallic compounds (IMCs) by the diffusion of the constituents of Sn-based solder alloys into the BiTe-based alloys. In this study, the electrochemical deposition of multi-layers, i.e., electroless nickel/electroless palladium/immersion gold (ENEPIG) was explored to enhance the bonding strength of BiTe materials with Cu electrodes. The thermoelectric modules with the ENEPIG plating layer exhibited high bonding strengths of 8.96 MPa and 7.28 MPa for the n- and p-type, respectively that increased slightly to 9.26 MPa and 7.76 MPa, respectively after the thermoelectric modules were heated at 200 °C for 200 h. These bonding strengths were significantly higher than that of the thermoelectric modules without a plating layer.


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