Reliability considerations of sintered silver paste on clip semiconductor packages

2016 ◽  
Author(s):  
Richard Clemente ◽  
Erik Nino Tolentino ◽  
Mohd Azizi Azman
Keyword(s):  
Silver Paste ◽  
Semiconductor Packages ◽  
Sintered Silver

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

2022 ◽  
Author(s):  
Xinyue Wang ◽  
Zejun Zeng ◽  
Guoqi Q. Zhang ◽  
Jing Zhang ◽  
Pan Liu
Keyword(s):  
Substrate Surface ◽  
Influence Factors ◽  
Holding Time ◽  
Joint Analysis ◽  
Processing Temperature ◽  
Silver Paste ◽  
Bonding Properties ◽  
Chip Size ◽  
Stress Damage ◽  
Sintered Silver

Abstract Recent years, the sintered silver paste was introduced and further developed for power electronics packaging due to low processing temperature and high working temperature. The pressure-less sintering technology reduces the stress damage caused by the pressure to the chip, improves reliability, and is widely applied in manufacturing. Currently, most existed studies are focused on alcohol-based sintered silver pastes while resins have been demonstrated to improve the bonding properties of solder joints. Hence, the performance and sintering mechanisms with epoxy-based silver paste need to be further explored. In this work, a methodology for multi-factor investigation is settled on the epoxy-based silver paste to reveal the relationship between the strength and the different influence factors. We firstly analyzed the characteristics of commercialized epoxy-based silver paste samples, including silver content, silver particle size, organic paste composition, sample viscosity, and thermal conductivity. Samples were then prepared for shear tests and microstructure analysis under different pressure-less sintering temperatures, holding time, substrate surface, and chip size. Full factor analysis results were further discussed in detail for correlation. The influence factors were ranked from strong to weak as follows: sintering temperature, substrate surface, chip size, and holding time. Finally, a thermal cycling test was carried out for reliability analysis. Epoxy residues are one of the possible reasons which result in shear strength decreasing exponentially.

Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells

2016 ◽  
Vol 849 ◽  
pp. 852-859
Author(s):  
Fang Chun Yan ◽  
Yuan Teng ◽  
Ji Kang Yan ◽  
Jing Hong Du ◽  
Jian Hong Yi ◽  
...  
Keyword(s):  
Solar Cells ◽  
Silver Film ◽  
Adhesion Force ◽  
Silicon Solar Cells ◽  
Sintering Process ◽  
Silver Paste ◽  
Composition Ratio ◽  
Sintering Time ◽  
Sintered Silver ◽  
Glass Powders

In order to study the effects of composition ratio of silver paste and the sintering process on the properties of the silver film after sintering, the effects of different ratios of silver powders, glass powders and organic carrier in silver paste and different sintering temperatures and sintering time on the adhesion force and square resistance of the silver film were studied. The morphology of the sintered silver film was observed by SEM. The results showed that the silver film sintered at 760°C for 6 seconds had better properties after sintering when the ratio of silver powders, glass powders and organic carrier in silver paste was 80:5:15 and the silver powders was composed of spherical silver powders and flake silver powders at the ratio of 94:6. The adhesion force and square resistance of the silver film were 8.25 N and 3.47mΩ /□, respectively.

scholarly journals Development of Sintered Silver Interlayer for Low Temperature Bonding on Aluminum with Glass Containing Silver Paste

2013 ◽  
Vol 2 (4) ◽  
pp. 166-172
Author(s):  
Shuji NISHIMOTO ◽  
Nobuyuki TERASAKI ◽  
Yoshiyuki NAGATOMO ◽  
Toshiyuki NAGASE ◽  
Yoshirou KUROMITSU
Keyword(s):  
Low Temperature ◽  
Silver Paste ◽  
Low Temperature Bonding ◽  
Sintered Silver

scholarly journals Microstructure and properties of a vacuum tempered glass with low-temperature sintered silver paste

2021 ◽  
Author(s):  
Qin Sun ◽  
Guoji Sun ◽  
Yihan Liu ◽  
Yufeng Li ◽  
Hongtao Chen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Low Temperature ◽  
Glass Powder ◽  
Silver Film ◽  
Sintering Temperature ◽  
Fracture Mechanisms ◽  
Tempered Glass ◽  
Silver Paste ◽  
Dissolution And Precipitation ◽  
Sintered Silver

Abstract A low-temperature sintered silver paste was used for metallization on tempered glass to prepare a vacuum tempered glass by soldering with Sn 96.5 Ag 3 Cu 0.5 paste (SAC305). The effects of the glass content and the sintering temperature on the microstructures, shear strengths, and fracture mechanisms of the bondlines were investigated in detail. The microstructure of the thick silver film and its interface with the tempered glass was characterized. The dissolution and precipitation behaviors of the silver in Bi-B-Zn glass were also analyzed. Bi 4 B 2 O 9 crystals were detected in the microstructure of the thick silver film when the joining temperature was increased above 450 °C, which can strengthen the silver film and the interface with the tempered glass. After soldering at 450 °C for 10 min, an excellent bondline was formed with a shear strength of 42.3 MPa and a leak rate of 7.2 × 10 -3 Pa.cm 3 /s by using the low-temperature sintered paste, which had a composition of 80 wt.% silver and 20 wt.% glass powder. Furthermore, heat transfer tests revealed that the vacuum tempered glass had excellent thermal insulation properties. The results showed that the low-temperature sintered silver paste combined with soldering was an effective method to prepare vacuum tempered glass.

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

2019 ◽  
Vol 32 (3) ◽  
pp. 129-136 ◽  
Author(s):  
Yansong Tan ◽  
Xin Li ◽  
Xu Chen ◽  
Zhenwen Yang ◽  
Guo-Quan Lu
Keyword(s):  
Shear Strength ◽  
Double Layer ◽  
Low Pressure ◽  
Large Area ◽  
Silver Paste ◽  
Content Type ◽  
Nano Silver ◽  
Average Shear Strength ◽  
Bonding Method ◽  
Sintered Silver

Purpose This paper aims to use nano-silver paste to design a new bonding method for super-large-area direct-bonded-aluminum (DBA) plates. It compared several frequently used bonding methods and proved the feasibility of an optimized low-pressure-assisted double-layer-printed silver sintering technology for large-area bonding to increase the thermal conductivity of power electronic modules with high junction temperature, higher power density and higher reliability. Design/methodology/approach The bonding profile was optimized by using transparent glasses as substrates. Thus, the bonding qualities could be directly characterized by optical observation. After sintering, the bonded DBA samples were characterized by nondestructive X-ray computed tomography system, scanning electron microscopy equipped with an energy dispersive spectrometer. Finally, bonding stress evolution was characterized by shear tests. Findings Low-pressure-assisted large-area double-layer-printed bonding process consisting of six-step was successfully developed to bond DBA substrates with the size of 50.8 × 25.4 mm. The thickness of the sintered-silver bond-line was between 33  and 74 µm with the average porosity of 12.5 per cent. The distribution of shear strength along the length of DBA/DBA bonded sample was from 9.7  to 18.8 MPa, with average shear strength of 15.5 MPa. The typical fracture primarily propagated in the sintered-silver layer and partially along the Ni layer. Research limitations/implications The bonding stress needs to be further improved. Meanwhile, the thermal and electrical properties are encouraged to test further. Practical implications If nano-silver paste can be used as thermal interfacial material for super-large-area bonding, the thermal performance will be improved. Social implications The paper accelerated the use of nano-silver paste for super-large-area DBA bonding. Originality/value The proposed bonding method greatly decreased the bonding pressure.

Test Results of Sintered Nano-Silver Paste Die Attach for High Temperature Applications

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000037-000049
Author(s):  
Paul Croteau ◽  
Sayan Seal ◽  
Ryan Witherell ◽  
Michael Glover ◽  
Shashank Krishnamurthy ◽  
...  
Keyword(s):  
High Temperature ◽  
Cooling System ◽  
Wide Band ◽  
Power Converter ◽  
Test Results ◽  
Silver Paste ◽  
Nano Silver ◽  
Strain Behavior ◽  
Die Attach ◽  
Sintered Silver

The emergence of wide band gap devices has pushed the boundaries of power converter operations and high power density applications. It is desirable to operate a power inverter at high switching frequencies to reduce passive filter weight and at high temperature to reduce the cooling system requirement. Therefore, materials and components that are reliable at temperatures ranging from −55 to 200 °C, or higher, are needed. Sintered silver is receiving significant attention in the power electronic industry. The porous nature of sintered nano-silver paste with a reduced elastic modulus has the potential to provide strain relief between the die component and substrate while maintaining its relatively high melting point after sintering. The test results presented herein include tensile testing to rupture of sintered silver film to characterize stress strain behavior, as well as die shear and thermal cyclic tests of sintered silver bonded silicon die specimens to copper substrates to determine shear strength and reliability.

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