CMOS Characterization and Compact Modelling for Circuit Reliability Simulation

2018 ◽  
Author(s):  
Javier Diaz-Fortuny ◽  
Javier Martin-Martinez ◽  
Rosana Rodriguez ◽  
Montserrat Nafria ◽  
Rafael Castro-Lopez ◽  
...  
Keyword(s):  
Circuit Reliability

Physics-based device aging modelling framework for accurate circuit reliability assessment

2021 ◽  
Author(s):  
Zhicheng Wu ◽  
Jacopo Franco ◽  
Brecht Truijen ◽  
Philippe Roussel ◽  
Stanislav Tyaginov ◽  
...  
Keyword(s):  
Reliability Assessment ◽  
Circuit Reliability ◽  
Modelling Framework ◽  
Device Aging

scholarly journals The wheelchair circuit: Reliability of a test to assess mobility in persons with spinal cord injuries

2002 ◽  
Vol 83 (12) ◽  
pp. 1783-1788 ◽  
Author(s):  
Olga J. Kilkens ◽  
Marcel W. Post ◽  
Lucas H. van der Woude ◽  
Annet J. Dallmeijer ◽  
Wim J. van den Heuvel
Keyword(s):  
Spinal Cord ◽  
Spinal Cord Injuries ◽  
Circuit Reliability

Sample Preparation of Aluminum Bridge Test Vehicles for Tem In-Situ Crystallographic Studies of Electromigration

1987 ◽  
Vol 115 ◽  
Author(s):  
W. E. Rhoden ◽  
J. V. Maskowitz ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
High Temperature ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Circuit Reliability ◽  
Test Vehicle ◽  
Aluminum Films ◽  
Current Densities ◽  
Integrated Circuit Reliability ◽  
A Current

IntroductionElectromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.

Solving 28 nm I/O circuit reliability issue due to IC design weakness

2018 ◽  
Vol 88-90 ◽  
pp. 246-249 ◽  
Author(s):  
Yi Chao Low ◽  
P.K. Tan ◽  
S.L. Tan ◽  
Y.Z. Zhao ◽  
J. Lam
Keyword(s):  
Circuit Reliability ◽  
Ic Design ◽  
Reliability Issue

Updated Analysis of Circuit Reliability Test Results

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000253-000259
Author(s):  
Milton Watts
Keyword(s):  
Failure Analysis ◽  
Detailed Analysis ◽  
Continuous Improvement ◽  
Oil And Gas ◽  
Lessons Learned ◽  
Reliability Test ◽  
Circuit Reliability ◽  
Test Results ◽  
Life Testing ◽  
Gas Market

The downhole oil and gas market is continually pushing for higher reliability at higher temperatures. Satisfying this need requires continuous improvement, driven by failure analysis of both internal testing and field returns. This paper discusses recent lessons learned from on-going tests. Results of unpowered circuit assembly tests are reviewed. Also, a detailed analysis of separate powered life testing is presented. The internal testing results are further discussed in the context of field return data.

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