Class-F Power Amplifier With High Power Added Efficiency Using Bowtie-Shaped Harmonic Control Circuit

2015 ◽  
Vol 25 (2) ◽  
pp. 133-135 ◽  
Author(s):  
Mohsen Hayati ◽  
Akram Sheikhi ◽  
Andrei Grebennikov
2011 ◽  
Vol 3 (6) ◽  
pp. 621-625
Author(s):  
Shilei Jin ◽  
Jianyi Zhou ◽  
Lei Zhang

In this article, the development of a high-efficiency power amplifier (PA) with the inverse class-F configuration and a novel 3/4 spiral defected ground structure (DGS) is presented. The proposed DGS structure has improved rejection characteristic and its resonance frequencies are more convenient to adjust than conventional symmetric and asymmetric spiral structure. The electromagnetic-simulated result shows that the proposed circuit has improved harmonic control performance with simplified structure and less return loss than the conventional microstrip harmonic control circuit. The 3/4 spiral harmonics control circuit (HCC) can be modeled by three parallel RLC resonators. Using the proposed structure a high-performance harmonic control circuit is designed for implementing an inverse class-F PA. For comparison, two inverse class-F PAs operating at 2.4 GHz have been implemented by the microstrip HCC and the proposed HCC, respectively. According to the experiment results, the size of the proposed inverse class-F PA is reduced by 20%, the power-added efficiency and the gain are increased by 4.8% and 1.5 dB, respectively.


Frequenz ◽  
2020 ◽  
Vol 74 (3-4) ◽  
pp. 145-152
Author(s):  
Ali Pirasteh ◽  
Saeed Roshani ◽  
Sobhan Roshani

AbstractIn this paper, a new method to decrease the dimensions of the microstrip structures and reducing the overall size of the class F amplifiers is presented. First, by using the PHEMT transistor with a conventional harmonic control circuit (HCC), a low-voltage class F amplifier in the L band frequency at the operating frequency of 1.75 GHz is introduced, which named primitive class F power amplifier. Then, this amplifier is optimized by using capacitor loaded transmission lines (CLTLs). The measurement results of the amplifier show that by using the CLTL structure, the overall size has been reduced 85% (0.23 λg × 0.17 λg). The maximum power-added efficiency (PAE) of the power amplifier is about 77.5 % and the power gain which has been reached to 18.33 dB. The desirable features of this power amplifier, along with its very small size, make this power amplifier a good choice to use for the global system for mobile communications.


2016 ◽  
Vol 04 (03) ◽  
pp. 74-78
Author(s):  
Chia-Han Lin ◽  
Hsien-Chin Chiu ◽  
Min-Li Chou ◽  
Hsiang-Chun Wang ◽  
Ming-Feng Huang

Electronics ◽  
2021 ◽  
Vol 10 (20) ◽  
pp. 2450
Author(s):  
Syed Muhammad Ammar Ali ◽  
S. M. Rezaul Hasan

This paper reports a “single-transistor” Class-F−1 power amplifier (PA) in 65 nm CMOS, which operates at the microwave center frequency of 6 GHz. The PA is loaded with a Class-F−1 harmonic control network, employing a new “parasitic-aware” topology deduced using a novel iterative algorithm. A dual-purpose output matching network is designed, which not only serves the purpose of output impedance matching, but also reinforces the harmonic control of the Class-F−1 harmonic network. This proposed PA yields a peak power-added efficiency (PAE) of 47.8%, which is one of the highest when compared to previously reported integrated microwave/millimeter-wave PAs in CMOS and SiGe technologies. The amplifier shows a saturated output power of 14.4 dBm along with an overall gain of 13.8 dB.


Author(s):  
M. Al-Ajmi ◽  
A. Al-Blushi ◽  
R. Al-Mamari ◽  
Z. Nadir ◽  
M. Bait-Suwailam

2021 ◽  
Vol 11 (19) ◽  
pp. 9017
Author(s):  
Jinho Jeong ◽  
Yeongmin Jang ◽  
Jongyoun Kim ◽  
Sosu Kim ◽  
Wansik Kim

In this paper, a high-power amplifier integrated circuit (IC) in gallium-nitride (GaN) on silicon (Si) technology is presented at a W-band (75–110 GHz). In order to mitigate the losses caused by relatively high loss tangent of Si substrate compared to silicon carbide (SiC), low-impedance microstrip lines (20–30 Ω) are adopted in the impedance matching networks. They allow for the impedance transformation between 50 Ω and very low impedances of the wide-gate transistors used for high power generation. Each stage is matched to produce enough power to drive the next stage. A Lange coupler is employed to combine two three-stage common source amplifiers, providing high output power and good input/output return loss. The designed power amplifier IC was fabricated in the commercially available 60 nm GaN-on-Si high electron mobility transistor (HEMT) foundry. From on-wafer probe measurements, it exhibits the output power higher than 26.5 dBm and power added efficiency (PAE) higher than 8.5% from 88 to 93 GHz with a large-signal gain > 10.5 dB. Peak output power is measured to be 28.9 dBm with a PAE of 13.3% and a gain of 9.9 dB at 90 GHz, which corresponds to the power density of 1.94 W/mm. To the best of the authors’ knowledge, this result belongs to the highest output power and power density among the reported power amplifier ICs in GaN-on-Si HEMT technologies operating at the W-band.


Circuit World ◽  
2020 ◽  
Vol 46 (4) ◽  
pp. 243-248
Author(s):  
Min Liu ◽  
Panpan Xu ◽  
Jincan Zhang ◽  
Bo Liu ◽  
Liwen Zhang

Purpose Power amplifiers (PAs) play an important role in wireless communications because they dominate system performance. High-linearity broadband PAs are of great value for potential use in multi-band system implementation. The purpose of this paper is to present a cascode power amplifier architecture to achieve high power and high efficiency requirements for 4.2∼5.4 GHz applications. Design/methodology/approach A common emitter (CE) configuration with a stacked common base configuration of heterojunction bipolar transistor (HBT) is used to achieve high power. T-type matching network is used as input matching network. To increase the bandwidth, the output matching networks are implemented using the two L-networks. Findings By using the proposed method, the stacked PA demonstrates a maximum saturated output power of 26.2 dBm, a compact chip size of 1.17 × 0.59 mm2 and a maximum power-added efficiency of 46.3 per cent. The PA shows a wideband small signal gain with less than 3 dB variation over working frequency. The saturated output power of the proposed PA is higher than 25 dBm between 4.2 and 5.4 GHz. Originality/value The technology adopted for the design of the 4.2-to-5.4 GHz stacked PA is the 2-µm gallium arsenide HBT process. Based on the proposed method, a better power performance of 3 dB improvement can be achieved as compared with the conventional CE or common-source amplifier because of high output stacking impedance.


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