Low cost and large deflection angle polymer MEMS mirror using glass substrate

A novel piezoelectrically actuated scanning micromirror integrated with angle sensors is presented. The mirror with large size of 3×3mm2 locates in the center of the device, and piezoelectric actuators are symmetrically placed on both sides of the mirror. They are connected through torsion bars in which piezoelectric angle sensors are integrated. In order to obtain large deflection angle at a low operation voltage, the new actuator consisting of several parallel piezoelectric cantilevers is adopted. The machematical models of the mirror and piezoelectric actuator are given, and the piezoelectric angle sensors are designed to obtain high sensitivities. The simulation results indicate that the maximum mechanical deflection angle of the micromirror is 12.4° at an operation voltage of 25V, and the maximum output voltage of the angle sensor is 164.3mV. The resonant frequency associated with the torsional mode is 960Hz. The sensitivity of the angle sensor is 13.3mV/° without amplifying. The Scanning miromirror is suitable for optical scanning systems such as the microscope, the micro-spectrometer, the medical imaging, the barcode reader and so on.

Download Full-text

Investigation of Superhydrophobic/Hydrophobic Materials Properties Using Electrospinning Technique

Baghdad Science Journal ◽

10.21123/bsj.2019.16.3.0632 ◽

2019 ◽

Vol 16 (3) ◽

pp. 0632 ◽

Cited By ~ 2

Author(s):

Jaafar Et al.

Keyword(s):

Polymer Solution ◽

Glass Substrate ◽

Low Cost ◽

Contact Angle Measurement ◽

Angle Measurement ◽

Metal Substrate ◽

Electrospinning Technique ◽

Electrospinning Method ◽

Surface Alteration ◽

Measurement Surface

The aim of this research is to study the surface alteration characteristics and surface morphology of the superhydrophobic/hydrophobic nanocomposite coatings prepared by an electrospinning method to coat various materials such as glass and metal. This is considered as a low cost method of fabrication for polymer solutions of Polystyrene (PS), Polymethylmethacrylate (PMMA) and Silicone Rubber (RTV). Si were prepared in various wt% of composition for each solutions. Contact angle measurement, surface tension, viscosity, roughness tests were calculated for all specimens. SEM showed the morphology of the surfaces after coated. PS and PMMA showed superhydrophobic properties for metal substrate, while Si showed hydrophobic characteristics for both metal and glass substrate. Polymer solution of (15%Si/Thinner (Th)) owned best roughness for glass substrate and polymer solution of (4%PMMA/Tetrahydrofuran (THF)) owned best roughness for metal substrate.

Download Full-text

Effect of large deflection angle on the laser intensity profile produced by AOD scanners in high precision manufacturing

International Congress on Applications of Lasers & Electro-Optics ◽

10.2351/1.5063169 ◽

2015 ◽

Author(s):

Tiansi Wang ◽

Chong Zhang ◽

Aleksandar Aleksov ◽

Islam A. Salama ◽

Aravinda Kar

Keyword(s):

High Precision ◽

Large Deflection ◽

Deflection Angle ◽

Laser Intensity ◽

Intensity Profile ◽

Precision Manufacturing

Download Full-text

Innovated Process Integration for Panel Size Glass Substrate Manufacturing for SiP Application

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016dpc-tha13 ◽

2016 ◽

Vol 2016 (DPC) ◽

pp. 001893-001917 ◽

Cited By ~ 1

Author(s):

Yu-Hua Chen ◽

Yu-Chung Hsieh ◽

Wei-Di Lin ◽

Chun-Hsien Chien ◽

Dyi-Chung Hu

Keyword(s):

Line Width ◽

Glass Substrate ◽

Process Integration ◽

Coefficient Of Thermal Expansion ◽

Low Cost ◽

Unit Cost ◽

High Volume ◽

Thin Glass ◽

Panel Size ◽

Wafer Processing

Although Silicon interposer has good performance, however high cost is still the major issue and limits its high volume adoption. Therefore to decrease the assembly cost or develop low cost, high density interconnect interposer technology is the keys to enable 2.5D SiP integration. One possibility is to develop low cost interposer by adopting the alternative materials instead of Silicon. The glass, low CTE polymer material, ceramic, etc. may be included. Glass represents an attractive choice with potential of tailorable properties dependent on specific glass composition. By targeting the coefficient of thermal expansion (CTE), the CTE of glass can be made to match perfectly with silicon dies and for reliable package. In addition, the advantages of using glass for interposer derive from process flexibility for size and thickness since the glass fusion process provides sheets with dimensions of more than three meters. It is straight forward to provide glass substrate of almost any size needed. Large glass panels are ideally suited for fabrication of interposer where the panel process is expected to provide large number of interposers in each run compared with wafer processing. Additionally, the two sided processing of the panel, the avoidance of Si wafer CMP processes further enable lower unit cost for the interposer Consequently, glass is an ideal interposer material due to its insulating property, large panel size availability, high modulus and ability to tailor CTE. In this paper, we successfully demonstrate manufacturing feasibility of glass substrate with 4 build-up layers starting with a thin glass panel in 508mm×508mm panel size format and under the IC substrate manufacturing environment. Glass thickness of 100~300um could be processed through the IC substrate HVM line. The laser via in via or direct metallization technology could be selected for double side electrical connection. The copper line width/space of 8/8um was demonstrated by current substrate HVM line. By adopting advanced lithography process and material, line width/space less than 2/2um was achievable. TCT Reliability test without glass crack results will also be discussed.

Download Full-text

Carbon nanotube/glycerol embedded low cost flexible sensor for large deflection sensing of continuum manipulators

Measurement Science and Technology ◽

10.1088/1361-6501/ac46f0 ◽

2021 ◽

Author(s):

SAPTAK BHATTACHERJEE ◽

Sananda Chatterjee ◽

Subhasis Bhaumik

Keyword(s):

Minimally Invasive Surgery ◽

Minimally Invasive ◽

Invasive Surgery ◽

Large Deflection ◽

Low Cost ◽

Gauge Factor ◽

Robot Assisted ◽

Continuum Robots ◽

Angular Deflection ◽

Wide Range

Abstract Large deflection sensing is highly crucial for proper positioning and control of continuum robots during robot assisted minimally invasive surgery. Existing techniques suffer from eletromagnetic noise susceptibility, harmful radiation exposure, limited range, bio-incompatibility and necessity of expensive instruments. In the present study, we propose a Multi-Walled Carbon Nano-Tube (MWCNT)/polyglycerol based low cost, flexible and biocompatible sensor which could allow safer, faster and accurate angular deflection measurement of continuum robots for biomedical applications. Experimental results demonstrate that the sensor is stretchable upto 100% , provides a gauge factor upto 11.65, have response time around 8 ms, durability of -0.14% for cyclic loading and unloading and show very small creep upto ±0.0008 ( ±2.88%). Furthermore, the sensor can measure continuum robot deflection upto ±150 o with a sensitivity of 666.67 ohms/degree, with a maximum error of 1.67% and maximum hysteresis of 1.41%. Thus, wide range, low cost, fast response, and biocompatibility justify the potential of the proposed sensor for large deflection sensing of continuum robots during robot assisted minimally invasive surgery.

Download Full-text