Activation energy of thermal oxidation germanium oxide on germanium substrates

Author(s):  
N. A. A. Halim ◽  
S. K. Sahari ◽  
A. A. Hamzah ◽  
B. Y. Majlis ◽  
S. Marini ◽  
...  
Crystals ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 522
Author(s):  
Małgorzata Płońska ◽  
Julian Plewa

In the presented work, two kinds of germanium oxide glass with different compositions, namely GeO2 and GeO2–Al2O3–Bi2O3, were investigated. After controlled crystallization of a glassy sample, the emission in the NIR-range was determined (1165 nm with excitation at 470 nm). To better understanding the kinetics of the glass crystallization, the activation energy was also determined by applying the Kissinger method. The obtained results show that in the case of GeO2–Al2O3–Bi2O3, activation energy value was 400 and 477 kJ/mol, which means that such values are significantly larger than for pure GeO2 (254 kJ/mol). The investigations also show that two phases crystallized in the complex glass matrix: the mullite-like phase and germanium oxide.


1987 ◽  
Vol 92 ◽  
Author(s):  
Stephan E. Lassig ◽  
Thomas J. Debolske ◽  
John L. Crowley

ABSTRACTThis paper presents kinetic data for the rapid thermal oxidation (RTO) of <100 silicon using a wall stabilized low pressure arc lamp as the heating source. The data shows a single activation energy of 1.31 eV over the temperature range of 900°C to 1200°C and times of 60 seconds to 240 seconds. Comparisons are made with published kinetic data of RTO using tungsten-halogen lamp source [1] and with furnace oxidation kinetics for short times (<240 sec.) [2]. “Wet” oxidation results using O2:H2 as the oxidizing ambient reveal a lower activation energy and preexponential coefficient than the dry oxidation. Also presented are results using an experimental set-up which exhibits ultraviolet enhanced oxidation.


2014 ◽  
Vol 898 ◽  
pp. 102-106
Author(s):  
Bei Long Zhang ◽  
Hong Hai Huang ◽  
Wei Yong Deng ◽  
Yong Zhou Wang ◽  
Li Ding ◽  
...  

The thermal oxidation kinetics of natural rubber containing hydrazine dihydrochloride or hydrazine sulfate used as tackifier were studied, and the effective storage time of natural rubber containing tackifier was predicted with a method of heat accelerated storage aging. The results show that the thermal oxidation activation energy of natural rubber containing hydrazine dihydrochloride is 105.6kJ/ mol, being a little higher than that (104.7 kJ/ mol) of the control. The thermal oxidation activation energy of natural rubber containing hydrazine sulfate is 103.1kJ/ mol, being a little lower than that of the control. The effective storage time of natural rubber containing hydrazine dihydrochloride is 13.4 years at 30°C,27.0years at 25°C, and 55.9years at 20°C. The effective storage time of natural rubber containing hydrazine sulfate is 11.6years at 30°C,23.0 at 25°C, and 46.8years at 20°C.The effective storage times of natural rubber containing two tackifiers hydrazine dihydrochloride or hydrazine sulfate are higher than that of the control at the same condition.


1982 ◽  
Vol 53 (12) ◽  
pp. 8771-8774 ◽  
Author(s):  
E. M. Lawson ◽  
A. J. Tavendale

1989 ◽  
Vol 146 ◽  
Author(s):  
Stephan E Lassig ◽  
John L

ABSTRACTA study of the oxidation kinetics of lightly doped (100) silicon in dry oxygen has been carried out at different pressures (0.03 atm. to 1.0 atm.) and temperatures (900ºC to 1200ºC) for short times (< 500 seconds). The data can be fit equally well to the parabolic model as it can to the linearparabolic or parallel oxidation models. The activation energy derived from analysis of the parabolic rate constant is 0.94 eVand is the same at 1.0 and 0.1 atmosphere dry O2. It was also found that the parabolic rate constant displayed a linear dependence on the O2 pressure.


2013 ◽  
Vol 594-595 ◽  
pp. 1069-1073 ◽  
Author(s):  
Siti Kudnie Sahari ◽  
Norsuzailina Momamad Sutan ◽  
Rohana Sapawi ◽  
Ibrahim Yakub ◽  
Dayang Nur Salmi Awg Salleh ◽  
...  

Thermal oxidation of Ge was performed in dry oxygen ambience at atmospheric pressure at temperature ranging between 375 and 575°C. From SE analysis, the slope of Ge oxide growth and extinction coefficient (k) increases while refractive index (n) does not change with oxidation temperature. The reduction of activation energy for Ge thermal oxidation was explained by the retardation of diffusion oxidant through GeO2film during Ge oxidation. The generation of an oxygen-defect region in the Ge oxide layer at 490°C oxidation was confirmed by XPS analysis and an O2anneal at 375°C was effective to reduce this oxygen deficiency.


2003 ◽  
Vol 762 ◽  
Author(s):  
A. Gordijn ◽  
J.K. Rath ◽  
R.E.I. Schropp

AbstractDue to the high temperatures used for high deposition rate microcrystalline (μc-Si:H) and polycrystalline silicon, there is a need for compact and temperature-stable doped layers. In this study we report on films grown by the layer-by-layer method (LbL) using VHF PECVD. Growth of an amorphous silicon layer is alternated by a hydrogen plasma treatment. In LbL, the surface reactions are separated time-wise from the nucleation in the bulk. We observed that it is possible to incorporate dopant atoms in the layer, without disturbing the nucleation. Even at high substrate temperatures (up to 400°C) doped layers can be made microcrystalline. At these temperatures, in the continuous wave case, crystallinity is hindered, which is generally attributed to the out-diffusion of hydrogen from the surface and the presence of impurities (dopants).We observe that the parameter window for the treatment time for p-layers is smaller compared to n-layers. Moreover we observe that for high temperatures, the nucleation of p-layers is more adversely affected than for n-layers. Thin, doped layers have been structurally, optically and electrically characterized. The best n-layer made at 400°C, with a thickness of only 31 nm, had an activation energy of 0.056 eV and a dark conductivity of 2.7 S/cm, while the best p-layer made at 350°C, with a thickness of 29 nm, had an activation energy of 0.11 V and a dark conductivity of 0.1 S/cm. The suitability of these high temperature n-layers has been demonstrated in an n-i-p microcrystalline silicon solar cell with an unoptimized μc-Si:H i-layer deposited at 250°C and without buffer. The Voc of the cell is 0.48 V and the fill factor is 70 %.


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