Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models
2006 ◽
Vol 29
(2)
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pp. 355-363
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2001 ◽
Vol 24
(2)
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pp. 499-506
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2006 ◽
Vol 46
(12)
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pp. 2131-2138
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2014 ◽
Vol 54
(5)
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pp. 939-944
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