Optimization of Thermomechanical Reliability of Board-level Package-on-Package Stacking Assembly
2006 ◽
Vol 29
(4)
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pp. 864-868
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2007 ◽
Vol 47
(1)
◽
pp. 104-110
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2008 ◽
Vol 31
(2)
◽
pp. 495-502
◽
2008 ◽
Vol 31
(2)
◽
pp. 174-179
◽
2008 ◽
Vol 85
(4)
◽
pp. 659-664
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Keyword(s):
Keyword(s):