Design guideline on board-level thermomechanical reliability of 2.5D package
2007 ◽
Vol 47
(1)
◽
pp. 104-110
◽
2008 ◽
Vol 31
(2)
◽
pp. 495-502
◽
2008 ◽
Vol 31
(2)
◽
pp. 174-179
◽
2008 ◽
Vol 85
(4)
◽
pp. 659-664
◽
2006 ◽
Vol 129
(1)
◽
pp. 98-104
◽
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