Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations

2020 ◽  
Vol 10 (8) ◽  
pp. 1394-1400
Author(s):  
A. Surendar ◽  
M. Kavitha ◽  
M. Arun ◽  
V. Panwar
Keyword(s):  
Solder Joints ◽  
Electronic Devices ◽  
Reliability Assessment ◽  
Thermal Fluctuations

scholarly journals Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Vahid Samavatian ◽  
Mahmud Fotuhi-Firuzabad ◽  
Majid Samavatian ◽  
Payman Dehghanian ◽  
Frede Blaabjerg
Keyword(s):  
Machine Learning ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Electronic Materials ◽  
Electronic Devices ◽  
Reliability Assessment ◽  
Electronic Systems ◽  
Learning Framework ◽  
Useful Lifetime

Abstract The quantity and variety of parameters involved in the failure evolutions in solder joints under a thermo-mechanical process directs the reliability assessment of electronic devices to be frustratingly slow and expensive. To tackle this challenge, we develop a novel machine learning framework for reliability assessment of solder joints in electronic systems; we propose a correlation-driven neural network model that predicts the useful lifetime based on the materials properties, device configuration, and thermal cycling variations. The results indicate a high accuracy of the prediction model in the shortest possible time. A case study will evaluate the role of solder material and the joint thickness on the reliability of electronic devices; we will illustrate that the thermal cycling variations strongly determine the type of damage evolution, i.e., the creep or fatigue, during the operation. We will also demonstrate how an optimal selection of the solder thickness balances the damage types and considerably improves the useful lifetime. The established framework will set the stage for further exploration of electronic materials processing and offer a potential roadmap for new developments of such materials.

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Recent Development on Fracture Analysis of Solder Joints

2014 ◽  
Vol 695 ◽  
pp. 680-683
Author(s):  
E.P. Ooi ◽  
R. Daud ◽  
N.A.M. Amin ◽  
T.W. Hong
Keyword(s):  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Fracture Analysis ◽  
Fracture Load ◽  
Mixed Mode Loading ◽  
Vibration Loading ◽  
Prevalent Fracture ◽  
Recent Fracture ◽  
Impact Vibration

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. In reality, the solder joints are exposed to drop impact, vibration loading, bending, and twisting of PCBs. Study on this matter will lead to prediction of fracture load, prevalent fracture mode, exact joint interconnect size and life of joints under brittle and fatigue failure. This paper presents a review of recent fracture analysis on solder joints.

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Sinan Su ◽  
Francy John Akkara ◽  
Ravinder Thaper ◽  
Atif Alkhazali ◽  
Mohammad Hamasha ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Prediction Models ◽  
Solder Joints ◽  
State Of The Art ◽  
Electronic Devices ◽  
Creep Damage ◽  
Fatigue Life Prediction ◽  
Factors Affecting ◽  
Causes Of Failure

Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

Finite Element Modeling of Intermetallic Compound (IMC) Solder Joints Fracture: Part A

2015 ◽  
Vol 786 ◽  
pp. 131-135
Author(s):  
Eang Pang Ooi ◽  
Ruslizam Daud ◽  
N.A.M. Amin ◽  
T.W. Hong ◽  
M.S. Abdul Majid ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Single Edge ◽  
Element Modeling ◽  
Conceptual Study ◽  
Displacement Extrapolation Method ◽  
Displacement Extrapolation

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. This paper presents a finite element modeling of intermetallic compounds solder joints failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack on intermetallic IMC solder joints is presented.

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