3-D Printing Structural Electronics With Conductive Filaments

In this publication, we describe the process of fabrication and the analysis of the properties of nanocomposite filaments based on carbon nanotubes and acrylonitrile butadiene styrene (ABS) polymer for fused deposition modeling (FDM) additive manufacturing. Polymer granulate was mixed and extruded with a filling fraction of 0.99, 1.96, 4.76, 9.09 wt.% of CNTs (carbon nanotubes) to fabricate composite filaments with a diameter of 1.75 mm. Detailed mechanical and electrical investigations of printed test samples were performed. The results demonstrate that CNT content has a significant influence on mechanical properties and electrical conductivity of printed samples. Printed samples obtained from high CNT content composites exhibited an improvement in the tensile strength by 12.6%. Measurements of nanocomposites’ electrical properties exhibited non-linear relation between the supply voltage and measured sample resistivity. This effect can be attributed to the semiconductor nature of the CNT functional phase and the occurrence of a tunnelling effect in percolation network. Detailed I–V characteristics related to the amount of CNTs in the composite and the supply voltage influence are also presented. At a constant voltage value, the average resistivity of the printed elements is 2.5 Ωm for 4.76 wt.% CNT and 0.15 Ωm for 9.09 wt.% CNT, respectively. These results demonstrate that ABS/CNT composites are a promising functional material for FDM additive fabrication of structural elements, but also structural electronics and sensors.

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Structural, electronics and optical properties of sodium based fluoroperovskites NaXF3 (X = Ca, Mg, Sr and Zn): First principles calculations

Physics Letters A ◽

10.1016/j.physleta.2021.127574 ◽

2021 ◽

pp. 127574

Author(s):

Mohammad Reda Kabli ◽

Jalil ur Rehman ◽

M. Bilal Tahir ◽

Muhammad Usman ◽

Arshid Mahmood Ali ◽

...

Keyword(s):

Optical Properties ◽

First Principles ◽

First Principles Calculations ◽

Structural Electronics

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Soldering of Electronics Components on 3D-Printed Conductive Substrates

Materials ◽

10.3390/ma14143850 ◽

2021 ◽

Vol 14 (14) ◽

pp. 3850

Author(s):

Bartłomiej Podsiadły ◽

Andrzej Skalski ◽

Marcin Słoma

Keyword(s):

Additive Manufacturing ◽

Solder Joints ◽

Rapid Development ◽

Surface Preparation ◽

Contact Angles ◽

Electronic Components ◽

Optimal Method ◽

Structural Electronics ◽

3D Printed ◽

Composite Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components.

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Photonic curing of silver paths on 3D printed polymer substrate

Circuit World ◽

10.1108/cw-11-2018-0084 ◽

2019 ◽

Vol 45 (1) ◽

pp. 9-14

Author(s):

Jakub Krzeminski ◽

Bartosz Blicharz ◽

Andrzej Skalski ◽

Grzegorz Wroblewski ◽

Małgorzata Jakubowska ◽

...

Keyword(s):

Polymer Substrate ◽

Fused Deposition Modelling ◽

Content Type ◽

Fused Deposition ◽

Photonic Curing ◽

Structural Electronics ◽

Jet Printing ◽

3D Printed ◽

Aerosol Jet Printing ◽

Photonic Sintering

Purpose Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate. Design/methodology/approach This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques. Findings This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications. Originality/value The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

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Conductive ABS/Ni Composite Filaments for Fused Deposition Modeling of Structural Electronics

Advances in Intelligent Systems and Computing - Mechatronics 2019: Recent Advances Towards Industry 4.0 ◽

10.1007/978-3-030-29993-4_8 ◽

2019 ◽

pp. 62-70

Author(s):

Bartłomiej Podsiadły ◽

Andrzej Skalski ◽

Marcin Słoma

Keyword(s):

Fused Deposition Modeling ◽

Fused Deposition ◽

Structural Electronics ◽

Deposition Modeling

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Direct-write/cure conductive polymer nanocomposites for 3D structural electronics

Journal of Mechanical Science and Technology ◽

10.1007/s12206-013-0805-4 ◽

2013 ◽

Vol 27 (10) ◽

pp. 2929-2934 ◽

Cited By ~ 13

Author(s):

Yanfeng Lu ◽

Morteza Vatani ◽

Jae-Won Choi

Keyword(s):

Polymer Nanocomposites ◽

Conductive Polymer ◽

Direct Write ◽

Structural Electronics ◽

3D Structural Electronics

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An exploration of binder jetting of copper

Rapid Prototyping Journal ◽

10.1108/rpj-12-2014-0180 ◽

2015 ◽

Vol 21 (2) ◽

pp. 177-185 ◽

Cited By ~ 85

Author(s):

Yun Bai ◽

Christopher B Williams

Keyword(s):

Maximum Temperature ◽

Powder Size ◽

Metal Powders ◽

Content Type ◽

Material Development ◽

Powder Packing ◽

Structural Electronics ◽

Manufacturing Techniques ◽

Future Work ◽

Binder Jetting

Purpose – The purpose of this paper is to explore the use of binder jetting to fabricate high-purity copper parts. The ability to fabricate geometrically complex copper shapes would have implications on the design and manufacture of components for thermal management systems and structural electronics. Design/methodology/approach – To explore the feasibility of processing copper via binder jetting, the authors followed an established material development process that encompasses powder selection and tuning process parameters in printing and thermal cycles. Specifically, the authors varied powder size and sintering cycles to explore their effects on densification. Findings – Three differently sized copper powders were successfully printed, followed by sintering in a reducing atmosphere. It was found that a 15-μm-diameter powder with a sintering cycle featuring a 1,080°C maximum temperature provides the most dense (85 per cent) and pure (97 per cent) final copper parts of the parameters tested. Research limitations/implications – Due to powder-based additive manufacturing techniques’ inherent limitations in powder packing and particle size diameter, there are difficulties in creating fully dense copper parts. To improve thermal, electrical and mechanical properties, future work will focus on improving densification. Originality/value – The paper demonstrates the first use of binder jetting to fabricate copper artifacts. The resulting copper parts are denser than what is typically found in binder jetting of metal powders (without infiltration); significant opportunity remains to further optimize the manufacturing process by introducing novel techniques to tailor the material properties for thermal/electrical applications.

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Theoretical Study of a New Diarylic Ligand for M2+ Cations Detection

Proceedings ◽

10.3390/ecsoc-22-05671 ◽

2018 ◽

Vol 9 (1) ◽

pp. 45

Author(s):

Carla M. Ormachea ◽

Cristián A. Ferretti ◽

Pablo Noriega ◽

Leandro Gutierrez ◽

Pedro M. E. Mancini ◽

...

Keyword(s):

Density Functional ◽

Theoretical Study ◽

Polarizable Continuum Model ◽

Ligand Complex ◽

Hydrazone Ligand ◽

Molecular Systems ◽

The Density Functional Theory ◽

Td Dft ◽

Structural Electronics ◽

Polarizable Continuum

A novel byphenyl hydrazone ligand developed as a chemosensor for the detection of Cu2+ was studied using a theoretical analysis based on the density functional theory (DFT) and time-dependent DFT (TD-DFT). The geometries of the ligand (L) and the Cu2+-ligand complex were optimized at the CAM-B3LYP/631+G(d,p) level of theory in dimethyl sulfoxide, using the conductor-like polarizable continuum model. The adsorption spectra of these molecular systems were analyzed and compared with the experimental data. Theoretical study of the structural, electronics and optical properties allowed us to understand the chemical changes that the ligand undergoes in the complexation process with the Cu+2 ion.

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