Integrating stereolithography and direct print technologies for 3D structural electronics fabrication

2012 ◽  
Vol 18 (2) ◽  
pp. 129-143 ◽  
Author(s):  
Amit Joe Lopes ◽  
Eric MacDonald ◽  
Ryan B. Wicker
Keyword(s):  
Structural Electronics ◽  
3D Structural Electronics

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
David A. Roberson ◽  
Ryan B. Wicker ◽  
Eric MacDonald
Keyword(s):  
Selection Process ◽  
Three Dimensional ◽  
Processing Parameters ◽  
Substrate Material ◽  
Direct Write ◽  
Conductive Inks ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Substrate Resistance ◽  
Polymeric Substrates

Ohmic curing was utilized as a method to improve the conductivity of three-dimensional (3D) interconnects printed from silver-loaded conductive inks and pastes. The goal was to increase conductivity of the conductive path without inducing damage to the substrate. The 3D via/interconnect structure was routed within 3D polymeric substrates and had external and internal sections. The 3D structures were created by the additive manufacturing (AM) process of stereolithography (SL) and were designed to replicate manufacturing situations which are common in the fabrication of 3D structural electronics that involve a combination of AM and direct write (DW) processing steps. The photocurable resins the 3D substrates were made of possessed glass transition temperatures of 75 °C and 42 °C meaning that a nonthermal method to increase the conductivity of the printed traces was needed as the conductive inks tested in this study required oven cure temperatures greater than 100 °C to perform properly. Ohmic curing was shown to decrease the measured resistance of the via/interconnect structure without harming the substrate. Substrate damage was observed on thermally cured samples and was characterized by discoloration and scaling of the substrate. Resistance measurements of the via/interconnect structures revealed samples cured by the ohmic curing process performed equal or better than samples subjected to thermal curing. The work presented here demonstrates a method to overcome the thermal cure temperature limitations of polymeric substrates imposed on the processing parameters of conductive inks during the fabrication of 3D structural electronics and presents an example of overcoming a manufacturing process problem associated with this emerging technology. An ink selection process involving characterization of the compatibility of inks with the substrate material and the use of different inks for the via and interconnect sections was also discussed.

Development of Direct Printing/Curing Process for 3D Structural Electronics

2013 ◽  
Author(s):  
Yanfeng Lu ◽  
Morteza Vatani ◽  
Ho-Chan Kim ◽  
Rae-Chan Lee ◽  
Jae-Won Choi
Keyword(s):  
Tool Path ◽  
Electronic Circuit ◽  
3D Structure ◽  
Radiation Energy ◽  
New Paradigm ◽  
Direct Printing ◽  
Pick And Place ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Electrical Components

3D structural electronics is a new paradigm in fabricating electronics with high design complexity. Basically, manufacturing of 3D structural electronics consists of several processes: structure building, wire creation, and pick-and-place of electrical components. In this work, a 3D structure was built in a commercial AM machine, and conductive wires were created on the 3D structure with a predetermined design of an electronic circuit. Generally, 2D wire paths are projected to a 3D surface, and a tool path for the wire is generated in advance. And a direct printing device follows the tool path to draw the conductive wires on the surface, while a direct curing device simultaneously hardens the created wires using thermal/radiation energy. This direct printing/curing device was developed by combining a micro-dispensing device and a light focusing module installed in a motorized xyz stage. Several experiments were accomplished using photocrosslinkable materials filled with carbon nanotubes (CNTs). Finally, a 3D electronics prototype was fabricated to show the compelling evidence that the suggested manufacturing methods and materials would be promising in manufacturing 3D structural electronics.

scholarly journals Laser curing of silver-based conductive inks for in situ 3D structural electronics fabrication in stereolithography

2014 ◽  
Vol 214 (9) ◽  
pp. 1935-1945 ◽  
Author(s):  
Amit J. Lopes ◽  
In Hwan Lee ◽  
Eric MacDonald ◽  
Rolando Quintana ◽  
Ryan Wicker
Keyword(s):  
Conductive Inks ◽  
Structural Electronics ◽  
3D Structural Electronics ◽  
Laser Curing

scholarly journals Carbon Nanotube-Based Composite Filaments for 3D Printing of Structural and Conductive Elements

2021 ◽  
Vol 11 (3) ◽  
pp. 1272
Author(s):  
Bartłomiej Podsiadły ◽  
Piotr Matuszewski ◽  
Andrzej Skalski ◽  
Marcin Słoma
Keyword(s):  
Carbon Nanotubes ◽  
Fused Deposition Modeling ◽  
Supply Voltage ◽  
Acrylonitrile Butadiene Styrene ◽  
Structural Elements ◽  
Filling Fraction ◽  
Fused Deposition ◽  
Structural Electronics ◽  
Measured Sample ◽  
Deposition Modeling

In this publication, we describe the process of fabrication and the analysis of the properties of nanocomposite filaments based on carbon nanotubes and acrylonitrile butadiene styrene (ABS) polymer for fused deposition modeling (FDM) additive manufacturing. Polymer granulate was mixed and extruded with a filling fraction of 0.99, 1.96, 4.76, 9.09 wt.% of CNTs (carbon nanotubes) to fabricate composite filaments with a diameter of 1.75 mm. Detailed mechanical and electrical investigations of printed test samples were performed. The results demonstrate that CNT content has a significant influence on mechanical properties and electrical conductivity of printed samples. Printed samples obtained from high CNT content composites exhibited an improvement in the tensile strength by 12.6%. Measurements of nanocomposites’ electrical properties exhibited non-linear relation between the supply voltage and measured sample resistivity. This effect can be attributed to the semiconductor nature of the CNT functional phase and the occurrence of a tunnelling effect in percolation network. Detailed I–V characteristics related to the amount of CNTs in the composite and the supply voltage influence are also presented. At a constant voltage value, the average resistivity of the printed elements is 2.5 Ωm for 4.76 wt.% CNT and 0.15 Ωm for 9.09 wt.% CNT, respectively. These results demonstrate that ABS/CNT composites are a promising functional material for FDM additive fabrication of structural elements, but also structural electronics and sensors.

Structural, electronics and optical properties of sodium based fluoroperovskites NaXF3 (X = Ca, Mg, Sr and Zn): First principles calculations

2021 ◽  
pp. 127574
Author(s):  
Mohammad Reda Kabli ◽  
Jalil ur Rehman ◽  
M. Bilal Tahir ◽  
Muhammad Usman ◽  
Arshid Mahmood Ali ◽  
...  
Keyword(s):  
Optical Properties ◽  
First Principles ◽  
First Principles Calculations ◽  
Structural Electronics

scholarly journals Soldering of Electronics Components on 3D-Printed Conductive Substrates

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 3850
Author(s):  
Bartłomiej Podsiadły ◽  
Andrzej Skalski ◽  
Marcin Słoma
Keyword(s):  
Additive Manufacturing ◽  
Solder Joints ◽  
Rapid Development ◽  
Surface Preparation ◽  
Contact Angles ◽  
Electronic Components ◽  
Optimal Method ◽  
Structural Electronics ◽  
3D Printed ◽  
Composite Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical components with these techniques. One way to produce complex structural electronic circuits is to merge 3D-printed elements with standard electronic components. Here, different soldering and surface preparation methods before soldering are tested to find the optimal method for soldering typical electronic components on conductive, 3D-printed, composite substrates. To determine the optimal soldering condition, the contact angles of solder joints fabricated in different conditions were measured. Additionally, the mechanical strength of the joints was measured using the shear force test. The research shows a possibility of fabricating strong, conductive solder joints on composites substrates prepared by additive manufacturing. The results show that mechanical cleaning and using additional flux on the composite substrates are necessary to obtain high-quality solder joints. The most repeatable joints with the highest shear strength values were obtained using reflow soldering together with low-temperature SnBiAg solder alloy. A fabricated demonstrator is a sample of the successful merging of 3D-printed structural electronics with standard electronic components.

Photonic curing of silver paths on 3D printed polymer substrate

Circuit World ◽  
2019 ◽  
Vol 45 (1) ◽  
pp. 9-14
Author(s):  
Jakub Krzeminski ◽  
Bartosz Blicharz ◽  
Andrzej Skalski ◽  
Grzegorz Wroblewski ◽  
Małgorzata Jakubowska ◽  
...  
Keyword(s):  
Polymer Substrate ◽  
Fused Deposition Modelling ◽  
Content Type ◽  
Fused Deposition ◽  
Photonic Curing ◽  
Structural Electronics ◽  
Jet Printing ◽  
3D Printed ◽  
Aerosol Jet Printing ◽  
Photonic Sintering

Purpose Despite almost limitless possibilities of rapid prototyping, the idea of 3D printed fully functional electronic device still has not been fulfilled – the missing point is a highly conductive material suitable for this technique. The purpose of this paper is to present the usage of the photonic curing process for sintering highly conductive paths printed on the polymer substrate. Design/methodology/approach This paper evaluates two photonic curing processes for the conductive network formulation during the additive manufacturing process. Along with the xenon flash sintering for aerosol jet-printed paths, this paper examines rapid infrared sintering for thick-film and direct write techniques. Findings This paper proves that the combination of fused deposition modeling, aerosol jet printing or paste deposition, along with photonic sintering, is suitable to obtain elements with low resistivity of 3,75·10−8 Ωm. Presented outcomes suggest the solution for fabrication of the structural electronics systems for daily-use applications. Originality/value The combination of fused deposition modelling (FDM) and aerosol jet printing or paste deposition used with photonic sintering process can fill the missing point for highly conductive materials for structural electronics.

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