Impact of the Si Content on the Electrical Properties of NiSi$_{{x}}$Ge$_{\text{1}-{x}}$ Source/Drain Contact Metal for Ge pMOSFETs

Author(s):  
Siyu Zeng ◽  
Yu Li ◽  
Rui Zhang
2005 ◽  
Vol 2 (2) ◽  
pp. 260-265
Author(s):  
Baghdad Science Journal

Been manufacturing detector Altosalih optical pattern contact metal semiconductor through deposition poles of aluminum metal on the chips of crystal cadmium Tleraad (CdTe) with directional [111] and growing with laboratory and annealed at a temperature 80c for 30 minutes and eat Study of some electrical properties nailed and scoutNmadj ??????? copper with non ??????? models to see effect Alichoab well research deals impact Alichoab and frequency detector resistance


1990 ◽  
Vol 181 ◽  
Author(s):  
M. Eizenberg

ABSTRACTControlled modifications in the electrical properties of metal/GaAs junctions were obtaind by a few different approaches. The first approach is based on modifications induced by solid state reactions occurring between the metal and GaAs substrate, resulting in compound formation and component redistribution. The characteristics of such contacts can further be modified when the contact metal is alloyed with another metal or with a dopant. The second approach is based on modifying the doping level of the near surface region of the GaAs. Here an enhancement of the barrier height was obtained by heavily counter doping the top GaAs region by recoil implantation of Mg from a Mg thin film irradiated by As− ions. The correlations between the electrical properties of the junctions and the physical processes taking place using the above mentioned approaches are discussed.


2016 ◽  
Vol 682 ◽  
pp. 138-142
Author(s):  
Beata Smyrak ◽  
Marek Gniełczyk ◽  
Bartosz Jurkiewicz ◽  
Tadeusz Knych ◽  
Kinga Korzeń ◽  
...  

The subject of the work focuses on hardened-precipitation type alloys Al-Mg-Si which constitute the primary component material used to build homogeneous electric wires, type AAAC (All Aluminium Alloy Conductor). The material in consideration is a well-known and well-studied alloy, particularly in terms of the possibilities for using it in thermal treatment processes. However, the subject literature does not present a comprehensive recognition of the effect of heat treatment parameters on the set of mechanical and electrical properties in wires grade 6101. In particular, the study presents the results of experiments that show the possibility of controlling the AlMgSi wire properties by means of selecting the heat treatment parameters for simultaneously obtaining a high tensile strength and high electrical conductivity. Hence, the research described in this paper focuses mostly on determining the impact of the Mg and Si content on the electrical and mechanical properties of wires of Al-Mg-Si wire alloys.


Author(s):  
F. M. Ross ◽  
R. Hull ◽  
D. Bahnck ◽  
J. C. Bean ◽  
L. J. Peticolas ◽  
...  

We describe an investigation of the electrical properties of interfacial dislocations in strained layer heterostructures. We have been measuring both the structural and electrical characteristics of strained layer p-n junction diodes simultaneously in a transmission electron microscope, enabling us to correlate changes in the electrical characteristics of a device with the formation of dislocations.The presence of dislocations within an electronic device is known to degrade the device performance. This degradation is of increasing significance in the design and processing of novel strained layer devices which may require layer thicknesses above the critical thickness (hc), where it is energetically favourable for the layers to relax by the formation of misfit dislocations at the strained interfaces. In order to quantify how device performance is affected when relaxation occurs we have therefore been investigating the electrical properties of dislocations at the p-n junction in Si/GeSi diodes.


Author(s):  
A.M. Letsoalo ◽  
M.E. Lee ◽  
E.O. de Neijs

Semiconductor devices require metal contacts for efficient collection of electrical charge. The physics of these metal/semiconductor contacts assumes perfect, abrupt and continuous interfaces between the layers. However, in practice these layers are neither continuous nor abrupt due to poor nucleation conditions and the formation of interfacial layers. The effects of layer thickness, deposition rate and substrate stoichiometry have been previously reported. In this work we will compare the effects of a single deposition technique and multiple depositions on the morphology of indium layers grown on (100) CdTe substrates. The electrical characteristics and specific resistivities of the indium contacts were measured, and their relationships with indium layer morphologies were established.Semi-insulating (100) CdTe samples were cut from Bridgman grown single crystal ingots. The surface of the as-cut slices were mechanically polished using 5μm, 3μm, 1μm and 0,25μm diamond abrasive respectively. This was followed by two minutes immersion in a 5% bromine-methanol solution.


Author(s):  
J.P.S. Hanjra

Tin mono selenide (SnSe) with an energy gap of about 1 eV is a potential material for photovoltaic applications. Various authors have studied the structure, electronic and photoelectronic properties of thin films of SnSe grown by various deposition techniques. However, for practical photovoltaic junctions the electrical properties of SnSe films need improvement. We have carried out investigations into the properties of flash evaporated SnSe films. In this paper we report our results on the structure, which plays a dominant role on the electrical properties of thin films by TEM, SEM, and electron diffraction (ED).Thin films of SnSe were deposited by flash evaporation of SnSe fine powder prepared from high purity Sn and Se, onto glass, mica and KCl substrates in a vacuum of 2Ø micro Torr. A 15% HF + 2Ø% HNO3 solution was used to detach SnSe film from the glass and mica substrates whereas the film deposited on KCl substrate was floated over an ethanol water mixture by dissolution of KCl. The floating films were picked up on the grids for their EM analysis.


Physica ◽  
1954 ◽  
Vol 3 (7-12) ◽  
pp. 834-844 ◽  
Author(s):  
H FRITZSCHE ◽  
K LARKHOROVITZ

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