CMOS-compatible GaN HEMT on 200mm Si-substrate for RF application

Author(s):  
Po-Chun Yeh ◽  
Po-Tsung Tu ◽  
Hsueh-Hsing Liu ◽  
Chien-Hua Hsu ◽  
Hsin-Yun Yang ◽  
...  
2015 ◽  
Author(s):  
D.H. Kim ◽  
M.J. Kang ◽  
S.K. Eom ◽  
H.Y. Cha ◽  
K.S. Seo

2013 ◽  
Vol 805-806 ◽  
pp. 948-953
Author(s):  
Cen Kong ◽  
Jian Jun Zhou ◽  
Jin Yu Ni ◽  
Yue Chan Kong ◽  
Tang Sheng Chen

GaN high electronic mobility transistor (HEMT) was fabricated on silicon substrate. A breakdown voltage of 800V was obtained without using field plate technology. The fabrication processes were compatible with the conventional GaN HEMTs fabrication processes. The length between drain and gate (Lgd) has a greater impact on breakdown voltage of the device. A breakdown voltage of 800V with maximum current density of 536 mA/mm was obtained while Lgd was 15μm and the Wg was 100μm. The specific on-state resistance of this devices was 1.75 mΩ·cm2, which was 85 times lower than that of silicon MOSFET with same breakdown voltage. The results establish the foundation of low cost GaN HEMT power electronic devices.


2010 ◽  
Vol 46 (14) ◽  
pp. 1011 ◽  
Author(s):  
J. Park ◽  
K. Lee ◽  
H.-Y. Cha ◽  
K. Seo

Author(s):  
Toshihide Kikkawa ◽  
Tsutomu Hosoda ◽  
Shinichi Akiyama ◽  
Yoshiyuki Kotani ◽  
Toshihiro Wakabayashi ◽  
...  
Keyword(s):  

2006 ◽  
Vol 27 (1) ◽  
pp. 7-9 ◽  
Author(s):  
D. Ducatteau ◽  
A. Minko ◽  
V. Hoel ◽  
E. Morvan ◽  
E. Delos ◽  
...  

2004 ◽  
Vol 14 (03) ◽  
pp. 785-790 ◽  
Author(s):  
M. NEUBURGER ◽  
T. ZIMMERMANN ◽  
E. KOHN ◽  
A. DADGAR ◽  
F. SCHULZE ◽  
...  

InAlN has been investigated as barrier layer material for GaN -HEMT structures, potentially offering higher sheet charge densities [1] and higher breakdown fields [2]. Lattice matched growth of the barrier layer can be achieved with 17 % In content, avoiding piezo polarization. In this configuration the sheet charge density is only induced by spontaneous polarization. First experimental results of unpassivated undoped samples realized on 111- Si substrate exceed a DC output current density of 1.8 A/mm for a gate length of 0.5 μm. Small signal measurements yield a f t = 26 GHz and f max = 14 GHz , still limited by the residual conductivity of the Si -substrate. A saturated output power at 2 GHz in class A bias point yielded a density of 4.1 W/mm at V DS = 24 V .


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