Ion Milling Method for Revealing the HgCdTe MBE-grown Structure

Author(s):  
Malgorzata Pociask-Bialy
Author(s):  
Natsuko Asano ◽  
Tamae Omoto ◽  
Jinfeng Lu ◽  
Hirobumi Morita ◽  
Natasha Erdman ◽  
...  

Abstract Understanding solder joints is very important for failure analysis in semiconductor manufacturing because it is commonly used for mounting semiconductor devices on boards. However, regarding sample preparation for analysis, solder poses challenges in crosssection preparation due to the differences in melting point and hardness of its constituents. Therefore, precision cutting methods such as ion milling are required. On the other hand, ion milling method usually causes thermal damage during cutting. In this paper, we tried to optimize the sample temperature during Ar ion milling using liquid nitrogen cooling [1].


2010 ◽  
Vol 18 (3) ◽  
Author(s):  
M.M. Pociask

AbstractOf many techniques used to characterize quality of HgCdTe, ion milling is emerging as a unique means to reveal electrically active and neutral defects and complexes. Ion milling is capable of strongly affecting electrical properties of HgCdTe, up to conductivity type conversion in p-type material. It appears, that strongly non-equilibrium processes which take place under ion milling, when material is oversaturated with mercury interstitial atoms generated near a surface, lead to formation of specific defect complexes, which may not form under other type of treatment. By measuring parameters of a crystal before and after milling, and following disintegration of defects with time after ion milling (’relaxation’), one can detect and identify these defects. This method was applied to analyse different samples grown by molecular beam epitaxy.


2013 ◽  
Vol 19 (S2) ◽  
pp. 898-899
Author(s):  
T. Shdiara ◽  
M. Konomi ◽  
S. Watanabe

Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.


1997 ◽  
Vol 480 ◽  
Author(s):  
T. Kouzaki ◽  
K. Yoshioka ◽  
E. Ohno

AbstractIt is very difficult to prepare cross-sectional TEM samples for phase-change optical disks by conventional argon ion milling because of the difference of ion milling rates between multilayers and the polymer substrate. We have been successful in preparing samples of those optical disks by ion milling method with dissolution of the polymer substrate in advance. The cross-sectional structure was observed more clearly in this method rather than in ultramicrotome method.


2017 ◽  
Vol 28 (50) ◽  
pp. 505702
Author(s):  
Jae Min Sohn ◽  
Hyungsang Kim ◽  
Hyunsik Im ◽  
Hyungbae Kim ◽  
Juwon Lee ◽  
...  

2009 ◽  
Vol 23 (17) ◽  
pp. 3492-3496
Author(s):  
SEONG GU KANG ◽  
JUN-KI CHUNG ◽  
SUNG CHANG PARK ◽  
DAE GIL JEONG ◽  
CHEOL JIN KIM

The microstructure of the MgB 2 wires with hydrocarbon, pyrene (C16H10) addition has been investigated by transmission electron microscopy (TEM) equipped with energy-dispersive X-ray spectroscopy (EDX). In our study, MgB 2 wires have been fabricated through powder-in-tube (PIT) process using pure Fe as sheath material and sintered at 600°C ~800°C for 30min to 4 hrs under high purity argon gas. TEM and EDS analyses were conducted on the specimens prepared by tripod polishing and ion milling method. The structural features such as second phases, interface and defects were investigated by electron microscopy.


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