Effect of Filling Ratio and Tilt Angle on the Performance of a Mini-Loop Thermosyphon

2019 ◽  
Vol 11 (6) ◽  
Author(s):  
Trijo Tharayil ◽  
Neha Gitty ◽  
Lazarus Godson Asirvatham ◽  
Somchai Wongwises
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Wall Temperature ◽  
Tilt Angle ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Filling Ratio ◽  
Average Decrease ◽  
Heat Loads

The thermal behavior of a compact mini-loop thermosyphon is experimentally studied at different filling ratios (20%, 30%, 40%, 50%, and 70%) and tilt angles (0 deg, 30 deg, 45 deg, 60 deg, and 90 deg) for the heat loads of 20–300 W using distilled water as the heat pipe fluid. The presence of microfins at the evaporator results in an average decrease of 37.4% and 15.3% in thermal resistance and evaporator wall temperature, respectively, compared with the evaporator with a plain surface. Both filling ratio (FR) and tilt angle influence the heat transfer performance significantly, and the best performance of the mini-loop thermosyphon is obtained at their optimum values. The thermal resistance and thermal efficiency values lie in the ranges of 0.73–0.076 K/W and 65–88.3% for different filling ratios and tilt angles. Similarly, evaporator heat transfer coefficient and evaporator wall temperature show significant variation with changes in filling ratio and tilt angle. A combination of the optimum filling ratio and tilt angle shows a lowest thermal resistance of 0.076 K/W and a highest evaporator wall temperature of 68.6 °C, which are obtained at 300 W. The experimental results recommend the use of mini-loop thermosyphon at an optimum filling ratio for electronics cooling applications, which have a heat dissipation of 20–300 W.

Experimental Study on Heat Transfer Performance of Pulsating Heat Pipe CPU Radiator

2019 ◽  
Author(s):  
Fu-Min Shang ◽  
Qing-Jing Yang ◽  
Jian-Hong Liu
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Wall Temperature ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Structural Characteristics ◽  
Hot Water ◽  
Transfer Performance ◽  
Pulsating Heat Pipe

Abstract According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.

Experimental Study on Heat Pipe Radiator in Cooling Electronic Apparatus

2012 ◽  
Vol 197 ◽  
pp. 216-220
Author(s):  
Zhong Chao Zhao ◽  
Rui Ye ◽  
Gen Ming Zhou
Keyword(s):  
Heat Transfer ◽  
Experimental Study ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Transfer Performance ◽  
Air Velocity ◽  
Electronic Apparatus ◽  
Operational Temperature

To solve the cooling problem in modern electronic device, a kind of heat pipe radiator was designed and manufactured in this paper. The heat transfer performance of heat pipe radiator and its relationship with air velocity were investigated by experimental method. The experimental results show that the heat pipe radiator can meet the temperature requirement of electronic device with the power range from 40W to 160W. To keep the operational temperature of electronic device with power of 160W under 75°C，the air velocity should be keep at 1.7m/s. The heat dissipation performance of heat pipe radiator was enhanced with the air velocity increased from 0.2m/s to 1.7m/s.for the electronic equipment with power of 160W.

scholarly journals Simulation analysis of heat transfer performance of heat sink with reduced material design

2020 ◽  
Vol 12 (5) ◽  
pp. 168781402092130
Author(s):  
Ya-Chu Chang
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Local Heating ◽  
Transfer Performance ◽  
Electronic Components ◽  
Thermal Reliability

The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

scholarly journals Numerical Study on Heat Transfer Performance in Packed Bed

Energies ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 414 ◽  
Author(s):  
Shicheng Wang ◽  
Chenyi Xu ◽  
Wei Liu ◽  
Zhichun Liu
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Transfer Process ◽  
Heat Transfer Performance ◽  
Numerical Study ◽  
Continuous Phase ◽  
Heat Transfer Process ◽  
Packed Beds ◽  
Transfer Performance ◽  
Entransy Dissipation

Packed beds are widely used in industries and it is of great significance to enhance the heat transfer between gas and solid states inside the bed. In this paper, numerical simulation method is adopted to investigate the heat transfer principle in the bed at particle scale, and to develop the direct enhanced heat transfer methods in packed beds. The gas is treated as continuous phase and solved by Computational Fluid Dynamics (CFD), while the particles are treated as discrete phase and solved by the Discrete Element Method (DEM); taking entransy dissipation to evaluate the heat transfer process. Considering the overall performance and entransy dissipation, the results show that, compared with the uniform particle size distribution, radial distribution of multiparticle size can effectively improve the heat transfer performance because it optimizes the velocity and temperature field, reduces the equivalent thermal resistance of convection heat transfer process, and the temperature of outlet gas increases significantly, which indicates the heat quality of the gas has been greatly improved. The increase in distribution thickness obviously enhances heat transfer performance without reducing the equivalent thermal resistance in the bed. The result is of great importance for guiding practical engineering applications.

scholarly journals Experiment Study on Improved Closed Loop Pulsating Heat Pipe with Silver/Water Nanofluid

2013 ◽  
Vol 732-733 ◽  
pp. 462-466
Author(s):  
Wei Xiu Shi ◽  
Wei Yi Li ◽  
Li Sheng Pan
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Closed Loop ◽  
Filling Ratio ◽  
Pulsating Heat Pipe ◽  
Start Up ◽  
High Heating ◽  
Operation Stability ◽  
Heat Transfer Limit

Start up and heat transfer performances of improved closed loop pulsating heat pipe (ICLPHP) charged with water and silver/water nanofluid, respectively, were investigated experimentally with angles of 90° and 60°. Both the average evaporator wall temperature and the overall thermal resistance of the ICLPHP with different working fluids and at the volume filling ratio of 35% were tested and compared. Experimental results showed that nanofluid caused different thermal performances of ICLPHP. Within the experiment range, silver/water nanofluid can improve operation stability and heat transfer limit and reduce starting power compared with water. With high heating power, thermal resistance of nanofluid was lower than that of water. With inclination of 60°, ICLPHP with nanofluid operated better and reduced sensitivity of inclination.

Experimental Investigation of Heat Transfer of Refrigerant Fluid Pulsating Heat Pipe

2017 ◽  
Vol 865 ◽  
pp. 137-142
Author(s):  
Somchai Maneewan ◽  
Chantana Punlek ◽  
Hoy Yen Chan ◽  
Atthakorn Thongtha
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Temperature Difference ◽  
Heat Input ◽  
Filling Ratio ◽  
Working Fluid ◽  
Pulsating Heat Pipe ◽  
Filling Volume ◽  
Volume Filling

Heat transfer performances of a pulsating heat pipe (PHP) having internal and external diameter with 4.5 mm and 6 mm with various contents of refrigerant are experimentally investigated. The working fluid as R404A refrigerant was filled in the volume ratios from 0% to 80% and the heat input was controlled in the range from 10 W to 80 W. Obtained results exhibited the ability of R404A refrigerant can enhance the thermal performance in steady state condition. The average temperature difference of the evaporating section and condensing section in the 80% filling volume ratio decreased from 9.5 °C to 2.5 °C when the heating power increase from 10 W to 80 W. The thermal resistance of evaporator and condenser decreased with an increase of the heat input as well. For other filling volume ratios, the trend of temperature difference and thermal resistance was similar to that of the 80% volume filling ratio. Considering the same heat input, the highest heat transfer performance was found at the 80% volume filling ratio. Refrigerant with a relatively low dynamic consistency can lead to relatively high velocity in the PHP that can reduce the temperature difference between the evaporating section and condensing section.

scholarly journals Thermal performance prediction of heat pipe with TiO2 nanofluids using RSM

2021 ◽  
pp. 199-199
Author(s):  
Lakshmi Reddy ◽  
Srinivasa Bayyapureddy Reddy ◽  
Kakumani Govindarajulu
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Thermal Resistance ◽  
Transfer Coefficient ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Tilt Angle ◽  
Heat Load ◽  
Maximum Heat ◽  
Maximum Heat Transfer

Heat pipe is a two phase heat transfer device with high effective thermal conductivity and transfer huge amount of heat with minimum temperature gradient in between evaporator and condenser section. This paper objective is to predict the thermal performance in terms of thermal resistance (R) and heat transfer coefficient (h) of screen mesh wick heat pipe with DI water-TiO2 as working fluid. The input process parameters of heat pipe such as heat load (Q), tilt angle (?) and concentration of nanofluid (?) were modeled and optimized by utilizing Response Surface Methodology (RSM) with MiniTab-17 software to attain minimum thermal resistance and maximum heat transfer coefficient. The minimum thermal resistance of 0.1764 0C/W and maximum heat transfer coefficient of 1411.52 W/m2 0C was obtained under the optimized conditions of 200 W heat load, 57.20 tilt angle and 0.159 vol. % concentration of nano-fluid.

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