An Integrated Reservoir for On-Chip Aqueous Storage in Microfluidic Systems

1999 ◽  
Author(s):  
Manoj Patel ◽  
H. Thurman Henderson ◽  
Shekhar Bhansali ◽  
Chong H. Ahn
Keyword(s):  
Contact Surface ◽  
Lab On A Chip ◽  
Pressure Head ◽  
Microfluidic System ◽  
Design Issues ◽  
Microfluidic Systems ◽  
Initial Characterization ◽  
On Chip ◽  
Silicon Based

Abstract A reservoir for a silicon-based “lab-on-a-chip” integrated microfluidic system has been designed, fabricated and initially characterized. The reservoirs are necessary for storing reagents, antibodies and buffers required for on-chip capture of target microorganisms in this work. Aside from the matter of storing fluids and providing a pressure head for flow or flow augmentation one has the issue of biochemical compatibility of the contact surface. Where one does not desire a pressure head, a mere bio-chemically compatible “collapsible” bag is desired. All these factors are included in the device. This paper reports design issues, fabrication, packaging and initial characterization of the reservoirs. Scaling possibilities are essentially unlimited, however in this case standard reservoirs have been developed in modules of 1/8 and 1 ml capacity.

Development of Planar Microfluidic Systems Using Conventional and Low Temperature Assembling Schemes for Components

1999 ◽  
Author(s):  
Nihat Okulan ◽  
Shekhar Bhansali ◽  
Arum Han ◽  
Saman Dharmatilleke ◽  
Jin-Woo Choi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Electrochemical Detection ◽  
Biochemical Analysis ◽  
Magnetic Particle ◽  
Lab On A Chip ◽  
Microfluidic System ◽  
Microfluidic Systems ◽  
Detection Techniques

Abstract This center is currently working on the development of a remotely accessible generic microfluidic system (“lab on a chip”) for biological and biochemical analysis, based on electrochemical detection techniques. Modular microfluidic components, including micro reservoirs, microvalves, micropumps, filterless magnetic particle separators, biosensors and flowsensors, were fabricated and tested, and integrated on a system motherboard. Other air-to-liquid measurand concentrators and integrated sieve/filters are being explored in related efforts. The fabrication of these microfluidic components and the utilization of wax for low temperature assembly and even bonding is discussed.

Vacuum pouch microfluidic system and its application for thin-film micromixers

Lab on a Chip ◽  
2019 ◽  
Vol 19 (17) ◽  
pp. 2834-2843 ◽  
Author(s):  
Cheng-Je Lee ◽  
Yu-Hsiang Hsu
Keyword(s):  
Thin Film ◽  
Lab On A Chip ◽  
Microfluidic System ◽  
System A ◽  
New Type ◽  
On Chip

Vacuum pouch microfluidic system: a new type of lab-on-a-chip device that uses an on-chip vacuum pouch to drive a thin-film micromixer with a wide operation range.

scholarly journals High-Efficiency and High-Throughput On-Chip Exchange of the Continuous Phase in Droplet Microfluidic Systems

2017 ◽  
Vol 22 (5) ◽  
pp. 529-535 ◽  
Author(s):  
Minkyu Kim ◽  
Chia Min Leong ◽  
Ming Pan ◽  
Lucas R. Blauch ◽  
Sindy K. Y. Tang
Keyword(s):  
High Throughput ◽  
Continuous Flow ◽  
High Efficiency ◽  
Scale Up ◽  
Continuous Phase ◽  
Microfluidic System ◽  
Droplet Surface ◽  
Generation Process ◽  
Microfluidic Systems ◽  
On Chip

This article describes an integrated platform for the on-chip exchange of the continuous phase in droplet microfluidic systems. The drops used in this work are stabilized by amphiphilic nanoparticles. For some characterizations and applications of these nanoparticle-stabilized drops, including the measurement of adsorption dynamics of nanoparticles to the droplet surface, it is necessary to change the composition of the continuous phase from that used during the droplet generation process. Thus far, no work has reported the exchange of the continuous phase for a large number (>1 million) of drops in a microfluidic system. This article describes the design and characterization of a high-efficiency and high-throughput on-chip exchanger of the continuous phase in a continuous-flow droplet microfluidic system. The efficiency of exchange was higher than 97%. The throughput was greater than 1 million drops/min, and this can be increased further by increasing the number of parallel exchangers used. Because drops are injected into the exchanger in a continuous-flow manner, the method is directly compatible with automation to further increase its reliability and potential scale-up.

Silicon-Based Lab-on-Chip Device for Acoustic Focusing Applications

2014 ◽  
Author(s):  
Kamran Moradi ◽  
Bilal El-Zahab
Keyword(s):  
Microfluidic Devices ◽  
Acoustic Resonator ◽  
Continuous Method ◽  
Particle Manipulation ◽  
Microfluidic Systems ◽  
Channel Geometry ◽  
Lab On Chip ◽  
Acoustic Focusing ◽  
On Chip ◽  
Silicon Based

Acoustic focusing and separations is a growing field of research since it is an efficient and continuous method for particle manipulation in microfluidic systems. Using microfabrication, microfluidic devices driven by an acoustic resonator were used to focus various microparticle suspensions. By simple tuning of frequency, amplitude, and channel geometry, controllable focusing patterns and alignments were obtained. This approach afforded the separation of particles of contrasting sizes, shapes, densities, porosities, and compressibilities. In this study we present the method for the fabrication of these lab-on-chip devices and report on their performance in the manipulation of microsized particles.

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

1999 ◽  
Author(s):  
V. H. Adams ◽  
K. Ramakrishna
Keyword(s):  
Heat Source ◽  
Heat Generation ◽  
Thermal Characterization ◽  
Electronic Packages ◽  
Heat Sources ◽  
Discrete Heat Sources ◽  
Uniform Heat ◽  
On Chip ◽  
Silicon Based

Abstract Simulations for thermal characterization of electronic packages for silicon-based integrated circuit (IC) components typically assume one of the two uniform heat generation conditions. They are: (1) an isoflux condition in which heat generation is uniformly distributed over the active surface of the die, or (2) a uniform heat generation over the entire (or active) volume of the die. The use of these models may be justified due to high thermal conductivity of silicon, size of the devices on the die, and their relatively uniform spatial distribution over the entire surface of the die in the traditional silicon technologies. However, the current and future technologies are migrating towards embedded systems solutions, such as system-on-chip, and in traditional applications devices are brought in close proximity to each other for improved on-chip electrical performance. These trends result in localized regions of power dissipation on the die that would invalidate the use of traditional uniform generation models in the thermal characterization. The present study examines the effect of discrete heat sources (as opposed to uniformly distributed sources) on the die on thermal performance and characterization of the electronic packages. For this purpose, a conjugate heat transfer problem of a memory chip in a 119 I/O flip chip ceramic and plastic ball grid array (FC-C & PBGA) package under natural and forced convection conditions. First the model is validated against experimentally measured thermal data on a 119 I/O FC-C & P BGA daisy-chain test packages with a thermal test die with uniformly distributed resistive heat source. Junction-to-ambient temperature difference predictions from the simulations are within 10% of the measurements for the uniform heating case. The validated model is then suitably modified to account for discrete heat sources and actual substrates. Results from the discrete heat sources study show a 15–20% increase in predicted junction-to-ambient temperature difference and a larger (a 10–15 °C) temperature variation across the active face of the die than for with a uniform heat source. These results call for the use of discrete heat sources in the thermal characterization of new generation of embedded silicon technologies. They also point to the need for development of test die and characterization methodologies for these technologies with discrete heat sources.

scholarly journals Design and Manufacturing of a Disposable, Cyclo-Olefin Copolymer, Microfluidic Device for a Biosensor †

Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1178 ◽  
Author(s):  
Jorge Prada ◽  
Christina Cordes ◽  
Carsten Harms ◽  
Walter Lang
Keyword(s):  
Microfluidic Device ◽  
Heating Temperature ◽  
Low Cost ◽  
Reaction Chamber ◽  
Microfluidic System ◽  
Heating Process ◽  
Design And Manufacturing ◽  
On Chip ◽  
Working Parameters ◽  
Auto Fluorescence

This contribution outlines the design and manufacturing of a microfluidic device implemented as a biosensor for retrieval and detection of bacteria RNA. The device is fully made of Cyclo-Olefin Copolymer (COC), which features low auto-fluorescence, biocompatibility and manufacturability by hot-embossing. The RNA retrieval was carried on after bacteria heat-lysis by an on-chip micro-heater, whose function was characterized at different working parameters. Carbon resistive temperature sensors were tested, characterized and printed on the biochip sealing film to monitor the heating process. Off-chip and on-chip processed RNA were hybridized with capture probes on the reaction chamber surface and identification was achieved by detection of fluorescence tags. The application of the mentioned techniques and materials proved to allow the development of low-cost, disposable albeit multi-functional microfluidic system, performing heating, temperature sensing and chemical reaction processes in the same device. By proving its effectiveness, this device contributes a reference to show the integration potential of fully thermoplastic devices in biosensor systems.

scholarly journals Identification and initial characterization of POLIII-driven transcripts by msRNA-sequencing.

RNA Biology ◽  
2021 ◽  
Author(s):  
Peter Zorn ◽  
Danny Misiak ◽  
Michael Gekle ◽  
Marcel Köhn
Keyword(s):  
Initial Characterization

scholarly journals Double-layer graphene on photonic crystal waveguide electro-absorption modulator with 12 GHz bandwidth

Nanophotonics ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 2377-2385 ◽  
Author(s):  
Zhao Cheng ◽  
Xiaolong Zhu ◽  
Michael Galili ◽  
Lars Hagedorn Frandsen ◽  
Hao Hu ◽  
...  
Keyword(s):  
Photonic Crystal ◽  
Double Layer ◽  
Slow Light ◽  
Modulation Depth ◽  
Photonic Crystal Waveguide ◽  
Optical Modulators ◽  
Layer Graphene ◽  
Silicon Photonic ◽  
On Chip ◽  
Silicon Based

AbstractGraphene has been widely used in silicon-based optical modulators for its ultra-broadband light absorption and ultrafast optoelectronic response. By incorporating graphene and slow-light silicon photonic crystal waveguide (PhCW), here we propose and experimentally demonstrate a unique double-layer graphene electro-absorption modulator in telecommunication applications. The modulator exhibits a modulation depth of 0.5 dB/μm with a bandwidth of 13.6 GHz, while graphene coverage length is only 1.2 μm in simulations. We also fabricated the graphene modulator on silicon platform, and the device achieved a modulation bandwidth at 12 GHz. The proposed graphene-PhCW modulator may have potentials in the applications of on-chip interconnections.

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