X-Ray Microtomography of Microcellular Polymers

2000 ◽  
Author(s):  
Ryszard Pyrz

Abstract Among modern measuring techniques, which are designed to reconstruct and to measure three-dimensional aspects of microstructure on mesoscopic scale lengths, the X-ray microtomography seems to be very well suited to yield this information. Generally, X-ray microtomography is the X-ray based non-destructive testing method that was first developed for medical purposes and only recently applied to materials characterization. Monitoring materials’ microstructure using X-ray microtomography allows reconstructing a three-dimensional image of the specimen from non-destructive, serial sections and processing it in order to visualize and measure three-dimensional features. Thus valuable information can be deduced from the correlation of measured stress and strain values with a number of internal geometrical parameters which cannot be measured at the specimen surface.

2016 ◽  
Vol 16 (4) ◽  
pp. 3583-3586 ◽  
Author(s):  
Jigang Wang ◽  
Shengcai Hao ◽  
Wenhua Zhou ◽  
Xiaokun Qi ◽  
Jilong Shi

Optical Non-Destructive Testing (ONDT) can be applied as penetrating elemental and structure analysis technology in the pigments identification field. Three-dimensional video microscopy, Raman microscopy and energy dispersive X-ray fluorescence spectroscopy are employed to measure the materials based on a Qing Dynasty meticulous painting. The results revealed that the dark yellow area within the decorative patterns was presented due to the interaction of Emerald green and hematite, and the bright yellow edge area was delineated by Cu–Zn–Pb composition. The interesting thing is that an artificial synthetic ultramarine blue was checked in the painting. According to the first synthesized time of ultramarine blue and Paris green, the time limit of the painting completion can be identified. The principle of Pigment subtractive colorant and nitikaset method were employed to interpreting the results. Optical testing combined with the area of cultural relic identification can be a potential method to build an expert identification system successfully. This work also help lay the optical method groundwork for further cultural relic identification, sterilization, and preservation.


Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.


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