Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

2000 ◽  
Author(s):  
Qizhou Yao ◽  
Jianmin Qu
Keyword(s):  
Surface Roughness ◽  
Fracture Mechanics ◽  
Interfacial Adhesion ◽  
Flip Chip ◽  
Interfacial Strength ◽  
Interface Roughness ◽  
Cohesive Failure ◽  
Mechanics Model ◽  
Polymer Metal ◽  
Metal Interfaces

Abstract This paper is concerned with the interfacial adhesion and failure of underfill materials in flip-chip packages. Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired to enhance the interfacial adhesion. Roughened surfaces generally produce more cohesive failure, therefore, are used commonly in practice to obtain better adhesion. In this paper a fracture mechanics model is developed that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer – metal interfaces.

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

2002 ◽  
Vol 124 (2) ◽  
pp. 127-134 ◽  
Author(s):  
Qizhou Yao ◽  
Jianmin Qu
Keyword(s):  
Surface Roughness ◽  
Fracture Mechanics ◽  
Electronic Packaging ◽  
Interfacial Adhesion ◽  
Interfacial Strength ◽  
Interface Roughness ◽  
Cohesive Failure ◽  
Mechanics Model ◽  
Polymer Metal ◽  
Metal Interfaces

Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired for enhancing the interfacial adhesion. Roughened surfaces generally produce more cohesive failure; therefore, they are used commonly in practice to obtain better adhesion. This paper develops a fracture mechanics model that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer–metal interfaces. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD.

The Competition between Adhesive and Cohesive Fracture at Amicro-Patterned Polymer-Metal Interface

2013 ◽  
Vol 577-578 ◽  
pp. 225-228 ◽  
Author(s):  
Olaf van der Sluis ◽  
Joris J.C. Remmers ◽  
M.A.C. Thurlings ◽  
B.J. Welling ◽  
Sander P.M. Noijen
Keyword(s):  
Crack Deflection ◽  
Surface Roughening ◽  
Adhesive Failure ◽  
Cohesive Failure ◽  
Metal Interface ◽  
Cohesive Fracture ◽  
Micro Patterning ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Point Bend

It is Common Practice for Polymer-Metal Interfaces, Frequently Encountered in Microelec-Tronic Devices, to Improve Adhesion by Surface Roughening or Micro-Patterning. the Competitionbetween Adhesive Fracture and Cohesive Fracture in the Vicinity of a Patterned Interface, i.e., Inter-Face Crack Deflection, is One of these Key Mechanisms that Contribute Significantly to the Macroscopicadhesion. in this Paper, these Fracture Phenomena are Described Simultaneously by Cohesive Zoneelements with an Exponential Traction-Separation Law (TSL) for the Adhesive Failure and an Initiallyrigid, Exponentially Decaying, TSL for the Cohesive Failure. it is Demonstrated that the Conditions Atwhich Crack Kinking Occurs are Dominated by Fracture Strength Values as Opposed to the Commonlyused Fracture Toughness Values. Experimental Verification is Performed by Means of Four Point Bend-Ing Tests on Specifically Designed Micro-Patterned Polymer-Metal Samples.

Interfaces and fatigue Damage in a Ti-15–3/SCS-6 [0/90]2s Composite

1996 ◽  
Vol 458 ◽  
Author(s):  
W. O. Soboyejo ◽  
B. Rabeeh ◽  
Y. Li ◽  
S. Rokhlin
Keyword(s):  
Fracture Mechanics ◽  
Fatigue Damage ◽  
Interfacial Strength ◽  
Fatigue Tests ◽  
Crack Bridging ◽  
Strength Variation ◽  
Mechanics Model ◽  
Initiation And Propagation ◽  
Push Out

AbstractThe key role of interfaces in the initiation and propagation of fatigue damage is elucidated for a model eight ply [0/90]2s Ti-15V-3Cr-3Al-3Sn (Ti-15–3) composite reinforced with SiC (SCS-6) fibers. Interfacial strengths obtained from fiber push-out tests are used in the quantification of shielding due to crack bridging. Composite fatigue tests are predicted using an idealized fracture mechanics model. The possible effects of interfacial strength variation on the predicted fatigue lives are also elucidated.

Experimental investigation and modelling of light scattering in a-Si:H solar cells deposited on glass/ZnO:Al substrates

2002 ◽  
Vol 715 ◽  
Author(s):  
J. Krc ◽  
M. Zeman ◽  
O. Kluth ◽  
F. Smole ◽  
M. Topic
Keyword(s):  
Surface Roughness ◽  
Experimental Investigation ◽  
Solar Cells ◽  
Angular Distribution ◽  
Light Scattering ◽  
Optical Model ◽  
Distribution Functions ◽  
Interface Roughness ◽  
Scattering Parameters ◽  
Good Agreement

AbstractThe descriptive scattering parameters, haze and angular distribution functions of textured ZnO:Al transparent conductive oxides with different surface roughness are measured. An approach to determine the scattering parameters of all internal interfaces in p-i-n a-Si:H solar cells deposited on the glass/ZnO:Al substrates is presented. Using the determined scattering parameters as the input parameters of the optical model, a good agreement between the measured and simulated quantum efficiencies of the p-i-n a-Si:H solar cells with different interface roughness is achieved.

A novel model of Z-pin insertion in prepreg based on fracture mechanics

2021 ◽  
pp. 095440542110144
Author(s):  
Guobiao Ji ◽  
Liang Cheng ◽  
Shaohua Fei ◽  
Jiangxiong Li ◽  
Yinglin Ke
Keyword(s):  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Analytical Model ◽  
Model Parameters ◽  
Force Model ◽  
Fe Model ◽  
Cohesive Elements ◽  
Fe Method ◽  
Insertion Force ◽  
Mechanics Model

Through-thickness reinforcement is a promising solution to the problem of delamination susceptibility in laminated composites. Modeling Z-pin–prepreg interaction is essential for accurate robotics-assisted Z-pin insertion. In this paper, a novel Z-pin insertion force model combining the classical cohesive finite element (FE) method with a dynamic analytical fracture mechanics model is proposed. The velocity-dependent cohesive elements, in which the fracture toughness is provided by the analytical model, are implemented in Z-pin insertion FE model to predict the crack initiation and propagation. Then Z-pin insertion experiments are performed on prepreg sample with metallic Z-pins at different velocities to identify the analytical model parameters and validate the simulation predictions offered by the model. Dynamics of Z-pin interaction with inhomogeneous prepreg is described and the effects of insertion velocity on prepreg contact force are studied. Results show that the force model agrees well with experiments and the fracture toughness rises with the increasing Z-pin insertion velocity.

Interfacial adhesion of nanoporous zeolite thin films

2006 ◽  
Vol 21 (2) ◽  
pp. 505-511 ◽  
Author(s):  
Lili Hu ◽  
Junlan Wang ◽  
Zijian Li ◽  
Shuang Li ◽  
Yushan Yan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Interfacial Adhesion ◽  
Interfacial Strength ◽  
Future Generation ◽  
In Situ Growth ◽  
Seeded Growth ◽  
Si Substrates ◽  
Film Substrate

Nanoporous silica zeolite thin films are promising candidates for future generation low-dielectric constant (low-k) materials. During the integration with metal interconnects, residual stresses resulting from the packaging processes may cause the low-k thin films to fracture or delaminate from the substrates. To achieve high-quality low-k zeolite thin films, it is important to carefully evaluate their adhesion performance. In this paper, a previously reported laser spallation technique is modified to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces fabricated using three different methods: spin-on, seeded growth, and in situ growth. The experimental results reported here show that seeded growth generates films with the highest measured adhesion strength (801 ± 68 MPa), followed by the in situ growth (324 ± 17 MPa), then by the spin-on (111 ± 29 MPa). The influence of the deposition method on film–substrate adhesion is discussed. This is the first time that the interfacial strength of zeolite thin films-Si substrates has been quantitatively evaluated. This paper is of great significance for the future applications of low-k zeolite thin film materials.

Effective Modeling of Fatigue Crack Growth in Pipelines

2012 ◽  
Author(s):  
Steven J. Polasik ◽  
Carl E. Jaske
Keyword(s):  
Fatigue Crack ◽  
Stress Intensity ◽  
Fatigue Crack Growth ◽  
Fracture Mechanics ◽  
Crack Growth ◽  
Growth Models ◽  
Critical Parameters ◽  
Operating Pressure ◽  
Mechanics Model ◽  
Key Variables

Pipeline operators must rely on fatigue crack growth models to evaluate the effects of operating pressure acting on flaws within the longitudinal seam to set re-assessment intervals. In most cases, many of the critical parameters in these models are unknown and must be assumed. As such, estimated remaining lives can be overly conservative, potentially leading to unrealistic and short reassessment intervals. This paper describes the fatigue crack growth methodology utilized by Det Norske Veritas (USA), Inc. (DNV), which is based on established fracture mechanics principles. DNV uses the fracture mechanics model in CorLAS™ to calculate stress intensity factors using the elastic portion of the J-integral for either an elliptically or rectangularly shaped surface crack profile. Various correction factors are used to account for key variables, such as strain hardening rate and bulging. The validity of the stress intensity factor calculations utilized and the effect of modifying some key parameters are discussed and demonstrated against available data from the published literature.

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