The Competition between Adhesive and Cohesive Fracture at Amicro-Patterned Polymer-Metal Interface

2013 ◽  
Vol 577-578 ◽  
pp. 225-228 ◽  
Author(s):  
Olaf van der Sluis ◽  
Joris J.C. Remmers ◽  
M.A.C. Thurlings ◽  
B.J. Welling ◽  
Sander P.M. Noijen
Keyword(s):  
Crack Deflection ◽  
Surface Roughening ◽  
Adhesive Failure ◽  
Cohesive Failure ◽  
Metal Interface ◽  
Cohesive Fracture ◽  
Micro Patterning ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Point Bend

It is Common Practice for Polymer-Metal Interfaces, Frequently Encountered in Microelec-Tronic Devices, to Improve Adhesion by Surface Roughening or Micro-Patterning. the Competitionbetween Adhesive Fracture and Cohesive Fracture in the Vicinity of a Patterned Interface, i.e., Inter-Face Crack Deflection, is One of these Key Mechanisms that Contribute Significantly to the Macroscopicadhesion. in this Paper, these Fracture Phenomena are Described Simultaneously by Cohesive Zoneelements with an Exponential Traction-Separation Law (TSL) for the Adhesive Failure and an Initiallyrigid, Exponentially Decaying, TSL for the Cohesive Failure. it is Demonstrated that the Conditions Atwhich Crack Kinking Occurs are Dominated by Fracture Strength Values as Opposed to the Commonlyused Fracture Toughness Values. Experimental Verification is Performed by Means of Four Point Bend-Ing Tests on Specifically Designed Micro-Patterned Polymer-Metal Samples.

Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface Roughness

2002 ◽  
Vol 124 (2) ◽  
pp. 127-134 ◽  
Author(s):  
Qizhou Yao ◽  
Jianmin Qu
Keyword(s):  
Surface Roughness ◽  
Fracture Mechanics ◽  
Electronic Packaging ◽  
Interfacial Adhesion ◽  
Interfacial Strength ◽  
Interface Roughness ◽  
Cohesive Failure ◽  
Mechanics Model ◽  
Polymer Metal ◽  
Metal Interfaces

Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired for enhancing the interfacial adhesion. Roughened surfaces generally produce more cohesive failure; therefore, they are used commonly in practice to obtain better adhesion. This paper develops a fracture mechanics model that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer–metal interfaces. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD.

Interfacial Versus Cohesive Failure on Underfill-Aluminum Interface: Effects of Interface Roughness

2000 ◽  
Author(s):  
Qizhou Yao ◽  
Jianmin Qu
Keyword(s):  
Surface Roughness ◽  
Fracture Mechanics ◽  
Interfacial Adhesion ◽  
Flip Chip ◽  
Interfacial Strength ◽  
Interface Roughness ◽  
Cohesive Failure ◽  
Mechanics Model ◽  
Polymer Metal ◽  
Metal Interfaces

Abstract This paper is concerned with the interfacial adhesion and failure of underfill materials in flip-chip packages. Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired to enhance the interfacial adhesion. Roughened surfaces generally produce more cohesive failure, therefore, are used commonly in practice to obtain better adhesion. In this paper a fracture mechanics model is developed that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer – metal interfaces.

Stick-Slip Fracture of Polymer/Metal Interfaces

2001 ◽  
Vol 710 ◽  
Author(s):  
Y. Toivola ◽  
B.P. Somerday ◽  
R. Shediac ◽  
M.P. Ivill
Keyword(s):  
Crack Propagation ◽  
Water Uptake ◽  
Fracture Behavior ◽  
Interfacial Crack ◽  
Strain Energy Release ◽  
Stick Slip ◽  
Degree Of Hydration ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Point Bend

ABSTRACTThe adhesion of a thin-film of PMMA to substrates consisting of Ti or Al was measured using a four-point bend technique. Initial results revealed that cracks propagated along the PMMA/metal interfaces at stable rates. Subsequent experiments showed intermittent (“stick-slip”) interfacial crack propagation consisting of cycles of crack initiation, unstable propagation, and arrest. To investigate the origin of stick-slip fracture behavior at PMMA/metal interfaces the effect of water uptake by PMMA on fracture behavior was studied. Four-point bend sandwich specimens were stored in vacuum or deionized water environments at either 25 °C or 65 °C for a period of 7 days prior to testing. The PMMA/Al system stored at 25 °C showed a transition from stable to stick-slip crack propagation when the exposure environment was changed from vacuum to water. Interface crack propagation was stable for both the PMMA/Ti and PMMA/Al systems on exposure to 65 °C water, but the critical strain energy release rate, GC was markedly reduced, indicating that water uptake promoted stick-slip fracture up to some critical degree of hydration. No change in stick-slip behavior was observed from a variation in imposed load-point displacement rate.

Model Compound Approach for Polymer-Metal InterFaces: ESCA Studies

1984 ◽  
Vol 40 ◽  
Author(s):  
P. N. Sanda ◽  
J. W. Bartha ◽  
B. D. Silverman ◽  
P. S. Ho ◽  
A. R. Rossi
Keyword(s):  
Model Compound ◽  
Amino Groups ◽  
Ether Linkage ◽  
Cu Films ◽  
Polymer Metal ◽  
Terminal Amino ◽  
Metal Interfaces ◽  
Imide Group

AbstractESCA studies of two molecules which are similar in structure to the PMDA and ODA constituents of the PMDA-ODA polyimide monomer are discussed. Their interaction with in-situ evaporated Cr and Cu films are compared. The PMDA model compound interacts with Cr through the imide group, while very little interaction is observed with Cu. The ODA model compound (oxydianiline) interacts with Cr via the ether linkage and the terminal amino groups, whereas very little interaction is observed with Cu.

Charactervation of Adhesion in Thin-Film Materials by the Blister Test

1992 ◽  
Vol 276 ◽  
Author(s):  
Y Z. Chu ◽  
H. S. Jeong ◽  
R. C. White ◽  
C. J. Durning
Keyword(s):  
Fluid Pressure ◽  
Structural Features ◽  
Adhesion Energy ◽  
Pressure Data ◽  
Blister Test ◽  
Constant Rate ◽  
Polymer Metal ◽  
Metal Interfaces ◽  
Peel Tests ◽  
Microscopic Dynamic

ABSTRACTIn this work a blister test is applied to study the adhesion of thin films to substrates. In the blister test one injects a fluid at constant rate at the interface between the substrate and an overlayer to create a “blister”. The fluid pressure is measured as function of time. An analysis gives a reliable way of calculating the adhesion energy Ga. from the time-dependent pressure data. The method was applied to a variety of systems including polymer/polymer, polymer/silicon and polymer/metal interfaces. The results show that the test is very sensitive and is able to determine small adhesion energies inaccessible in conventional peel tests. This work demonstrates that the blister test provides a means of relating the mechanical strength of an interface to its microscopic dynamic and structural features.

Studies on polymer-metal interfaces

Polymer ◽  
1999 ◽  
Vol 40 (14) ◽  
pp. 3989-3994 ◽  
Author(s):  
Dong Ha Kim ◽  
Won Ho Jo
Keyword(s):  
Polymer Metal ◽  
Metal Interfaces

scholarly journals Repair Bond Strength of Composite to Zirconia Ceramic Using Two Types of Zirconia Primers

2020 ◽  
Author(s):  
Hoseinali Mahgoli ◽  
Mahnaz Arshad ◽  
Kamran Rasouli ◽  
Ali Akbar Sobati ◽  
Ahmad Reza Shamshiri
Keyword(s):  
Bond Strength ◽  
Shear Bond Strength ◽  
Composite Resin ◽  
Zirconia Ceramic ◽  
Adhesive Failure ◽  
Cohesive Failure ◽  
Simultaneous Application ◽  
All Ceramic ◽  
The Mean

  Objectives: This study aimed to assess the effect of application of two types of zirconia primers on repair bond strength of composite to zirconia ceramic. Materials and Methods: In this in vitro, experimental study, 60 zirconia blocks were divided into five groups and subjected to the application of Z-Prime Plus (ZPP), Monobond Plus (MBP), Porcelain Bonding Resin (PBR), ZPP followed by PBR (ZPP+PBR) and MBP followed by PBR (MBP+PBR). They were then bonded to Z100 composite. The samples were then immersed in water at 37°C for 24 hours, thermocycled for 1000 cycles between 5-55°C and subjected to shear bond strength (SBS) test. The mode of failure was determined under a stereomicroscope and a scanning electron microscope (SEM). Results: The mean bond strength was the highest in ZPP+PBR group followed by MBP+PBR, ZPP, PBR and MBP group (22.29±8.86, 15.75±2.81, 12.02±3.24, 3.60±2.92 and 2.92±1.78 MPa, respectively). The effects of type of zirconia primer and use/no use of PBR on SBS were significant (P<0.05). The frequency of adhesive failure in MBP and PBR groups was significantly higher than that in MBP+PBR and ZPP+PBR groups (P<0.05). The cohesive failure was significantly more frequent in ZPP+PBR group than in ZPP, MBP and PBR groups (P<0.05). Conclusion: Simultaneous application of zirconia primer and PBR is the most efficient technique for repair of all-ceramic zirconia restorations with composite resin.

Sign in / Sign up

Export Citation Format

Share Document