Reliability Evaluation of CSP Using New Flip-Chip Bonding Technology: Both-Sided CSP and Single-Sided CSP

2002 ◽  
Author(s):  
Hideo Koguchi ◽  
Nipon Taweejun ◽  
Kazuto Nishida ◽  
Chie Sasaki
Keyword(s):  
Finite Element Method ◽  
Cross Section ◽  
Flip Chip ◽  
High Reliability ◽  
Reliability Evaluation ◽  
Thickness Direction ◽  
Material Parameters ◽  
Conductive Film ◽  
Chip Size ◽  
Bonding Technology

Chip-size packaging (CSP) attracts largely attentions due to its lighter, thinner and smaller size. In this study, the deformations and the stresses in the CSP fabricated by non-conductive film stud-bump direct interconnection (NSD) were analyzed. The reliability evaluation of single-sided CSP and both-sided CSP were investigated for heat cycles. The material parameters, i.e. stresses, strains and deformations, for achieving a high reliability of CSP were investigated using a finite element method and experiment. The dependency of the life in single-sided CSP and both-sided CSP on the thicknesses of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively.

Ultra-Thin and High-Density Packaging Using Both Sides Flip Chip Technology

2003 ◽  
Author(s):  
Kazuto Nishida ◽  
Kazumichi Shimizu ◽  
Michiro Yoshino ◽  
Hideo Koguchi ◽  
Nipon Taweejun
Keyword(s):  
Cross Section ◽  
Flip Chip ◽  
High Capacity ◽  
High Density ◽  
Thickness Direction ◽  
The Finite Element Method ◽  
Memory Card ◽  
Chip Technology ◽  
Chip Size ◽  
High Density Packaging

We have developed a high-density packaging technology by using a thin IC and a thin substrate and bonding it by new flip chip technology. Numerical analysis with the finite element method (FEM) as well experiments clearly showed that deflection of the IC and reliability were affected by the IC thickness. Consequently, reliability could be improved by reducing IC thickness. The dependency of the life in single-sided CSP and both-sided CSP on the thickness of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively. Moreover, a both-sided flip chip approach solved the problem of warpage. A high-capacity memory card of 512 MB was put to practical use by applying these results. This increased the Si density by four times over that of a conventional chip-size package (CSP).

Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology––double-sided CSP and single-sided CSP

2003 ◽  
Vol 43 (12) ◽  
pp. 2065-2075 ◽  
Author(s):  
Kazuto Nishida ◽  
Kazumichi Shimizu ◽  
Michiro Yoshino ◽  
Hideo Koguchi ◽  
Nipon Taweejun
Keyword(s):  
Flip Chip ◽  
Reliability Evaluation ◽  
Flip Chip Bonding ◽  
Bonding Technology

New Flip-Chip Interconnect Technology for High Performance and High Reliability Applications

2012 ◽  
Vol 2012 (1) ◽  
pp. 000482-000490
Author(s):  
Eiji Yamaguchi ◽  
Mutsuo Tsuji ◽  
Nozomi Shimoishizaka ◽  
Takahiro Nakano ◽  
Katsunori Hirata
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
High Reliability ◽  
Device Structure ◽  
Bonding Pressure ◽  
Flip Chip Bonding ◽  
Reflow Temperature ◽  
Device Structures ◽  
Bonding Technology ◽  
The Cost

As the current and next generation devices are embracing geometries below 28nm and requiring softer low-K dielectric isolation on very thin large silicon dies ∼ to perform a reliable die-to-package interconnect is becoming a challenge. Further, the high pressure from Cu wire bonding and high reflow temperature of conventional flip-chip bonding often results in damage of device structure. A new flip-chip bonding technology has been developed for such critical applications, and is claimed to be “damage free”. It uses soft bump made by non-full cured conductive paste on the package substrate. These soft bumps require ultra-low bonding pressure on the pad of the die. Thus the bonding process don't make any damage on ULK isolation layer. Details of the process, material sets used for such fragile device structures have been discussed. Reliability results are shared, which further ensures the robustness of this process. Finally, the cost advantage through adaptation of this process has also been elaborated.

Effects of Ultrasonic Power on Bonding Strength of Anisotropic Conductive Film Joint in Chip-on-Glass Assembly

2011 ◽  
Vol 189-193 ◽  
pp. 3466-3469
Author(s):  
Yong Cheng Lin ◽  
Hao Jin ◽  
Xiao Nan Fang ◽  
Jun Zhang
Keyword(s):  
Electronic Packaging ◽  
Bonding Strength ◽  
Flip Chip ◽  
Ultrasonic Power ◽  
Anisotropic Conductive Film ◽  
Flip Chip Bonding ◽  
Conductive Film ◽  
Bonding Technology

Polymer-based anisotropic conductive film has become widely used in many electronic packaging interconnect applications. In this study, thermosonic flip chip bonding technology for anisotropic conductive film (ACF) joints of chip-on-glass (COG) assembly is investigated. The effects of ultrasonic power on the curing degree and bonding strength of anisotropic conductive film joints are discussed. The results show that (1) The bonding strength of the ACF joints firstly increases and then fast decreases when the ultrasonic power is continuously increased; (2) The curing degree of ACF material increases with the increase of the ultrasonic power. When the ultrasonic power is 3.52W, the curing degree of ACF material can reach 94.1%; (3) The optimized value of ultrasonic power is 3.5W for the studied assembly.

Closure Behavior of Longitudinal Cavities in a Slab by Side Pressing

2013 ◽  
Vol 535-536 ◽  
pp. 247-249
Author(s):  
Jong Jin Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Aspect Ratio ◽  
Cross Section ◽  
Effective Strain ◽  
Longitudinal Direction ◽  
Critical Value ◽  
Thickness Direction ◽  
Void Closure ◽  
Plane Strain Deformation

Longitudinal cavities or pipes are usually developed in a metallic slab or billet produced by continuous casting. In the present study, closure behavior of such cavities by side pressing was investigated by finite-element method. Since the contact surface between the dies and the slab was much longer in the longitudinal direction than in the thickness direction, the slab was compressed under the condition of plane-strain deformation. As a result, the effective strain was found to be an indicator for the void closure. The critical value of the effective strain was dependent upon the aspect ratio of the cross section of the cavity, but not upon its size.

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