Deterioration mechanism of flip chip attachment using an anisotropic conductive film and design technology for high reliability

2003 ◽  
Author(s):  
S. Fujiwara ◽  
M. Harada ◽  
Y. Fujita ◽  
T. Hachiya ◽  
M. Muramatsu
Keyword(s):  
Flip Chip ◽  
High Reliability ◽  
Anisotropic Conductive Film ◽  
Design Technology ◽  
Conductive Film ◽  
Deterioration Mechanism ◽  
Chip Attachment

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film

Reliability Evaluation of CSP Using New Flip-Chip Bonding Technology: Both-Sided CSP and Single-Sided CSP

2002 ◽  
Author(s):  
Hideo Koguchi ◽  
Nipon Taweejun ◽  
Kazuto Nishida ◽  
Chie Sasaki
Keyword(s):  
Finite Element Method ◽  
Cross Section ◽  
Flip Chip ◽  
High Reliability ◽  
Reliability Evaluation ◽  
Thickness Direction ◽  
Material Parameters ◽  
Conductive Film ◽  
Chip Size ◽  
Bonding Technology

Chip-size packaging (CSP) attracts largely attentions due to its lighter, thinner and smaller size. In this study, the deformations and the stresses in the CSP fabricated by non-conductive film stud-bump direct interconnection (NSD) were analyzed. The reliability evaluation of single-sided CSP and both-sided CSP were investigated for heat cycles. The material parameters, i.e. stresses, strains and deformations, for achieving a high reliability of CSP were investigated using a finite element method and experiment. The dependency of the life in single-sided CSP and both-sided CSP on the thicknesses of IC and substrate could be expressed using a normal stress in the thickness direction and shear stress in the vertical cross section, respectively.

Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film

2004 ◽  
Vol 33 (1) ◽  
pp. 76-82 ◽  
Author(s):  
Myung Jin Yim ◽  
Jin-Sang Hwang ◽  
Jin Gu Kim ◽  
Jin Yong Ahn ◽  
Hyung Joon Kim ◽  
...  
Keyword(s):  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film
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