Heat Conduction in High Thermal Conductivity Networked Composite Films for Thermal Interface Materials

2011 ◽  
Author(s):  
Hafez Raeisi Fard ◽  
Kamyar Pashayi ◽  
Fengyuan Lai ◽  
Joel Plawsky ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Contact ◽  
Composite Films ◽  
Vital Role ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Thermally Induced ◽  
Resistance Pathway

Fast and efficient exchange of thermal energy plays a vital role in the thermal management of electronic and optoelectronic devices. A critical component for thermal management is a thermal interface material (TIM) that is used to minimize the contact thermal resistance between surfaces and to provide a low resistance pathway to spread and remove heat. Ideal TIMs must pass several key requirements: 1) high thermal conductivity κ and low thermal contact resistance with the mating surfaces; 2) easy to apply with controlled thickness; 3) low temperature processing; 4) able to accommodate thermally induced mechanical stresses during on-off cycling of the device1. Particle-based composites have reasonable slurry viscosities, however their thermal conductivity are usually very low (<10 Wm−1K−1), even when high κ nanofillers are employed, due to the thermal interface resistance between nanoparticles and the polymer matrix2 or the absence of high κ pathways.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Development of a Metal Micro-Textured Thermal Interface Material

2009 ◽  
Author(s):  
R. Kempers ◽  
R. Frizzell ◽  
A. Lyons ◽  
A. J. Robinson
Keyword(s):  
Thermal Conductivity ◽  
Applied Pressure ◽  
Solid Particles ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Filler Materials ◽  
Mechanical And Thermal Properties ◽  
Metal Foil ◽  
Thermal Interface ◽  
Thermally Conductive

Typical thermal interface materials (TIMs) consist of high thermal conductivity solid particles dispersed in a continuous, low thermal conductivity organic compound. Despite using filler materials of very high thermal conductivity, the effective thermal conductivity of these TIMs is often two orders of magnitude lower than the pure filler materials. In addition, dispensing and flow of the particle-matrix composite results in voids being trapped within the bond. To address these issues, a novel metal micro-textured thermal interface material (MMT-TIM) has been developed. This material consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. Numerical tools have been developed that couple the mechanical and thermal properties and behaviour of MMT-TIMs as they undergo large-plastic deformation during assembly. This study presents the modelling approach and predictions of MMT-TIM performance based on these numerical techniques. The predictions show good agreement with experimental results, which were obtained using prototype MMT-TIMs and an advanced TIM characterization facility. Finally, a future outlook for this technology is presented based on these promising initial results.

Verbesserte Wärmeableitung sorgt für kühlere Motorventile

Konstruktion ◽  
2017 ◽  
Vol 69 (11-12) ◽  
pp. IW8-IW9
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Eine Verbesserte

Auf der IAA 2017 in Frankfurt stellte Federal-Mogul Powertrain neue Werkstoffe für Ventilsitze und -führungen mit verbesserter Wärmeableitung vor (Bild 1). Die serienreifen Materialien High Thermal Conductivity (HTC) und die Beschichtung mit Thermal Interface Material (TIM) können die Temperaturen am Ventilteller um bis zu 70 °C reduzieren. Dies ermöglicht eine verbesserte Verbrennung und niedrigere Emissionen.

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

1999 ◽  
Vol 122 (2) ◽  
pp. 128-131 ◽  
Author(s):  
Yunsheng Xu ◽  
Xiangcheng Luo ◽  
D. D. L. Chung
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Sodium Silicate ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Mineral Oil ◽  
Thermal Interface Material ◽  
Thermal Contact Conductance ◽  
Thermal Interface ◽  
Contact Conductance

Sodium silicate based thermal interface pastes give higher thermal contact conductance across conductor surfaces than polymer based pastes and oils, due to their higher fluidity and the consequent greater conformability. Addition of hexagonal boron nitride particles up to 16.0 vol. percent further increases the conductance of sodium silicate, due to the higher thermal conductivity of BN. However, addition beyond 16.0 vol. percent BN causes the conductance to decrease, due to the decrease in fluidity. At 16.0 vol. percent BN, the conductance is up to 63 percent higher than those given by silicone based pastes and is almost as high as that given by solder. Water is almost as effective as sodium silicate without filler, but the thermal contact conductance decreases with time due to the evaporation of water. Mineral oil and silicone without filler are much less effective than water or sodium silicate without filler. [S1043-7398(00)00402-3]

Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

2020 ◽  
Vol 1010 ◽  
pp. 160-165
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Nor Zaiazmin Yahaya ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Mixed Material ◽  
Interface Materials ◽  
Main Material

Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not exactly like predicted. In this studied, thermal interface material using graphene and CNT as main material were used to increase thermal conductivity and thermal contact resistance. These two types of TIM had been compare to each other in order to find wich material were able to increase the thermal conductivity better. The sample that contain 20 wt. %, 40 wt. % and 60 wt. % of graphene and CNT were used in this studied. The thermal conductivity of thermal interface material is both measured and it was found that TIM made of graphene had better thermal conductivity than CNT. The highest thermal conductivity is 23.2 W/ (mK) with 60 w. % graphene meanwhile at 60 w. % of CNT only produce 12.2 W/ (mK thermal conductivity).

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