Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Author(s):  
Takahiro Kinoshita ◽  
Takashi Kawakami ◽  
Takeshi Wakamatsu ◽  
Shunpei Shima ◽  
Keiji Matsumoto ◽  
...  

Stresses and mechanical strength of brittle materials (Si chip and insulator) around TSV (Through Silicon Via) structures in 3D SiP (Three Dimensional System in Package) were discussed under device operation condition and reflow process condition by using a large scale simulator ADVENTURECluster®, which was based on FEM (Finite Element Method), for ensuring the reliability of 3D SiP. In case of the device operation, the equivalent stress of TSV were lower than yield stress of copper, and the maximum principal stress of Si and insulator were also lower than its bending strength. In case of the reflow process, the equivalent stress of TSV were over the yield stress of copper, and the maximum principal stresses of Si and insulator were closed to its bending strength. In addition, steep stress elevations were shown at edge part of Si and insulator. It will be a singular stress field by stress concentration. Its stress singularity was evaluated and the local strength of Si chip and insulator was discussed.

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Takahiro Kinoshita ◽  
Takashi Kawakami ◽  
Tatsuhiro Hori ◽  
Keiji Matsumoto ◽  
Sayuri Kohara ◽  
...  

Thermal conduction and mechanical stresses in through silicon via (TSV) structures in three dimensional system in package (3D SiP) under device operation condition were discussed. A large scale simulator, ADVENTURECluster® based on finite element method (FEM) was used to simulate the effects of voids formed inside Cu TSVs on the thermal conduction and mechanical stresses in the TSV structure. The thermal performance that was required in 3D SiP was estimated to ensure the reliability. Simulations for thermal stresses in the TSV structure in 3D SiP were carried out under thermal condition due to power ON/OFF of device. In case that void was not present inside the TSV, the stresses in TSV were close to the hydrostatic pressure and the magnitude of the equivalent stress was lower than the yield stress of copper. Maximum principal stress of the Si chip in the TSV structure for the case without voids was lower than that of the bending strength of silicon. However, the level of the stresses in the Si chips should not be negligible for damages to Si chips. In case that void was present inside the TSV, stress concentration was occurred around the void in the TSV. The magnitude of the equivalent stress in the TSV was lower than the yield stress of copper. The magnitude of the maximum principal stress of the Si chip was lower than that of the bending strength of silicon. However, its level should not be negligible for damages to TSVs and Si chips. The stress on inner surfaces of Si chip was slightly reduced due to the presence of a void in the TSV.


Author(s):  
Takahiro Kinoshita ◽  
Takashi Kawakami ◽  
Tatsuhiro Hori ◽  
Keiji Matsumoto ◽  
Sayuri Kohara ◽  
...  

Thermal conduction and mechanical strength around TSV (Through Silicon Via) structures of 3D SiP (Three Dimensional System in Package) were discussed both cases of with and without void in TSV by using a large scale simulator based on FEM, ADVENTURECluster® for ensuring the reliability of 3D SiP. In the results, the thermal performance that was required in 3D SiP was estimated to ensure the reliability. Simulations for thermal stresses around TSV structure in 3D SiP under thermal cycle condition due to power ON/OFF were carried out. In case that void was not in TSV, stresses in TSV were close to hydrostatic pressure and the magnitude of the equivalent stress was lower than the yield stress of copper. However, the level of the stresses, especially in Si chips, should not be negligible in inducing damages to TSVs and Si single crystals. In case that void was in TSV, stress was concentrated around void in TSV and the magnitude of the equivalent stress was lower than the yield stress of copper. The level of stresses applied to Si chip was slightly reduced due to void in TSV. However, its level should not be negligible in inducing damages to TSVs and Si single crystals.


Author(s):  
Le Xie ◽  
Guangwen He ◽  
Bin Yu ◽  
Shaowei Yan

Abstract In this study, the mixing quality of high-viscosity yield stress fluid (Carbopol aqueous solution) under laminar and turbulent flow regimes was evaluated through a numerical experimental study. A three-dimensional computational fluid dynamics large-eddy simulation (CFD-LES) model was employed to capture large-scale vortex structures. The proposed CFD model was validated by the experimental data in terms of mean velocity profiles and velocity-time history. Thereafter, the CFD model was applied to simulate the residence time distribution using the tracking technique: tracer pulse method and step method. In addition, the non-ideal flow phenomena caused by molecular diffusion and eddy diffusion were evaluated. The effects of the rheological properties on the mixing performance were also investigated. The presented results can provide useful guidance to enhance mass transfer in reactors with high-viscosity fluids.


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
L. Orr ◽  
S. C. Chapman ◽  
J. W. Gjerloev ◽  
W. Guo

AbstractGeomagnetic substorms are a global magnetospheric reconfiguration, during which energy is abruptly transported to the ionosphere. Central to this are the auroral electrojets, large-scale ionospheric currents that are part of a larger three-dimensional system, the substorm current wedge. Many, often conflicting, magnetospheric reconfiguration scenarios have been proposed to describe the substorm current wedge evolution and structure. SuperMAG is a worldwide collaboration providing easy access to ground based magnetometer data. Here we show application of techniques from network science to analyze data from 137 SuperMAG ground-based magnetometers. We calculate a time-varying directed network and perform community detection on the network, identifying locally dense groups of connections. Analysis of 41 substorms exhibit robust structural change from many small, uncorrelated current systems before substorm onset, to a large spatially-extended coherent system, approximately 10 minutes after onset. We interpret this as strong indication that the auroral electrojet system during substorm expansions is inherently a large-scale phenomenon and is not solely due to many meso-scale wedgelets.


2021 ◽  
Author(s):  
Federica Paglialunga ◽  
François Passelègue ◽  
Fabian Barras ◽  
Mathias Lebihain ◽  
Nicolas Brantut ◽  
...  

<p>Potential energy stored during the inter-seismic period by tectonic loading around faults can be released through earthquakes as radiated energy, heat and rupture energy. The latter is of first importance, since it controls both the nucleation and the propagation of the seismic rupture. On one side, the rupture energy estimated for natural earthquakes (also called Breakdown work) ranges between 1 J/m<sup>2</sup> and tens of MJ/m<sup>2</sup> for the largest events, and shows a clear slip dependence. On the other side, recent experimental studies highlighted that at the scale of the laboratory, rupture energy is a material property (energy required to break the fault interface), limited by an upper bound value corresponding to the rupture energy of the intact material (1 to 10 kJ/m<sup>2</sup>), independently of the size of the event, i.e. of the seismic slip.</p><p>To reconcile these contradictory observations, we performed stick-slip experiments, as an analog for earthquakes, in a bi-axial shear configuration. We analyzed the fault weakening during frictional rupture by accessing to the on-fault (1 mm away) stress-slip curve through strain-gauge array. We first estimated rupture energy by comparing the experimental strain with the theoretical predictions from both Linear Elastic Fracture Mechanics (LEFM) and the Cohesive Zone Model (CZM). Secondly, we compared these values to the breakdown work obtained from the integration of the stress-slip curve. Our results showed that, at the scale of our experiments, fault weakening is divided into two stages; the first one, corresponding to an energy of few J/m<sup>2</sup>, coherent with the estimated rupture energy (by LEFM and CZM), and a long-tailed weakening corresponding to a larger energy not observable at the rupture tip.</p><p>Using a theoretical analysis and numerical simulations, we demonstrated that only the first weakening stage controls the nucleation and the dynamics of the rupture tip. The breakdown work induced by the long-tailed weakening can enhance slip during rupture propagation and can allow the rupture to overcome stress heterogeneity along the fault. Additionally, we showed that at a large scale of observation the dynamics of the rupture tip can become controlled by the breakdown work induced by the long-tailed weakening, leading to a larger stress singularity at the rupture tip which becomes less sensitive to stress perturbations. We suggest that while the onset of frictional motions is related to fracture, natural earthquakes propagation is driven by frictional weakening with increasing slip, explaining the large values of estimated breakdown work for natural earthquakes, as well as the scale dependence in the dynamics of rupture.</p>


Author(s):  
Wolf Reinhardt ◽  
Don Metzger

The strip yield model is widely used to describe crack tip plasticity in front of a crack. In the strip yield model the stress in the plastic zone is considered as known, and stress and deformation fields can be obtained from elastic solutions using the condition that the crack tip stress singularity vanishes. The strip yield model is generally regarded to be valid to describe small scale plasticity at a crack tip. The present paper examines the behavior of the strip yield model at the transition to large-scale plasticity and its relationship to net section plasticity descriptions. A bar in bending with a single edge crack is used as an illustrative example to derive solutions and compare with one-sided and two-sided plasticity solutions.


2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Feng Jie Zheng ◽  
Chao Yong Zong ◽  
William Dempster ◽  
Fu Zheng Qu ◽  
Xue Guan Song

Reservoir-pipe-valve (RPV) systems are widely used in many industrial processes. The pressure in an RPV system plays an important role in the safe operation of the system, especially during the sudden operations such as rapid valve opening or closing. To investigate the pressure response, with particular interest in the pressure fluctuations in an RPV system, a multidimensional and multiscale model combining the method of characteristics (MOC) and computational fluid dynamics (CFD) method is proposed. In the model, the reservoir is modeled as a zero-dimensional virtual point, the pipe is modeled as a one-dimensional system using the MOC, and the valve is modeled using a three-dimensional CFD model. An interface model is used to connect the multidimensional and multiscale model. Based on the model, a transient simulation of the turbulent flow in an RPV system is conducted in which not only the pressure fluctuation in the pipe but also the detailed pressure distribution in the valve is obtained. The results show that the proposed model is in good agreement when compared with a high fidelity CFD model used to represent both large-scale and small-scale spaces. As expected, the proposed model is significantly more computationally efficient than the CFD model. This demonstrates the feasibility of analyzing complex RPV systems within an affordable computational time.


Author(s):  
Md Shahjahan Hossain ◽  
Hossein Taheri ◽  
Niraj Pudasaini ◽  
Alexander Reichenbach ◽  
Bishal Silwal

Abstract The applications for metal additive manufacturing (AM) are expanding. Powder-bed, powder-fed, and wire-fed AM are the different kinds of AM technologies based on the feeding material. Wire-Arc AM (WAAM) is a wire-fed technique that has the potential to fabricate large-scale three-dimensional objects. In WAAM, a metallic wire is continuously fed to the deposition location and is melted by an arc-welding power source. As the applications for WAAM expands, the quality assurance of the parts becomes a major concern. Nondestructive testing (NDT) of AM parts is necessary for quality assurance and inspection of these materials. The conventional method of inspection is to perform testing on the finished parts. There are several limitations encountered when using conventional methods of NDT for as-built AM parts due to surface conditions and complex structure. In-situ process monitoring based on the ultrasound technology is proposed for WAAM material inspection during the manufacturing process. Ultrasonic inline monitoring techniques have the advantages of providing valuable information about the process and parts quality. Ultrasonic technique was used to detect the process condition deviations from the normal. A fixture developed by the authors holds an ultrasonic sensor under the build platform and aligned with the center of the base plate. Ultrasonic signals were measured for different process conditions by varying the current and gas flow rate. Features (indicators) from the radio frequency (RF) signal were used to evaluate the difference in signal clusters to identify and classify different build conditions. Results show that the indicator values of the ultrasonic signals in the region of interest (ROI) changes with different process conditions and can be used to classify them.


Author(s):  
Yuwei Li ◽  
David Donghyun Kim ◽  
Brian Anthony

Abstract We present HapticWall, an encountered-type, motor actuated vertical two-dimensional system that enables both small and large scale physical interactions in virtual reality. HapticWall consists of a motor-actuated vertical two-dimensional gantry system that powers the physical proxy for the virtual counterpart. The physical proxy, combined with the HapticWall system, can be used to provide both small and large scale haptic feedbacks for virtual reality in the vertical space. Haptic Wall is capable of providing wall-like haptic feedback and interactions in the vertical space. We created two virtual reality applications to demonstrate the application of the HapticWall system. Preliminary user feedback was collected to evaluate the performance and the limitations of the HapticWall system. The results of our study are presented in this paper. The outcome of this research will provide better understanding of multi-scale haptic interfaces in the vertical space for virtual reality and guide the future development of the HapticWall system.


Holzforschung ◽  
2014 ◽  
Vol 68 (3) ◽  
pp. 327-335 ◽  
Author(s):  
Yonggun Park ◽  
Chang-Deuk Eom ◽  
Yeonjung Han ◽  
Jun-Ho Park ◽  
Yoon-Seong Chang ◽  
...  

Abstract Pitch pine (P. rigida) wood was treated with superheated steam (SHS) and the subsequent effects due to drying and heat treatment (HT) were observed. The following treatment parameters were tested: 180°C air HT, 220°C air HT, 0.1 MPa–180°C SHS HT, 0.1 MPa–220°C SHS HT, 0.5 MPa–180°C SHS HT, and 0.5 MPa–220°C SHS HT. No drying checks were observed in the specimens (500×150×50 mm3) treated at 0.5 MPa–220°C SHS and with these treatment parameters, equilibrium moisture content (EMC) was the lowest. Low EMC has an effect on physical properties such as shrinkage, compressive strength parallel to the grain, bending strength, hardness, and decay resistance. Based on the results, it is expected that the green wood in a large scale is possible to be simultaneously dried and heat-treated without occurrence of checks by the SHS HT process.


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