Channel Size Optimization for 3D-IC Integrated Interlayer Microchannel Liquid Cooling

2016 ◽  
Author(s):  
D. D. Ma ◽  
G. D. Xia ◽  
W. Wang ◽  
X. F. Li ◽  
Y. T. Jia
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Rectangular Channel ◽  
Channel Structure ◽  
Maximum Temperature ◽  
Liquid Cooling ◽  
3D Ic ◽  
Flow Rates ◽  
Multi Objective ◽  
Contraction Ratio

3D-IC is getting increasingly attractive, as it improves speed and frequency, and reduces power consumption, noise and latency. However, three dimension (3D) integration technologies bring a new serious challenge to chip thermal management with the power density increased exponentially. Interlayer microchannel liquid cooling is thought as a promising and scalable solution for cooling high heat flux 3D-IC. In this paper, firstly channel number, channel width and height parameters of rectangular channel are optimized by the method of multi-objective parameter optimization under given overall size of 5mm in length and 5mm in width. The results show the total thermal resistances can reach very small under individual constraint condition of volume flow rates, but the pressure drop is too larger to accept. The minimum thermal resistance structure can be got by multi-objective optimization at various constraint conditions. It is found that the channel height and width increase with increasing of flow rates at pumping power less than 0.1W and pressure drop less than 20kPa. Secondly, the zigzag channels are designed on the basis of the optimized rectangular channel structure. The expansion and contraction ratio as an important parameter is optimized by numerical simulation. The thermal enhancement factor and Nusselt number measure the comprehensive performances of heat transfer. The results show heat transfer characteristic is enhanced with the decreasing of expansion and contraction ratio. Besides, the maximum junction temperature and maximum temperature difference are also reduced. 3D-IC with wave channel of β=3/7 is more promising for interlayer cooling.

Computational Study and Optimization of Laminar Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2013 ◽  
Vol 5 (1) ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Double Layer ◽  
Flow Rate ◽  
Single Layer ◽  
Parallel Flow ◽  
Heat Fluxes ◽  
Liquid Cooling ◽  
Counter Flow ◽  
Flow Rates

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to be incorporated to manage the increase of the dissipated heat. The traditional air-cooling can not meet the requirements of cooling heat fluxes as high as 100 W/cm2, or even higher, and the traditional liquid cooling is not sufficient either in cooling very high heat fluxes although the pressure drop is small. Therefore, a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid removing the heat, but these microchannels are often designed to be single-layer channels with high pressure drop. In this paper, the laminar heat transfer and pressure loss of a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flow rates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics. Due to the negative heat flux effect, the parallel-flow layout is found to be better for heat dissipation when the flow rate is limited to a low value while the counter-flow layout is better when a high flow rate can be provided. In addition, the thermal performance of the single-layer microchannel is between those of parallel-flow layout and counter-flow layout of the double-layer microchannel at low flow rates. At last, the optimizations of geometry parameters of double-layer microchannel are carried out through changing the height of the upper-branch and lower-branch channels to investigate the influence on the thermal performance.

Mini-Channel Liquid Cooling System for Improving Heat Transfer Capacity and Thermal Uniformity in Battery Packs for Electric Vehicles

2021 ◽  
Vol 18 (3) ◽  
Author(s):  
Congbo Li ◽  
Yongsheng Li ◽  
Sanjay Srinivaas ◽  
Jinwen Zhang ◽  
Shiyang Qu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Cooling Water ◽  
Channel Structure ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Liquid Cooling ◽  
Temperature Deviation ◽  
Battery Packs ◽  
Heat Transfer Capacity

Abstract Temperature is a significant factor affecting performance and safety of energy storage systems such as battery packs. How to design a reliable battery thermal management system (BTMS) is still a hot issue at present. Most of the past researches have focused on methods of reducing temperature rise. This paper mainly studies how to reduce the temperature deviation of the battery pack while ensuring heat dissipation conditions. This paper designs a mini-channel liquid cooling BTMS with a side cover to improve heat transfer capacity and thermal uniformity in battery packs. By analyzing different side cover materials, cooling water temperature, and water channel structure, the influence of different parameters on battery heat dissipation and uniformity is obtained. The main findings are: (1) the presence of the side cover can effectively reduce the maximum temperature and temperature deviation, and the material with high thermal conductivity is more likely to dissipate heat, (2) The increase of cooling water inlet temperature can improve temperature uniformity, and (3) When the cross-sectional area is fixed, as the channel depth increases, the temperature deviation gradually decreases.

Heat Transfer And Pressure Drop Of An Angled Discrete Turbulator At Elevated Reynolds Numbers Up To 900,000

2021 ◽  
pp. 1-29
Author(s):  
Sam Ghazi-Hesami ◽  
Dylan Wise ◽  
Keith Taylor ◽  
Peter Ireland ◽  
Étienne Robert
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Pressure Drop ◽  
Friction Factor ◽  
Rectangular Channel ◽  
Reynolds Numbers ◽  
Enhance Heat Transfer ◽  
Near Surface ◽  
Number Range ◽  
Smooth Channel

Abstract Turbulators are a promising avenue to enhance heat transfer in a wide variety of applications. An experimental and numerical investigation of heat transfer and pressure drop of a broken V (chevron) turbulator is presented at Reynolds numbers ranging from approximately 300,000 to 900,000 in a rectangular channel with an aspect ratio (width/height) of 1.29. The rib height is 3% of the channel hydraulic diameter while the rib spacing to rib height ratio is fixed at 10. Heat transfer measurements are performed on the flat surface between ribs using transient liquid crystal thermography. The experimental results reveal a significant increase of the heat transfer and friction factor of the ribbed surface compared to a smooth channel. Both parameters increase with Reynolds number, with a heat transfer enhancement ratio of up to 2.15 (relative to a smooth channel) and a friction factor ratio of up to 6.32 over the investigated Reynolds number range. Complementary CFD RANS (Reynolds-Averaged Navier-Stokes) simulations are performed with the κ-ω SST turbulence model in ANSYS Fluent® 17.1, and the numerical estimates are compared against the experimental data. The results reveal that the discrepancy between the experimentally measured area averaged Nusselt number and the numerical estimates increases from approximately 3% to 13% with increasing Reynolds number from 339,000 to 917,000. The numerical estimates indicate turbulators enhance heat transfer by interrupting the boundary layer as well as increasing near surface turbulent kinetic energy and mixing.

scholarly journals Effect of Metal Foam Insert Configurations on Flow Boiling Heat Transfer and Pressure Drop in a Rectangular Channel

Materials ◽  
2021 ◽  
Vol 14 (16) ◽  
pp. 4617
Author(s):  
Sanghyun Nam ◽  
Dae Yeon Kim ◽  
Youngwoo Kim ◽  
Kyung Chun Kim
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Mass Flux ◽  
Test Section ◽  
Boiling Heat Transfer ◽  
Metal Foam ◽  
Flow Boiling ◽  
Rectangular Channel ◽  
Saturation Pressure ◽  
Two Phase

Heat transfer under flow boiling is better in a rectangular channel filled with open-cell metal foam than in an empty channel, but the high pressure drop is a drawback of the empty channel method. In this study, various types of metal foam insert configurations were tested to reduce the pressure drop while maintaining high heat transfer. Specifically, we measured the boiling heat transfer and pressure drop of a two-phase vertical upward flow of R245fa inside a channel. To measure the pressure and temperature differences of the metal foam, differential pressure transducers and T-type thermocouples were used at both ends of the test section. While the saturation pressure was kept constant at 5.9 bar, the steam quality at the inlet of the test section was changed from 0.05 to 0.99. The channel height, moreover, was 3 mm, and the mass flux ranged from 133 to 300 kg/m2s. The two-phase flow characteristics were observed through a high-speed visualization experiment. Heat transfer tended to increase with the mean vapor quality, and, as expected, the fully filled metal foam channel offered the highest thermal performance. The streamwise insert pattern model had the lowest heat transfer at a low mass flux. However, at a higher mass flux, the three different insert models presented almost the same heat transfer coefficients. We found that the streamwise pattern model had a very low pressure drop compared to that of the spanwise pattern models. The goodness factors of the flow area and the core volume of the streamwise patterned model were higher than those of the full-filled metal foam channel.

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ki Wook Jung ◽  
Eunho Cho ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Single Phase ◽  
Flow Instability ◽  
Heated Surface ◽  
Heat Fluxes ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in two-dimensional (2D) plane. Utilizing direct “embedded cooling” strategy in combination with top access three-dimensional (3D) manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This study presents the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold plate (CP) bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 5 × 5 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with four microconduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by infrared (IR) camera and electrical resistance thermometry. The maximum and average temperatures of the chip, pressure drop, thermal resistance, and average heat transfer coefficient (HTC) are reported for flow rates of 0.1, 0.2. 0.3, and 0.37 L/min and heat fluxes from 25 to 300 W/cm2. The proposed embedded microchannels-3D manifold cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature, and pressures are 0.37 L/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the microcooler.

Effects of Taper Configurations on Heat Transfer and Pressure Drop in Single-Phase Flows in Microgaps

2020 ◽  
Author(s):  
Debora C. Moreira ◽  
Gherhardt Ribatski ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Single Phase ◽  
Bubble Nucleation ◽  
Low Flow ◽  
Working Fluid ◽  
Inlet Temperature ◽  
Inlet Section ◽  
Flow Rates

Abstract This paper presents a comparison of heat transfer and pressure drop during single-phase flows inside diverging, converging, and uniform microgaps using distilled water as the working fluid. The microgaps were created on a plain heated copper surface with a polysulfone cover that was either uniform or tapered with an angle of 3.4°. The average gap height was 400 microns and the length and width dimensions were 10 mm × 10 mm, resulting in an average hydraulic diameter of approximately 800 microns for all configurations. Experiments were conducted at atmospheric pressure and the inlet temperature was set to 30 °C. Heat transfer and pressure drop data were acquired for flow rates varying from 57 to 485 ml/min and the surface temperature was monitored not to exceed 90 °C to avoid bubble nucleation, so the heat flux varied from 35 to 153 W/cm2 depending on the flow rate. The uniform configuration resulted in the lowest pressure drop, and the diverging one showed slightly higher pressure drop values than the converging configuration, possibly because the flow is most constrained at the inlet section, where the fluid is colder and presents higher viscosity. In addition, a minor dependence of pressure drop with heat flux was observed due to temperature dependent properties. The best heat transfer performance was obtained with the converging configuration, which was especially significant at low flow rates. This behavior could be explained by an increase in the heat transfer coefficient due to flow acceleration in converging gaps, which compensates the decrease in temperature difference between the fluid and the surface due to fluid heating along the gap. Overall, the comparison between the three configurations shows that converging microgaps have better performance than uniform or diverging ones for single-phase flows, and such effect is more pronounced at lower flow rates, when the fluid experiences higher temperature changes.

Experimental Study on Flow Boiling of HFC134a in a Multi-Port Extruded Tube

2004 ◽  
Author(s):  
Ken Kuwahara ◽  
Shigeru Koyama ◽  
Kengo Kazari
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Rectangular Channel ◽  
Large Diameter ◽  
Local Heat Transfer ◽  
Local Heat ◽  
Inlet Temperature

In the present study, the local heat transfer and pressure drop characteristics are investigated experimentally for the flow boiling of refrigerant HFC134a in a multi-port extruded tube of 1.06mm in hydraulic diameter. The test tube is 865mm in total length made of aluminum. The pressure drop is measured at an interval of 191 mm, and the local heat transfer coefficient is measured in every subsection of 75mm in effective heating length. Experimental ranges are as follows: the mass velocity of G = 100–700 kg/m2s, the inlet temperature of Tin = 5.9–11.4 °C and inlet pressure of about 0.5 MPa. The data of pressure drop are compared with a few previous correlations for small diameter tubes, and the correlations can predict the data relatively good agreement. The data of heat transfer coefficient is compared with the correlations of Yu et al. proposed for relatively large diameter tubes. It is found that there are some differences about two phase multiplier factor of convective heat transfer between the circular channel and rectangular channel.

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

2019 ◽  
Author(s):  
Ki Wook Jung ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Single Phase ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable thermal cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct “embedded cooling” strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. Here, we present the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold-plate bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 52 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with 4 micro-conduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by Infra-red (IR) camera and electrical resistance thermometry. The experimental results for maximum and average temperatures of the chip, pressure drop, thermal resistance, average heat transfer coefficient for flow rates of 0.1, 0.2. 0.3 and 0.37 lit/min and heat fluxes from 25 to 300 W/cm2 are reported. The proposed Embedded Microchannels-3D Manifold Cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature and pressures are 0.37 lit/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the micro-cooler.

Effect of Mass Flow Rate on Dryer Room Radiator Pressure Drop and Heat Transfer

2016 ◽  
Vol 836 ◽  
pp. 102-108
Author(s):  
Mirmanto ◽  
Emmy Dyah Sulistyowati ◽  
I Ketut Okariawan
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Electrical Power ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Mass Flow Rates ◽  
Room Model

In the rainy season, in tropical countries, to dry stuffs is difficult. Using electrical power or fossil energy is an expensive way. Therefore, it is wise to utilize heat waste. A device that can be used for this purpose is called radiator. The effect of mass flow rate on pressure drop and heat transfer for a dryer room radiator have been experimentally investigated. The room model size was 1000 mm x 1000 mm x 1000 mm made of plywood and the overall radiator dimension was 360 mm x 220 mm x 50 mm made of copper pipes with aluminium fins. Three mass flow rates were investigated namely 12.5 g/s, 14 g/s and 16.5 g/s. The water temperature at the entrance was increased gradually and then kept at 80°C. The maximum temperature reached in the dryer room was 50°C which was at the point just above the radiator. The effect of the mass flow rate on the room temperature was insignificant, while the effect on the pressure drop was significant. Moreover, the pressure drop decreased as the inlet temperature increased. In general, the radiator is recommended to be used as the heat source in a dryer room.

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