Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ki Wook Jung ◽  
Eunho Cho ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Single Phase ◽  
Flow Instability ◽  
Heated Surface ◽  
Heat Fluxes ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in two-dimensional (2D) plane. Utilizing direct “embedded cooling” strategy in combination with top access three-dimensional (3D) manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This study presents the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold plate (CP) bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 5 × 5 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with four microconduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by infrared (IR) camera and electrical resistance thermometry. The maximum and average temperatures of the chip, pressure drop, thermal resistance, and average heat transfer coefficient (HTC) are reported for flow rates of 0.1, 0.2. 0.3, and 0.37 L/min and heat fluxes from 25 to 300 W/cm2. The proposed embedded microchannels-3D manifold cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature, and pressures are 0.37 L/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the microcooler.

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

2019 ◽  
Author(s):  
Ki Wook Jung ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Single Phase ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Fluid Temperature ◽  
Ir Camera

Abstract High performance and economically viable thermal cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct “embedded cooling” strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. Here, we present the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold-plate bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 52 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with 4 micro-conduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by Infra-red (IR) camera and electrical resistance thermometry. The experimental results for maximum and average temperatures of the chip, pressure drop, thermal resistance, average heat transfer coefficient for flow rates of 0.1, 0.2. 0.3 and 0.37 lit/min and heat fluxes from 25 to 300 W/cm2 are reported. The proposed Embedded Microchannels-3D Manifold Cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature and pressures are 0.37 lit/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the micro-cooler.

scholarly journals Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

2018 ◽  
Vol 140 (2) ◽  
Author(s):  
Chirag R. Kharangate ◽  
Ki Wook Jung ◽  
Sangwoo Jung ◽  
Daeyoung Kong ◽  
Joseph Schaadt ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Friction Factor ◽  
Integrated Circuit ◽  
Single Phase ◽  
Absolute Error ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
Working Fluid ◽  
Pin Fin

Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on channel dimensions, and pressure drop. Here, we investigate heat transfer and pressure drop characteristics of a microfluidic cooling device with staggered pin-fin array arrangement with dimensions as follows: diameter D = 46.5 μm; spacing, S ∼ 100 μm; and height, H ∼ 110 μm. Deionized single-phase water with mass flow rates of m˙ = 15.1–64.1 g/min was used as the working fluid, corresponding to values of Re (based on pin fin diameter) from 23 to 135, where heat fluxes up to 141 W/cm2 are removed. The measurements yield local Nusselt numbers that vary little along the heated channel length and values for both the Nu and the friction factor do not agree well with most data for pin fin geometries in the literature. Two new correlations for the average Nusselt number (∼Re1.04) and Fanning friction factor (∼Re−0.52) are proposed that capture the heat transfer and pressure drop behavior for the geometric and operating conditions tested in this study with mean absolute error (MAE) of 4.9% and 1.7%, respectively. The work shows that a more comprehensive investigation is required on thermofluidic characterization of pin fin arrays with channel heights Hf < 150 μm and fin spacing S = 50–500 μm, respectively, with the Reynolds number, Re < 300.

Effects of Taper Configurations on Heat Transfer and Pressure Drop in Single-Phase Flows in Microgaps

2020 ◽  
Author(s):  
Debora C. Moreira ◽  
Gherhardt Ribatski ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Single Phase ◽  
Bubble Nucleation ◽  
Low Flow ◽  
Working Fluid ◽  
Inlet Temperature ◽  
Inlet Section ◽  
Flow Rates

Abstract This paper presents a comparison of heat transfer and pressure drop during single-phase flows inside diverging, converging, and uniform microgaps using distilled water as the working fluid. The microgaps were created on a plain heated copper surface with a polysulfone cover that was either uniform or tapered with an angle of 3.4°. The average gap height was 400 microns and the length and width dimensions were 10 mm × 10 mm, resulting in an average hydraulic diameter of approximately 800 microns for all configurations. Experiments were conducted at atmospheric pressure and the inlet temperature was set to 30 °C. Heat transfer and pressure drop data were acquired for flow rates varying from 57 to 485 ml/min and the surface temperature was monitored not to exceed 90 °C to avoid bubble nucleation, so the heat flux varied from 35 to 153 W/cm2 depending on the flow rate. The uniform configuration resulted in the lowest pressure drop, and the diverging one showed slightly higher pressure drop values than the converging configuration, possibly because the flow is most constrained at the inlet section, where the fluid is colder and presents higher viscosity. In addition, a minor dependence of pressure drop with heat flux was observed due to temperature dependent properties. The best heat transfer performance was obtained with the converging configuration, which was especially significant at low flow rates. This behavior could be explained by an increase in the heat transfer coefficient due to flow acceleration in converging gaps, which compensates the decrease in temperature difference between the fluid and the surface due to fluid heating along the gap. Overall, the comparison between the three configurations shows that converging microgaps have better performance than uniform or diverging ones for single-phase flows, and such effect is more pronounced at lower flow rates, when the fluid experiences higher temperature changes.

Effect of Mass Flow Rate on Dryer Room Radiator Pressure Drop and Heat Transfer

2016 ◽  
Vol 836 ◽  
pp. 102-108
Author(s):  
Mirmanto ◽  
Emmy Dyah Sulistyowati ◽  
I Ketut Okariawan
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Electrical Power ◽  
Maximum Temperature ◽  
Inlet Temperature ◽  
Mass Flow Rates ◽  
Room Model

In the rainy season, in tropical countries, to dry stuffs is difficult. Using electrical power or fossil energy is an expensive way. Therefore, it is wise to utilize heat waste. A device that can be used for this purpose is called radiator. The effect of mass flow rate on pressure drop and heat transfer for a dryer room radiator have been experimentally investigated. The room model size was 1000 mm x 1000 mm x 1000 mm made of plywood and the overall radiator dimension was 360 mm x 220 mm x 50 mm made of copper pipes with aluminium fins. Three mass flow rates were investigated namely 12.5 g/s, 14 g/s and 16.5 g/s. The water temperature at the entrance was increased gradually and then kept at 80°C. The maximum temperature reached in the dryer room was 50°C which was at the point just above the radiator. The effect of the mass flow rate on the room temperature was insignificant, while the effect on the pressure drop was significant. Moreover, the pressure drop decreased as the inlet temperature increased. In general, the radiator is recommended to be used as the heat source in a dryer room.

Pseudoboiling Heat Transfer to Supercritical Pressure Water in Smooth and Ribbed Tubes

1970 ◽  
Vol 92 (3) ◽  
pp. 490-497 ◽  
Author(s):  
J. W. Ackerman
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heated Surface ◽  
Supercritical Pressure ◽  
Heat Fluxes ◽  
Film Boiling ◽  
Fluid Temperature ◽  
Bulk Fluid ◽  
Pressure Water ◽  
Supercritical Pressure Water

Investigations of heat transfer to supercritical pressure fluids have been going on for some time, and correlations have been developed for both free and forced-convection conditions. In these investigations, unpredictable heat transfer performance has sometimes been observed when the pseudocritical temperature of the fluid is between the temperature of the bulk fluid and that of the heated surface. The unusual performance has been attributed to many causes, but one for which more evidence is being collected is that of a pseudofilm-boiling process similar to film boiling which occurs at subcritical pressures. This paper, which is an extension of work reported earlier on forced-convection heat transfer to supercritical pressure water, presents experimental evidence which suggests that a pseudofilm-boiling phenomenon can occur in smooth-bore tubes. During the period from 1963–1966, tubes with ID’s from 0.37 to 0.96 in. were tested at pressures from 3300–6000 psia and at heat fluxes and mass velocities in the range of interest in steam-generator design. The effects of heat flux, mass velocity, tube diameter, pressure, and bulk fluid temperature on both the occurrence and characteristics of pseudofilm boiling are discussed. Results of a second series of tests conducted in 1967, which show that ribbed tubes suppress pseudofilm boiling at supercritical pressure much like they do film boiling at subcritical pressures, are also discussed.

Heat Transfer Enhancement in Microchannels Incorporating Slanted Grooves

2008 ◽  
Author(s):  
Poh-Seng Lee ◽  
Chiang-Juay Teo
Keyword(s):  
Heat Transfer ◽  
Single Phase ◽  
Flow Direction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Fluid Temperature ◽  
Additional Energy ◽  
Pressure Drops ◽  
Microchannel Heat Sinks ◽  
Significant Temperature

The ever-increasing density, speed, and power consumption of microelectronics has led to a rapid increase in the heat fluxes which need to be dissipated in order to ensure their stable and reliable operation. The shrinking dimensions of electronics devices, in parallel, have imposed severe space constraints on the volume available for the cooling solution, defining the need for innovative and highly effective compact cooling techniques. Microchannel heat sinks have the potential to satisfy these requirements. However, significant temperature variations across the chip persist for conventional single-pass parallel flow microchannel heat sinks since the heat transfer performance deteriorates in the flow direction in microchannels as the boundary layers thicken and the coolant heats up. To accommodate higher heat fluxes, enhanced microchannel designs are needed. The present work presents an idea to enhance the single-phase convective heat transfer in microchannels. The proposed technique is passive, and does not require additional energy to be expended to enhance the heat transfer. The idea incorporates the generation of a spanwise or secondary flow to enhance mixing and hence decrease fluid temperature gradients across the microchannel. Slanted grooves can be created on the microchannel wall to induce the flow to twist and rotate thus introducing an additional component to the otherwise laminar flow in the microchannel. Numerical results are presented to demonstrate the effectiveness of such an enhanced microchannel heat sink. The heat transfer was found to increase by up to 12% without incurring substantial additional pressure drops.

Free Jet Impingement Heat Transfer of a High Prandtl Number Fluid Under Conditions of Highly Varying Properties

1999 ◽  
Vol 121 (3) ◽  
pp. 592-597 ◽  
Author(s):  
J. E. Leland ◽  
M. R. Pais
Keyword(s):  
Heat Transfer ◽  
Heated Surface ◽  
Jet Impingement ◽  
Turbulent Jets ◽  
Heat Fluxes ◽  
Lubricating Oil ◽  
Fluid Temperature ◽  
Transfer Coefficients ◽  
Constant Property ◽  
Wide Range

An experimental investigation was performed to determine the heat transfer rates for an impinging free-surface axisymmetric jet of lubricating oil for a wide range of Prandtl numbers (48 to 445) and for conditions of highly varying properties (viscosity ratios up to 14) in the flowing film. Heat transfer coefficients were obtained for jet Reynolds numbers from 109 to 8592, nozzle orifice diameters of 0.51, 0.84 and 1.70 mm and a heated surface diameter of 12.95 mm. The effect of nozzle to surface spacing (1 to 8.5 mm), was also investigated. Viscous dissipation was found to have an effect at low heat fluxes. Distinct heat transfer regimes were identified for initially laminar and turbulent jets. The data show that existing constant property correlations underestimate the heat transfer coefficient by more than 100 percent as the wall to fluid temperature difference increases. Over 700 data points were used to generate Nusselt number correlations which satisfactorily account for the highly varying properties with a mean absolute error of less than ten percent.

scholarly journals INVESTIGATION OF SINGLE-PHASE FLOW CHARACTERISTICS IN A STAGGER PIN-FINS COMPLEX GEOMETRY

2021 ◽  
Vol 25 (6) ◽  
pp. 74-81
Author(s):  
R. Shakir ◽  
Keyword(s):  
Heat Transfer ◽  
Single Phase ◽  
Complex Geometry ◽  
Flow Characteristics ◽  
Inlet Temperature ◽  
Phase Flow ◽  
Fluid Temperature ◽  
Single Phase Flow ◽  
Pin Fins ◽  
Micro Pin Fins

The cooling equipment project must use electrical and electronic equipment because of the need to remove the heat generated by this equipment. Investigation; R-113 single-phase flow heat transfer; (50 x 50 mm2) cross-section and (5 mm) height; used in a series of stagger-square micro-pin fins. Inlet temperature of (25 °C); (6) Mass flow rate at this temperature, the recommended range is (0. 0025 -0.01 kg/sec) the inlet and outlet pressures are approximately (1-1.10 bar), and through (25- 225 watts) applied heat. The iterative process is used to obtain the heat flow characteristics, for example; the single-phase heat transfer coefficient is completely laminar flow developing, in this flow, guesses the wall temperature, guess the fluid temperature. The possible mechanism of heat transfer has been discussed

Pressure Drop and Heat Transfer in a Single-Phase Micro-Pin-Fin Heat Sink

2006 ◽  
Author(s):  
Abel M. Siu Ho ◽  
Weilin Qu ◽  
Frank Pfefferkorn
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Pressure Drop ◽  
Friction Factor ◽  
Heat Sink ◽  
Single Phase ◽  
Fluid Transport ◽  
Heat Sinks ◽  
Inlet Temperature ◽  
Pin Fin

The pressure drop and heat transfer characteristics of a single-phase micro-pin-fin heat sink were investigated experimentally. Fabricated from 110 copper, the heat sink consisted of 1950 staggered micro-pins with 200×200 μm2 cross-section by 670 μm height. Deionized water was employed as the cooling liquid. A coolant inlet temperature of 25°C, and two heat flux levels, q" eff = 50 W/cm2 and q" eff = 100 W/cm2, defined relative to the planform area of the heat sink, were tested. The inlet Reynolds number ranged from 93 to 634 for q" eff = 50 W/cm2, and 127 to 634 for q" eff = 100 W/cm2. The measured pressure drop and temperature distribution were used to evaluate average friction factor and local averaged heat transfer coefficient/Nusselt number. Predictions of the Moores and Joshi friction factor correlation and the Chyu et al. heat transfer correlation that were developed using macro-size pin-fin arrays were compared to micro-pin-fin heat sink data. While the Moores and Joshi correlation provide acceptable predictions, the Chyu et al. correlation overpredicted local Nusselt number data by a fairly large margin. These findings point to the need for further study of single-phase thermal/fluid transport process in micro-pin-fin heat sinks.

Thermal and Hydrodynamic Characteristics of Single-Phase Flow and Flow Boiling in a Staggered Micro-Pin-Fin Array

2008 ◽  
Author(s):  
Weilin Qu
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Single Phase ◽  
Flow Boiling ◽  
Hydrodynamic Characteristics ◽  
Inlet Temperature ◽  
Phase Flow ◽  
Single Phase Flow ◽  
Pin Fin ◽  
Pin Fin Array

This study concerns thermal and hydrodynamic characteristics of water single-phase flow and flow boiling in a micro-pin-fin array. An array of 1950 staggered square micro-pin-fins with a 200×200 μm2 cross-section by a 670 μm height were fabricated into a copper heat sink test section. Two inlet temperatures of 30 °C and 60 °C, and six maximum mass velocities for each inlet temperature, ranging from 183 to 420 kg/m2s, were tested. The corresponding inlet Reynolds number ranged from 45.9 to 179.6. General characteristics of single-phase flow and flow boiling were described. Predictive tools were proposed for single-phase heat transfer coefficient and pressure drop. Unique features of flow boiling heat transfer in the micro-pin-fin array were identified. The classic Lockhart-Martinelli correlation incorporating a single-phase micro-pin-fin friction factor correlation and the laminar liquid–laminar vapor combination assumption was used to predict two-phase pressure drop in the micro-pin-fin array. The predictions agreed well with the experimental data.

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