With the decrease in high-grade chalcopyrite resources, the copper extraction from low-grade chalcopyrite has attracted more and more attention. However, the kinetic rates of chalcopyrite leaching with traditional oxidants are usually very slow due to the formation of the passivation layer. In this study, a novel reagent of chlorinated oxidant, trichloroisocyanuric acid (TCCA), was used to leach chalcopyrite for the first time. The experimental results showed that when the initial oxidant concentration for TCCA was 0.054 mol·L−1, the leaching temperature was kept at 55 °C, and the pH of the pulp was controlled at 1, the oxidation efficiency of Cu can reach above 90% in less than 30 min. Various analyses of chalcopyrite mineral ore and its oxidized residues, such as chemical composition analysis, X-ray diffraction analysis, scanning electron microscopy analysis and X-ray photoelectron spectroscopy, were conducted, respectively. No obvious passivation layer was found on the chalcopyrite surface, though the sulfur product can also be generated during the leaching. Reaction kinetic analysis results showed that the different influence of surface reaction and diffusion process on the dissolution of chalcopyrite is little due to the fast leaching speed. After calculation, the activation energy of the whole leaching reaction is 9.06 kJ·mol−1, much lower than that in other reports. The mechanism was also proposed that TCCA was hydrolyzed in the solution to form hypochlorous acid, which is the strong oxidant, and cyanuric acid, which prevents the formation of a passivation layer. The processing in this study is expected to be applied as a novel method for atmospheric leaching of chalcopyrite.
X-ray photoelectron spectroscopy: A perspective on quantitation accuracy for composition analysis of homogeneous materials
