Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining

2014 ◽  
Vol 13 (2) ◽  
pp. 023008
Author(s):  
Kuo-Lun Kao ◽  
Cho-Wei Chang ◽  
Yung-Chun Lee
Keyword(s):  
Three Dimensional ◽  
Metal Contact ◽  
Contact Printing ◽  
Silicon Bulk

Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

2011 ◽  
Vol 2011 (1) ◽  
pp. 001028-001032
Author(s):  
Michael J. O’Reilly ◽  
Jeff Leal ◽  
Suzette K. Pangrle ◽  
Kenneth Vartanian
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Three Dimensional ◽  
Contact Printing ◽  
Wire Bond ◽  
Printing System ◽  
3D Printed ◽  
Working Distance ◽  
Aerosol Jet Deposition ◽  
Vertical Interconnect

Aerosol Jet deposition systems provide an evolutionary alternative to both wire bond and TSV technology. As part of the Vertical Interconnect Pillar (ViP™) process, the Aerosol Jet system prints high density three-dimensional (3D) interconnects enabling multi-function integrated circuits to be stacked and vertically interconnected in high performance System-in-Packages (SiP). The stacks can include two or more die, with a total height of ∼ 2 millimeters. The non-contact printing system has a working distance of several millimeters above the substrate allowing 3D interconnects to be printed with no Z-height adjustments. The Aerosol Jet printhead is configured with multiple nozzles and a closely coupled atomizer to achieve production throughput of greater than 19,000 interconnects per hour. The Aerosol Jet printer deposits silver fine particle ink to form connections on staggered die stacks. High aspect ratio interconnects, less than 30-microns wide and greater than 6-microns tall, are printed at sub 60-micron pitch. After isothermal sintering at 150° C to 200° C for 30 minutes, highly conductive interconnects near bulk resistivity are produced. Pre-production yields exceeding 80% have been realized. This paper will provide further details on the 3D printed interconnect process, current and planned production throughput levels, and process yield and device reliability status.

Techniques and Applications for Non-Planar Lithography

2002 ◽  
Vol 739 ◽  
Author(s):  
John A. Rogers
Keyword(s):  
High Resolution ◽  
Microcontact Printing ◽  
Three Dimensional ◽  
Contact Printing ◽  
Nanometer Resolution ◽  
Replica Molding ◽  
Flat Surfaces ◽  
Operational Characteristics ◽  
Printing Technique

ABSTRACTCertain classes of three dimensional nanostructures can be fabricated by contact printing patterns onto curved or non-flat surfaces. This paper reviews some of our work that demonstrates this approach by using microcontact printing to form a range of three dimensional structures with feature sizes as small as 1–2 microns and it demonstrates their use in a variety of functional devices. We also describe a nanotransfer printing technique with operational characteristics that are similar to those of microcontact printing but which enables nanometer resolution. High resolution replica molding techniques provide a method for producing copies of some of these printed structures.

Behavior of Flange Joints Under Combined Internal Pressure and Thermal Loading: The Case of Using Metal-to-Metal Contact Type Gaskets

2013 ◽  
Author(s):  
Kai Ma ◽  
Yi Zhang ◽  
Lanzhu Zhang ◽  
Kaishu Guan
Keyword(s):  
Internal Pressure ◽  
Nuclear Power ◽  
Thermal Loading ◽  
Three Dimensional ◽  
Element Model ◽  
Metal Contact ◽  
Flange Joint ◽  
Contact Type ◽  
Bolted Flange ◽  
Nonlinear Finite Element Model

In a bolted flange joint, metal-to-metal contact type gasket takes over only part of the bolt load to achieve seating stress, and the additional bolt load is transmitted to the metal-to-metal contact to compensate for the unloading effects due to internal and external loadings. Due to this advantage, flange joints with metal-to-metal contact type gaskets are gradually used in chemical industry, nuclear power industry, etc. A three-dimensional nonlinear finite element model is developed to highlight the complex behavior of the flange joint with metal-to-metal contact type gasket under combined internal pressure and thermal loading. Despite of the common perception that the gasket stress in the metal-to-metal contact type gasket stays constant, reduced gasket stress is concluded due to flange rotation and joint thermal expansion.

3D Pyramidal Micropool Array Electrode for Amperometric Microsensor

2011 ◽  
Vol 483 ◽  
pp. 103-107
Author(s):  
Ji Zhou Sun ◽  
Yang Li ◽  
Chao Bian ◽  
Jian Hua Tong ◽  
Han Peng Dong ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Pt Nanoparticles ◽  
Catalytic Efficiency ◽  
Enhancement Effect ◽  
Effective Surface ◽  
Current Output ◽  
Array Electrode ◽  
Silicon Bulk ◽  
Lower Detection ◽  
Higher Sensitivity

This paper reports a novel three-dimensional (3D) microelectrode to enhance the sensitivity and current output of the amperometric microsensor. Based on silicon bulk micromachining technology and the introduction of nanomaterials, the 3D microelectrodes (3DME) are fabricated as working electrodes of the amperometric sensor. It comprises both sensitive microstructures and platinum (Pt) nanoparticles. The 3D micro structure can enlarge the effective surface area of working electrode and make more analyte to approach electrode surface more easily. This design provides a better microenvironment for electrodeposition of platinum nanoparticales. It further improves the enhancement effect of catalytic efficiency and electroactivity for the microelectrode. The sensor has been successfully used to detect H2O2, which is a vital target analyte in glucose detection and enzyme-linked immunodetection. Compared with amperometric biosensor based on planar microelectrode (PME), this sensor has advantages of lower detection limit, higher current signal and higher sensitivity.

Micropatterning of Poly (Ethylene Glycol)-Diacrylate (PEG-DA) Hydrogel by Soft-Photolithography for Analysis of Cell-Biomaterial Interactions

2009 ◽  
Vol 2 ◽  
pp. 3-14 ◽  
Author(s):  
Karthikeyan Subramani ◽  
M.A. Birch
Keyword(s):  
Ethylene Glycol ◽  
Three Dimensional ◽  
Poly Ethylene Glycol ◽  
Contact Printing ◽  
Pdms Stamp ◽  
Glycol Diacrylate ◽  
Dimethyl Siloxane ◽  
Hydrogel Matrix ◽  
Poly Ethylene ◽  
Innovative Techniques

Poly (ethylene glycol) hydrogel (PEG) micropatterns fabricated by photolithography and various other microfabrication techniques have been used as a platform to analyze cell-biomaterial interactions in cell culture studies. Numerous innovative techniques have been described about photolithography and the use of Poly (dimethyl siloxane) stamp (PDMS) based pressure moulding technique for the microfabrication of PEG hydrogel micropatterns. We herein this literature describe a simple and a versatile method for fabricating Poly (ethylene glycol) hydrogel-diacrylate (PEG-DA) hydrogel micropatterns using the ‘Soft-photolithography’ technique which is a combination of pressure moulding using a PDMS stamp and photolithography. Using this simple technique, PEG-DA hydrogel micropatterns were fabricated on a silicon substrate of varying dimensions from 40μm to 10μm within the same substrate. Such a three-dimensional microenvironment with varying sizes can serve as an excellent platform to study cell behaviour in culture. These PEG-DA hydrogel micropatterns can further be functionalized by adding a variety of biomolecular cues within the PEG-DA hydrogel matrix or these biomolecules can be patterned on the PEG-DA micropatterns after photopolymerization using micro-contact printing for analysis of cell-biomaterial interactions and tissue engineering purposes.

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