Parametric analysis and comparative study of multimode waveguides on lithium niobate-on-insulator and silicon-on-insulator platforms

2019 ◽  
Vol 58 (10) ◽  
pp. 1 ◽  
Author(s):  
Archana Kaushalram ◽  
Gopalkrishna Hegde ◽  
Srinivas Talabattula
2005 ◽  
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pp. 125-129 ◽  
Author(s):  
S. Ganesamoorthy ◽  
M. Nakamura ◽  
S. Takekawa ◽  
S. Kumaragurubaran ◽  
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...  

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Over the last decades, the concept of backside illumination (BSI) sensors has become one of the leading solutions to optical challenges such as improved quantum efficiency (QE), and cross-talk, respectively [1-. Direct wafer bonding is a method for fabricating advanced substrates for micro-electrochemical systems (MEMS) and integrated circuits (IC). The most typical example of such an advanced substrate is the silicon-on-insulator (SOI) wafer.


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Author(s):  
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K. Kitamura ◽  
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T. Hayashi ◽  
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2015 ◽  
Vol 86 (8) ◽  
pp. 085001 ◽  
Author(s):  
N. Patel ◽  
D. W. Branch ◽  
E. Schamiloglu ◽  
S. Cular

2018 ◽  
Vol 143 (3) ◽  
pp. 1918-1918
Author(s):  
Chandrima Chatterjee ◽  
Daniel Miller ◽  
Igor Ostrovskii

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Author(s):  
Yawei Li ◽  
Qi Liang ◽  
Yu-Po Wong ◽  
Keyuan Gong ◽  
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...  

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