cSRM 2035: a rare-earth oxide glass for the wavelength calibration of near-infrared dispersive and Fourier transform spectrometers

Author(s):  
Steven J. Choquette ◽  
John C. Travis ◽  
David L. Duewer
1987 ◽  
Vol 11 (S_1_ISMO) ◽  
pp. S1_269-272 ◽  
Author(s):  
K. YAMADA ◽  
K. MATSUMOTO ◽  
F. MARUYAMA

2005 ◽  
Vol 59 (4) ◽  
pp. 496-504 ◽  
Author(s):  
Steven J. Choquette ◽  
David L. Duewer ◽  
Leonard M. Hanssen ◽  
Edward A. Early

Standard Reference Material 2036 (SRM 2036) is a certified transfer standard intended for the verification and calibration of the wavelength/wavenumber scale of near-infrared (NIR) spectrometers operating in diffuse or trans-reflectance mode. SRM 2036 Near-Infrared Wavelength/Wavenumber Reflection Standard is a combination of a rare earth oxide glass of a composition similar to that of SRM 2035 Near-Infrared Transmission Wavelength/Wavenumber Standard and SRM 2065 Ultraviolet–Visible–Near-Infrared Transmission Wavelength/Wavenumber Standard, but is in physical contact with a piece of sintered poly(tetrafluoroethylene) (PTFE). The combination of glass contacted with a nearly ideal diffusely reflecting backing provides reflection–absorption bands that range from 15% R to 40% R. SRM 2036 is certified for the 10% band fraction air wavelength centroid location, 10%B, of seven bands spanning the spectral region from 975 nm to 1946 nm. It is also certified for the vacuum wavenumber 10%B of the same seven bands in the spectral region from 10 300 cm−1 to 5130 cm−1 at 8 cm−1 resolution. Informational values are provided for the locations of thirteen additional bands from 334 nm to 804 nm.


Nano Letters ◽  
2021 ◽  
Author(s):  
Ziqiang Sun ◽  
Haoying Huang ◽  
Rong Zhang ◽  
Xiaohu Yang ◽  
Hongchao Yang ◽  
...  
Keyword(s):  

2021 ◽  
Vol 13 (3) ◽  
pp. 168781402110077
Author(s):  
Chao Du ◽  
Cuirong Liu ◽  
Xu Yin ◽  
Haocheng Zhao

Herein, we synthesized a new polyethylene glycol (PEG)-based solid polymer electrolyte containing a rare earth oxide, CeO2, using mechanical metallurgy to prepare an encapsulation bonding material for MEMS. The effects of CeO2 content (0–15 wt.%) on the anodic bonding properties of the composites were investigated. Samples were analyzed and characterized by alternating current impedance spectroscopy, X-ray diffraction, scanning electron microscopy, differential scanning calorimetry, tensile strength tests, and anodic bonding experiments. CeO2 reduced the crystallinity of the material, promoted ion migration, increased the conductivity, increased the peak current of the bonding process, and increased the tensile strength. The maximum bonding efficiency and optimal bonding layer were obtained at 8 wt% CeO2. This study expands the applications of solid polymer electrolytes as encapsulation bonding materials.


1998 ◽  
Vol 45 (4) ◽  
pp. 503-508 ◽  
Author(s):  
Pi-Tai Chou ◽  
Youn-Chan Chen ◽  
Shu-Juan Chen ◽  
Min-Zen Lee ◽  
Ching-Yen Wei ◽  
...  

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