Influence of electric-field-assisted thermal ionization on the formation of the schottky barrier between metal and amorphous silicon

2000 ◽  
Vol 34 (3) ◽  
pp. 300-304 ◽  
Author(s):  
P. N. Krylov
1991 ◽  
Vol 23 (2-4) ◽  
pp. 273-281
Author(s):  
R. Könenkamp ◽  
S. Muramatsu ◽  
H. Itoh ◽  
S. Matsubara ◽  
T. Shimada

2013 ◽  
Vol 740-742 ◽  
pp. 881-886 ◽  
Author(s):  
Hiroyuki Okino ◽  
Norifumi Kameshiro ◽  
Kumiko Konishi ◽  
Naomi Inada ◽  
Kazuhiro Mochizuki ◽  
...  

The reduction of reverse leakage currents was attempted to fabricate 4H-SiC diodes with large current capacity for high voltage applications. Firstly diodes with Schottky metal of titanium (Ti) with active areas of 2.6 mm2 were fabricated to investigate the mechanisms of reverse leakage currents. The reverse current of a Ti Schottky barrier diode (SBD) is well explained by the tunneling current through the Schottky barrier. Then, the effects of Schottky barrier height and electric field on the reverse currents were investigated. The high Schottky barrier metal of nickel (Ni) effectively reduced the reverse leakage current to 2 x 10-3 times that of the Ti SBD. The suppression of the electric field at the Schottky junction by applying a junction barrier Schottky (JBS) structure reduced the reverse leakage current to 10-2 times that of the Ni SBD. JBS structure with high Schottky barrier metal of Ni was applied to fabricate large chip-size SiC diodes and we achieved 30 A- and 75 A-diodes with low leakage current and high breakdown voltage of 4 kV.


2019 ◽  
Vol 30 (40) ◽  
pp. 405207 ◽  
Author(s):  
Hengheng Li ◽  
Zhongpo Zhou ◽  
Kelei Zhang ◽  
Haiying Wang

2019 ◽  
Vol 16 (5) ◽  
pp. 20181135-20181135
Author(s):  
Bo Yi ◽  
Hao Hu ◽  
Jia Lin ◽  
Junji Cheng ◽  
Haimeng Huang ◽  
...  

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