Time-Dependent Dielectric Breakdown Characterization of 90- and 65-nm-Node Cu/SiOC Interconnects with Via Plugs
2007 ◽
Vol 46
(4A)
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pp. 1444-1451
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1996 ◽
Vol 27
(7)
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pp. 657-665
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Keyword(s):
2021 ◽
Vol 68
(5)
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pp. 2220-2225
Keyword(s):
2007 ◽
Vol 46
(No. 28)
◽
pp. L691-L692
◽
Keyword(s):
Keyword(s):
2013 ◽
Vol 26
(3)
◽
pp. 281-296