Electrical Characterization of Mos Memory Devices with Self-Assembled Tungsten Nano-Dots Dispersed in Silicon Nitride

2019 ◽  
Vol 18 (1) ◽  
pp. 33-37
Author(s):  
Yanli Pei ◽  
Chengkuan Yin ◽  
Masahiko Nishijima ◽  
Toshiya Kojima ◽  
Hiroshi Noriha ◽  
...  
2011 ◽  
Vol 23 (18) ◽  
pp. 2104-2107 ◽  
Author(s):  
Jin Ju Kim ◽  
Byungjin Cho ◽  
Ki Seok Kim ◽  
Takhee Lee ◽  
Gun Young Jung

2006 ◽  
Vol 131 ◽  
pp. 367-376 ◽  
Author(s):  
Hezy Cohen ◽  
Claude Nogues ◽  
Daniela Ullien ◽  
Shirley Daube ◽  
Ron Naaman ◽  
...  

2004 ◽  
Vol 830 ◽  
Author(s):  
Ch. Sargentis ◽  
K. Giannakopoulos ◽  
A. Travlos ◽  
D. Tsamakis

ABSTRACTMOS memory devices containing semiconductor nanocrystals have drawn considerable attention recently, due to their advantages when compared to the conventional memories. Only little work has been done on memory devices containing metal nanoparticles.We describe the fabrication of a novel MOS device with embedded Pt nanoparticles in the HfO2 / SiO2 interface of a MOS device. Using as control oxide, a high-k dielectric, our device has a great degree of scalability. The fabricated nanoparticles are very small (about 5 nm) and have high density. High frequency C-V measurements demonstrate that this device operates as a memory device.


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