scholarly journals The Effect of PECVD Oxide on the Threshold Voltage and Leakage Current of Transistors for CMOS High Voltage Integrated Circuits

1987 ◽  
Vol 1987-13 (1) ◽  
pp. 106-117
Author(s):  
Henry W. Chien
2014 ◽  
Vol 23 (03) ◽  
pp. 1450043
Author(s):  
SHOUCAI YUAN ◽  
YAMEI LIU

Standby switch can strongly turn off all the high threshold voltage transistors, which enhances the effectiveness of a dual threshold voltage CMOS technology to reduce sub-threshold leakage current. Sub-threshold leakage currents are especially important in burst mode type integrated circuits where the system is in an idle mode in the majority of the time. The standby switch allows a domino system to enter and leave a low leakage standby mode within a single clock cycle. In addition, we combine domino dynamic logic with pass transistor XNOR and pass transistor NAND gates to achieve logic 1 output during its precharge phase without affecting circuits operation in its evaluation and standby phase. The required process for dual threshold voltage circuit configuration involves only one additional ion implant step to provide an extra threshold voltage. SPICE simulation for our proposed circuits is made using a 0.18 μm CMOS processes from TSMC, with 10 fF capacitive loads in all output nodes, and parameters for typical process corner at 25°C. Layout is designed, wafer is fabricate and measured. The measurement results of fabricated chips are listed and verify that our designed 8-bit carry look-ahead adders (CLAs) reduced power consumption and propagation delay time by more than 15% and around 20%, respectively, when compared with the prior work.


2020 ◽  
Vol 12 ◽  
Author(s):  
Vijay Kumar Sharma

Background: The increased demand of battery operated portable systems boost up the field of low power VLSI design. Integrated circuits are enhancing the performance of the systems in terms of lesser area requirement, higher functionality and faster response at lower technology nodes. The applied power supply and threshold voltage of the individual device is scaled down at lower technology node. Scaling of the threshold voltage of the devices raises the issue of leakage current. Objective: Leakage current should be made recessive with the continuous scaling of technology nodes. Methods: Various leakage current mitigation methods had been employed to reduce the leakage current at different abstraction levels. This review paper demonstrates the survey of systematic arrangement of device scaling, leakage power, its causes, and various methods to overcome the leakage current at circuit level design. Results: 3-input NAND (NAND3) gate is designed and simulated at 22 nm technology node on HSPICE tool and analyzed for comparison of different leakage reduction techniques. Conclusion: INDEP approach is the most effective approach to reduce the leakage current and improving the reliability of the circuits followed by DTCMOS technique as compared to other available techniques.


2017 ◽  
Vol 897 ◽  
pp. 669-672 ◽  
Author(s):  
Shinichiro Kuroki ◽  
Tatsuya Kurose ◽  
Hirofumi Nagatsuma ◽  
Seiji Ishikawa ◽  
Tomonori Maeda ◽  
...  

For logic gate with higher voltage swing, 4H-SiC pseudo-CMOS logic inverter with four nMOS was suggested and demonstrated, and a high voltage swing of 4.4 V was achieved at VDD=5 V. Simple nMOS inverters were also investigated. Both of pseudo-CMOS and nMOS inverters were operated at a high temperature of 200°C. For future SiC large integrated circuits, junction leakage current between n+ regions were also investigated with the comb-shaped test elements.


2008 ◽  
Vol 600-603 ◽  
pp. 1091-1094 ◽  
Author(s):  
Y. Zhang ◽  
Kuang Sheng ◽  
Ming Su ◽  
Jian Hui Zhao ◽  
Petre Alexandrov ◽  
...  

A series of high voltage (HV) and low voltage (LV) lateral JFETs are successfully developed in 4H-SiC based on the vertical channel LJFET (VC-LJFET) device platform. Both room temperature and 300 oC characterizations are presented. The HV JFET shows a specific-on resistance of 12.8 mΩ·cm2 and is capable of conducting current larger than 3 A at room temperature. A threshold voltage drop of about 0.5 V for HV and LV JFETs is observed when temperature varies from room temperature to 300 oC. The measured increase of specific-on resistance with temperature due to a reduction of electron mobility agrees with the numerical prediction. The first demonstration of SiC power integrated circuits (PIC) is also reported, which shows 5 MHz switching at VDS of 200 V and on-state current of 0.4 A.


1989 ◽  
Vol 24 (10) ◽  
pp. 993-1000 ◽  
Author(s):  
G. Charitat ◽  
A. Nezar ◽  
P. Rossel

1989 ◽  
Vol 25 (17) ◽  
pp. 1133 ◽  
Author(s):  
S.E. Nordquist ◽  
J.W. Haslett ◽  
F.N. Trofimenkoff

2007 ◽  
Vol 46 (2) ◽  
pp. 569-571
Author(s):  
Tomoyuki Yamazaki ◽  
Naoki Kumagai ◽  
Akira Nishiura ◽  
Tatsuhiko Fujihira ◽  
Takashi Matsumoto

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