A Forward Current-Voltage-Temperature Method for Extraction of Intrinsic Schottky Barrier Height

2020 ◽  
Vol 9 (6) ◽  
pp. 064007
Author(s):  
Liu Changshi
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Schottky Barrier Height ◽  
Forward Current ◽  
Temperature Method ◽  
Current Voltage

A Proposed Regrowth Mechanism for the Enhancement of Schottky Barrier Height to N-GAAS

1994 ◽  
Vol 337 ◽  
Author(s):  
C-P. Chen ◽  
Y. A. Chang ◽  
T.F. Kuech
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Schottky Barrier Height ◽  
Gaas Layer ◽  
Dark Field ◽  
Schottky Barriers ◽  
Semiconductor Interface ◽  
Al Content ◽  
Current Voltage ◽  
High Al Content

ABSTRACTA systematic study of the enhancement of Schottky barriers to n-GaAs diodes has been carried out using the Ni-Al binary system. The diodes, Ni2Al3/n-GaAs, Ni2Al3/Ni/n-GaAs, Ni/Al/Ni/n-GaAs and NiAl/Al/Ni/n-GaAs, have been realized by sputter deposition at a base pressure ∼2xl0-7 Torr. A high Schottky barrier height ranging from 0.95 to 0.98 eV (deduced from current-voltage measurements) was observed for all the annealed contacts except for Ni2Al3/n-GaAs contacts. The enhancement of the Schottky barrier height in all the contacts was attributed to the formation of a high Al content (Al,Ga)As layer at the metal/semiconductor interface. The formation of this (Al,Ga)As layer was explained in terms of a regrowth mechanism. In this mechanism, Ni reacts with GaAs initially at low temperatures, forming NixGaAs. The NixGaAs layer is believed to react with the Ni-Al layer to form the (Al,Ga)As layer when subjected to a high temperature annealing. A (200) dark field XTEM image of the annealed contact was used to demonstrate the existence of this (Al,Ga)As phase.

Effect of Indentation on I-V Characteristics of Au/n-GaAs Schottky Barrier Diodes

2008 ◽  
Vol 63 (3-4) ◽  
pp. 199-202 ◽  
Author(s):  
Ahmet Faruk Ozdemir ◽  
Adnan Calik ◽  
Guven Cankaya ◽  
Osman Sahin ◽  
Nazim Ucar
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Schottky Diode ◽  
Ideality Factor ◽  
Room Temperature ◽  
Schottky Barrier Height ◽  
Vickers Microhardness ◽  
Schottky Barrier Diodes ◽  
Microhardness Test ◽  
Current Voltage

Au/n-GaAs Schottky barrier diodes (SBDs) have been fabricated. The effect of indentation on Schottky diode parameters such as Schottky barrier height (φb) and ideality factor (n) was studied by current-voltage (I-V) measurements. The method used for indentation was the Vickers microhardness test at room temperature. The experimental results showed that the I-V characteristics move to lower currents due to an increase of φb with increasing indentation weight, while contacts showed a nonideal diode behaviour.

scholarly journals Reversible Barrier Switching of ZnO/RuO2 Schottky Diodes

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2678
Author(s):  
Philipp Wendel ◽  
Dominik Dietz ◽  
Jonas Deuermeier ◽  
Andreas Klein
Keyword(s):  
Magnetron Sputtering ◽  
Schottky Barrier ◽  
Barrier Height ◽  
Oxygen Vacancies ◽  
Schottky Barrier Height ◽  
Schottky Diodes ◽  
Hysteresis Behavior ◽  
Current Voltage ◽  
Current Voltage Characteristics

The current-voltage characteristics of ZnO/RuO2 Schottky diodes prepared by magnetron sputtering are shown to exhibit a reversible hysteresis behavior, which corresponds to a variation of the Schottky barrier height between 0.9 and 1.3 eV upon voltage cycling. The changes in the barrier height are attributed to trapping and de-trapping of electrons in oxygen vacancies.

Distribution of Forward Voltage of SiC Schottky Barrier Diode Using Ti Sintering Process

2008 ◽  
Vol 600-603 ◽  
pp. 979-982 ◽  
Author(s):  
Kenichi Kuroda ◽  
Yoshinori Matsuno ◽  
Kenichi Ohtsuka ◽  
Naoki Yutani ◽  
Shozo Shikama ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
Current Density ◽  
Schottky Barrier Height ◽  
The Other ◽  
Substrate Thickness ◽  
Donor Concentration ◽  
Sintering Process ◽  
Forward Voltage ◽  
Forward Current

The forward current density-voltage (JF-VF) characteristics of SiC Schottky barrier diodes (SBDs) with an epilayer thickness between 9.6 and 10 μm and donor concentration (ND) ranging from 4.0x1015 to 5.7x1015 cm-3 was evaluated. It was found that the Schottky barrier height (Φb) can be stabilized by Ti sintering process and the forward current (IF) abruptly rises at the same knee voltage for all samples. On the other hand, the on-resistance (Ron) and VF were dispersed. The instability corresponds to the values calculated by the dispersion of ND, substrate resistivity and substrate thickness.

Temperature Dependent Current-Voltage Characteristics of Pt/MoS2 Schottky Junction

MRS Advances ◽  
2019 ◽  
Vol 4 (38-39) ◽  
pp. 2127-2134
Author(s):  
Neetika ◽  
Ramesh Chandra ◽  
V. K. Malik
Keyword(s):  
Band Gap ◽  
Schottky Barrier ◽  
Barrier Height ◽  
Ideality Factor ◽  
Schottky Barrier Height ◽  
Schottky Junction ◽  
Transition Metal Dichalcogenide ◽  
Dc Sputtering ◽  
Current Voltage ◽  
Dc Sputtering Technique

AbstractMolybdenum disulphide (MoS2) is one of the transition metal dichalcogenide (TMD) materials which has attracted attention due to its various interesting properties. MoS2 is very promising for electronic and optoelectronic devices due to its indirect band gap (∼1.2 eV) for few layer and direct band gap (∼1.8 eV) for monolayer MoS2. In MoS2 based Schottky devices, Schottky barrier height depends on the thickness of MoS2 because of its tunable electronic properties. Here, we have used DC sputtering technique to fabricate metal-semiconductor junction of MoS2 with platinum (Pt) metal contacts. In this work, MoS2 thin film (∼10 nm) was deposited on p-Silicon (111) using DC sputtering technique at optimized parameters. Schottky metallization of Pt metal (contact area ∼ 0.785x10-2 cm2) was also done using DC sputtering. Current-voltage (I-V) characteristics of the Pt/MoS2 Schottky junction have been investigated in the temperature range 80-350K. Forward I-V characteristics of Pt/MoS2 junction are analysed to calculate different Schottky parameters. Schottky barrier height increases and ideality factor decreases on increasing the temperature from 80-350K. The I-V-T measurements suggest the presence of local inhomogeneities at the Pt/MoS2 junction. Schottky barrier inhomogeneities occur in case of rough interface. In such cases, the Schottky barrier height does not remain constant and vary locally. Current transport through the Schottky junction is a thermally activated process. As temperature increases, more and more electrons overcome the spatially inhomogeneous barrier height. As a result, the ideality factor becomes close to unity and apparent barrier height increases due to increase in temperature.

A Study of Post Annealing Effects in the Repair of High Resistance Failures with Unstable Schottky Barrier Height in 4H-SiC Schottky Barrier Diode

2015 ◽  
Vol 821-823 ◽  
pp. 588-591
Author(s):  
Sin Su Kyoung ◽  
Eun Sik Jung ◽  
Tai Young Kang ◽  
Chang Heon Yang ◽  
Man Young Sung
Keyword(s):  
Schottky Barrier ◽  
Barrier Height ◽  
High Resistance ◽  
Schottky Barrier Height ◽  
Annealing Process ◽  
Post Annealing ◽  
Forward Current ◽  
Process Error ◽  
Annealing Effects ◽  
Process Event

To improve the high resistance and low Breakdown Voltage (BV) of 4H-SiC SBD, the metal annealing process is usually used to to stabilize SBH. We confirmed that post metal annealing after the chip process also stabilizes SBH by the post annealing experiment of applying failure chips (4H-SiC Ti/Al SBD) that have a forward current (IF) under 1 [A] with high resistance, because of the metal annealing process error. The result of experiments showed that the IFincrement and BV decrement are proportional to the applied temperatures over 450 °C, and the second additional post annealing shows a decrease of IFand BV. Aluminum and Titanium transformation with post metal annealing made a decrease of SBH, so that the on-resistance is decreased and BV is decreased (in severe cases, the intense post annealing generates Aluminum spiking). From a result of this work, using a suitable post metal annealing, we can improve the IFof SiC SBD with a high resistance failure from the metal process event.

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