Physical Vapor Deposition of Li7La3Zr2O12 for All-Solid-State Thin Film Li Batteries

With the development of smart electronics, a wide range of techniques have been considered for efficient co-integration of micro devices and micro energy sources. Physical vapor deposition (PVD) by means of thermal evaporation, magnetron sputtering, ion-beam deposition, pulsed laser deposition, etc., is among the most promising techniques for such purposes. Layer-by-layer deposition of all solid-state thin-film batteries via PVD has led to many publications in the last two decades. In these batteries, active materials are homogeneous and usually binder free, which makes them more promising in terms of energy density than those prepared by the traditional powder slurry technique. This review provides a summary of the preparation of cathode materials by PVD for all solid-state thin-film batteries. Cathodes based on intercalation and conversion reaction, as well as properties of thin-film electrode–electrolyte interface, are discussed.

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CVD and PVD coating process modelling by using artificial neural networks

Artificial Intelligence Research ◽

10.5430/air.v1n1p46 ◽

2012 ◽

Vol 1 (1) ◽

pp. 46 ◽

Cited By ~ 2

Author(s):

Amir Mahyar Khorasani ◽

Mohammad Reza Solymany yazdi ◽

Mehdi Faraji ◽

Alex Kootsookos

Keyword(s):

Thin Film ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

Chemical Vapor ◽

Film Coating ◽

Deposition Process ◽

Thin Film Coating ◽

Mlp Neural Network ◽

Titanium Thin Film ◽

Pvd Coating

Thin-film coating plays a prominent role on the manufacture of many industrial devices. Coating can increase material performance due to the deposition process. Having adequate and precise model that can predict the hardness of PVD and CVD processes is so helpful for manufacturers and engineers to choose suitable parameters in order to obtain the best hardness and decreasing cost and time of industrial productions. This paper proposes the estimation of hardness of titanium thin-film layers as protective industrial tools by using multi-layer perceptron (MLP) neural network. Based on the experimental data that was obtained during the process of chemical vapor deposition (CVD) and physical vapor deposition (PVD), the modeling of the coating variables for predicting hardness of titanium thin-film layers, is performed. Then, the obtained results are experimentally verified and very accurate outcomes had been attained.

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Aspects of thin film deposition on granulates by physical vapor deposition

The European Physical Journal D ◽

10.1140/epjd/e2016-70435-7 ◽

2016 ◽

Vol 70 (11) ◽

Cited By ~ 4

Author(s):

Andreas Eder ◽

Gerwin H.S. Schmid ◽

Harald Mahr ◽

Christoph Eisenmenger-Sittner

Keyword(s):

Thin Film ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

Thin Film Deposition ◽

Film Deposition

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Thermodynamic Analysis of Physical Vapor Deposition (PVD) Inorganic Thin Films on Low Temperature Cofired Ceramic (LTCC)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2016cicmt-tha13 ◽

2016 ◽

Vol 2016 (CICMT) ◽

pp. 000175-000182

Author(s):

Carol Putman ◽

Rachel Cramm Horn ◽

Ambrose Wolf ◽

Daniel Krueger

Keyword(s):

Thin Film ◽

Thin Films ◽

Low Temperature ◽

Vapor Deposition ◽

Physical Vapor Deposition ◽

High Reliability ◽

Interface Energy ◽

Molecular Stability ◽

Thin Film Adhesion ◽

Inorganic Thin Films

Abstract Low temperature cofired ceramic (LTCC) has been established as an excellent packaging technology for high reliability, high density microelectronics. The functionality and robustness of rework has been increased through the incorporation of a Physical Vapor Deposition (PVD) thin film Ti/Cu/Pt/Au metallization. PVD metallization is suitable for RF (Radio Frequency) applications as well as digital systems. Adhesion of the Ti “adhesion layer” to the LTCC as-fired surface is not well understood. While past work has established extrinsic parameters for delamination mechanisms of thin films on LTCC substrates, there is incomplete information regarding the intrinsic (i.e. thermodynamic) parameters in literature. This paper analyzes the thermodynamic favorability of adhesion between Ti, Cr, and their oxides coatings on LTCC (assumed as amorphous silica glass and Al2O3). Computational molecular calculations are used to determine interface energy as an indication of molecular stability over a range of temperatures. The end result will expand the understanding of thin film adhesion to LTCC surfaces and assist in increasing the long-term reliability of the interface bonding on RF microelectronic layers.

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