Mechanics Of Adhesively Bonded Flip-Chip-On-Flex Assemblies. Part I: Durability Of Anisotropically Conductive Adhesive Interconnects

2010 ◽  
pp. 203-226 ◽  
Author(s):  
J. Haase ◽  
P. Iyer ◽  
P. Baumgartner ◽  
A. Dasgupta ◽  
J. F. J. Caers ◽  
...  
Keyword(s):  
Flip Chip ◽  
Conductive Adhesive ◽  
Adhesively Bonded

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects

2008 ◽  
Vol 22 (14) ◽  
pp. 1733-1756 ◽  
Author(s):  
J. Haase ◽  
D. Farley ◽  
P. Iyer ◽  
P. Baumgartner ◽  
A. Dasgupta ◽  
...  
Keyword(s):  
Flip Chip ◽  
Conductive Adhesive ◽  
Adhesively Bonded

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

2002 ◽  
Author(s):  
Muthiah Venkateswaran ◽  
Peter Borgesen ◽  
K. Srihari
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Critical Evaluation ◽  
Conductive Adhesive ◽  
Circuit Board ◽  
Lead Free ◽  
Conductive Adhesives ◽  
Flip Chip Assembly ◽  
Placement Machine

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

Sign in / Sign up

Export Citation Format

Share Document