Effect of Rapid Thermal Annealing on Thermal Evaporated CdSe Thin Film for Solar Cell Application

2020 ◽  
Vol 12 (7) ◽  
pp. 924-929
Author(s):  
Hemant Kumar ◽  
Mangej Singh

Cadmium Selenide (CdSe) thin films have been deposited on a cleaned glass substrate by thermal vacuum evaporation method under the pressure of 10-5 torr. These CdSe thin films were also kept into a quart glass tube for rapid thermal annealing at 60 and 120 second using a 500 W halogen lamp for crystalline the structure. These thin films were characterized for structural, optical and thermo-electrical properties. The optical studies have been done using UV-VIS-NIR, shows that the transition of the deposited film is found to be a direct band gap of 1.74, 1.70 and 1.67 eV for asdeposited, 60 sec and 120 sec annealed thin films respectively. It was also found that absorbance has increased and transmission decreased with increasing annealing time, the change in the extinction coefficient with energy (hν) has been also measured. The Thermoelectric power (TEP) studies confirm the n-type nature of CdSe thin films but as well as annealing time increased the hole concentration increased resultant n-nature of CdSe thin film changing toward p-type nature, the Seebeck coefficient for different annealing time at as-deposited (RT), 60 seconds and 120 seconds have observed 549, 949 and 1031 μV/K respectively. The SEM result shows that with increasing annealing time the grain size and roughness of surface are increased. X-ray diffraction (XRD) studies indicate that the film is like a cubic crystal structure with average crystalline size (D) was measured using Scherrer formula and it is 16.44 nm.

2020 ◽  
Vol 59 (10) ◽  
pp. 105503
Author(s):  
Wafaa Magdy ◽  
Ayaka Kanai ◽  
F. A. Mahmoud ◽  
E. T. El Shenawy ◽  
S. A. Khairy ◽  
...  

Coatings ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 130 ◽  
Author(s):  
Jin Chen ◽  
Fengchao Wang ◽  
Bobo Yang ◽  
Xiaogai Peng ◽  
Qinmiao Chen ◽  
...  

In the current study, Cu2ZnSnS4 (CZTS) thin film was successfully fabricated by the facile nanocrystals (NCs)-printing approach combined with rapid thermal annealing (RTA) process. Firstly, the CZTS NCs were synthesized by a thermal solution method and the possible formation mechanism was analyzed briefly. Then the influences of RTA toleration temperature and duration time on the various properties of as-printed thin films were examined via XRD, Raman, FE-SEM, UV-vis-IR spectroscopy, EDS and XPS treatments in detail. As observed, the RTA factors of temperature and time had significant impacts on the structure and morphology of as-prepared thin films, while there were no obvious effects on the band gap energy in studied conditions. The results showed that the obtained thin film at optimal RTA conditions of (600 °C, 20 min) featured a kesterite structure in pure phase and an irregular morphology consisting of large grains. Moreover, the satisfactory composition of a Cu-poor, Zn-rich state and an ideal band gap energy of 1.4 eV suggests that as-fabricated CZTS thin film is a suitable light-absorbing layer candidate for the application in thin film solar cells.


Membranes ◽  
2021 ◽  
Vol 12 (1) ◽  
pp. 49
Author(s):  
Wei-Sheng Liu ◽  
Chih-Hao Hsu ◽  
Yu Jiang ◽  
Yi-Chun Lai ◽  
Hsing-Chun Kuo

In this study, high-performance indium–gallium–zinc oxide thin-film transistors (IGZO TFTs) with a dual-gate (DG) structure were manufactured using plasma treatment and rapid thermal annealing (RTA). Atomic force microscopy measurements showed that the surface roughness decreased upon increasing the O2 ratio from 16% to 33% in the argon–oxygen plasma treatment mixture. Hall measurement results showed that both the thin-film resistivity and carrier Hall mobility of the Ar–O2 plasma–treated IGZO thin films increased with the reduction of the carrier concentration caused by the decrease in the oxygen vacancy density; this was also verified using X-ray photoelectron spectroscopy measurements. IGZO thin films treated with Ar–O2 plasma were used as channel layers for fabricating DG TFT devices. These DG IGZO TFT devices were subjected to RTA at 100 °C–300 °C for improving the device characteristics; the field-effect mobility, subthreshold swing, and ION/IOFF current ratio of the 33% O2 plasma–treated DG TFT devices improved to 58.8 cm2/V·s, 0.12 V/decade, and 5.46 × 108, respectively. Long-term device stability reliability tests of the DG IGZO TFTs revealed that the threshold voltage was highly stable.


1994 ◽  
Vol 64 (4) ◽  
pp. 417-419 ◽  
Author(s):  
L. H. Allen ◽  
G. Ramanath ◽  
S. L. Lai ◽  
Z. Ma ◽  
S. Lee ◽  
...  

2015 ◽  
Vol 773-774 ◽  
pp. 647-651
Author(s):  
Noor Sakinah Khalid ◽  
Siti Harwani Ishak ◽  
Mohd Khairul Ahmad

Titanium oxide (TiO2) thin films were deposited onto glass substrates by spray pyrolysis method. The thin films were deposited at three different annealing time; 1, 5 and 10 hours at 400°C. The structural and electrical properties were characterized using FESEM and I-V characteristic. Polycrystalline thin film with anatase crystal structure, as evidenced from X-ray diffraction pattern, was obtained with major reflection along (101). Electrical properties have been studied by means of electrical resistivity. The dark resistivity had been measured as a function of the film thickness, d. The resistivity of samples had been found to decrease with decreasing thickness. Thus, TiO2 is one of the most promising candidates for relatively low cost, simple manufacture for solar cell.


2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Tao-Hsing Chen ◽  
Tzu-Yu Liao

This study utilizes radio frequency magnetron sputtering (RF sputtering) to deposit GZO transparent conductive film and Ti thin film on the same corning glass substrate and then treats GZO/Ti thin film with rapid thermal annealing. The annealing temperatures are 300°C , 500°C, and 550°C, respectively. Ti:GZO transparent conductive oxide (TCO) thin films are deposited on glass substrates using a radio frequency magnetron sputtering technique. The thin films are then annealed at temperatures of 300°C, 500°C, and 550°C, respectively, for rapid thermal annealing. The effects of the annealing temperature on the optical properties, resistivity, and nanomechanical properties of the Ti:GZO thin films are then systematically explored. The results show that all of the annealed films have excellent transparency (~90%) in the visible light range. Moreover, the resistivity of the Ti:GZO films reduces with an increasing annealing temperature, while the carrier concentration and Hall mobility both increase. Finally, the hardness and Young’s modulus of the Ti:GZO thin films are both found to increase as the annealing temperature is increased.


2003 ◽  
Vol 27 (11) ◽  
pp. 1083-1086 ◽  
Author(s):  
H. Ito ◽  
T. Kusunoki ◽  
H. Saito ◽  
S. Ishio

Coatings ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 397
Author(s):  
Yu-Chen Chang ◽  
Ying-Chung Chen ◽  
Bing-Rui Li ◽  
Wei-Che Shih ◽  
Jyun-Min Lin ◽  
...  

In this study, piezoelectric zinc oxide (ZnO) thin film was deposited on the Pt/Ti/SiNx/Si substrate to construct the FBAR device. The Pt/Ti multilayers were deposited on SiNx/Si as the bottom electrode and the Al thin film was deposited on the ZnO piezoelectric layer as the top electrode by a DC sputtering system. The ZnO thin film was deposited onto the Pt thin film by a radio frequency (RF) magnetron sputtering system. The cavity on back side for acoustic reflection of the FBAR device was achieved by KOH solution and reactive ion etching (RIE) processes. The crystalline structures and surface morphologies of the films were analyzed by X-ray diffraction (XRD) and field emission scanning electron microscope (FE-SEM). The optimized as-deposited ZnO thin films with preferred (002)-orientation were obtained under the sputtering power of 80 W and sputtering pressure of 20 mTorr. The crystalline characteristics of ZnO thin films and the frequency responses of the FBAR devices can be improved by using the rapid thermal annealing (RTA) process. The optimized annealing temperature and annealing time are 400 °C and 10 min, respectively. Finally, the FBAR devices with structure of Al/ZnO/Pt/Ti/SiNx/Si were fabricated. The frequency responses showed that the return loss of the FBAR device with RTA annealing was improved from −24.07 to −34.66 dB, and the electromechanical coupling coefficient (kt2) was improved from 1.73% to 3.02% with the resonance frequency of around 3.4 GHz.


1996 ◽  
Vol 35 (Part 1, No. 8) ◽  
pp. 4220-4224 ◽  
Author(s):  
M. D. Kim ◽  
T. W. Kang ◽  
M. S. Han ◽  
T. W. Kim

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